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M93S46-BN6G

STMicroelectronics

M93S46-BN6G by STMicroelectronics

M93S46-BN6G by STMicroelectronics is a 1024-bit EEPROM with a synchronous operating mode and a max clock frequency of 2 MHz. It features hardware/software write protection and operates within -40 °C to 85 °C, making it ideal for industrial applications. With a robust endurance of 1M write/erase cycles, it's perfect for reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,394 parts In-Stock

1+ parts

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2,394

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Anansix

USA . 1,960 parts In-Stock

1+ parts

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1,960

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Digiode

USA . 309 parts In-Stock

1+ parts

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309

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,115 parts In-Stock

1+ parts

$3.742

100+ parts

-

1k+ parts

$3.367

10k+ parts

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2,115

$3.742

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$3.367

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MKK Technologies

India . 1,964 parts In-Stock

1+ parts

$7.036

100+ parts

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1,964

$7.036

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DigiPath Technology Company

USA . 1,964 parts In-Stock

1+ parts

$7.036

100+ parts

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10k+ parts

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1,964

$7.036

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Corphita

USA . 4,022 parts In-Stock

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4,022

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Parana Technologies

USA . 899 parts In-Stock

1+ parts

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100+ parts

$4.474

1k+ parts

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899

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$4.474

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Overview

Unlock the potential of your projects with the M93S46-BN6G EEPROM from STMicroelectronics, a name synonymous with quality and reliability. Designed for industrial applications, this robust memory solution offers superior endurance, exceptional data retention, and flexible write protection options. With its compact design and temperature resilience, it seamlessly integrates into diverse systems, ensuring optimal performance and long-lasting value for your innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliable performance and protection against environmental factors.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on PCBs, facilitating easier integration into various designs.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer speed and system efficiency.

Nominal Supply Voltage / Vsup: 5V

Standard supply voltage makes it compatible with most systems, simplifying integration.

Power Supplies (V): 5

Consistent power supply requirements ensure stable performance in various applications.

Number of Terminals: 8

Compact design with 8 terminals supports easy connection while reducing space requirements.

Package Style (Meter): IN-LINE

In-line package style is ideal for through-hole mounting and simplifies assembly processes.

Maximum Operating Temperature: 85 °C

High operational temperature range ensures functionality in demanding environments.

Organization: 64X16

Structured organization provides efficient memory arrangement, enhancing access speed and management.

Minimum Operating Temperature: -40 °C

Wide temperature range allows operation in extreme conditions, perfect for industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in board layout and connection options.

Write Protection: HARDWARE/SOFTWARE

Versatile write protection enhances data security against unintended modifications or failures.

Maximum Seated Height: 5.33 mm

Low profile enables better airflow and fits in compact spaces, improving overall design efficiency.

Maximum Clock Frequency (fCLK): 2 MHz

High clock frequency facilitates faster data processing and improves overall system performance.

Width: 7.62 mm

Narrow width promotes space-efficient designs that fit into smaller applications and devices.

Minimum Supply Voltage (Vsup): 4.5V

Lower supply voltage requirement allows for energy-efficient designs while maintaining reliability.

Length: 9.27 mm

Compact length ensures easy placement in tight spaces and reduces PCB area usage.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability and extended service life in harsh environments.

Technology: CMOS

CMOS technology provides low power consumption, which is essential for battery-operated devices.

Parallel or Serial: SERIAL

Serial communication allows for reduced pin count and simplified wiring in designs.

Terminal Form: THROUGH-HOLE

Through-hole form factor ensures strong mechanical support and easier handling during assembly.

Maximum Supply Current: 2 mA

Low current consumption contributes to the overall energy efficiency of the system.

Number of Words: 64 words

Sufficient memory capacity for moderate data storage needs without excessive resource usage.

Memory Width: 16

16-bit width allows for handling larger data types, enhancing performance in various applications.

Minimum Data Retention Time: 40 years

Long data retention time ensures reliability and stability of stored information over time.

Terminal Pitch: 2.54 mm

Standard terminal pitch facilitates easy compatibility with other components and PCB designs.

Number of Words Code: 64

Provides a clear indicator of memory structure, aiding in efficient data management.

Maximum Supply Voltage (Vsup): 5.5V

Allows a safe operating margin above nominal voltage, enhancing robustness against fluctuations.

Endurance: 1,000,000 Write/Erase Cycles

High endurance level assures longevity and reliability in applications requiring frequent updates.

Serial Bus Type: MICROWIRE

Microwire interface supports efficient data transfer, optimizing system performance.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time enhances responsiveness and efficiency in data-heavy applications.

Memory Density: 1024 bits

Adequate memory density for a range of applications, providing balance between size and storage capacity.

Memory IC Type: EEPROM

EEPROM type allows for non-volatile data storage, ensuring data integrity when power is lost.

Maximum Standby Current: 0.000015 Amps

Extremely low standby current minimizes power consumption, making it ideal for battery-powered applications.

Technical Specifications

EEPROM M93S46-BN6G attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000015 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M93S46-BN6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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