Loading...

M93S46-BN3TP

STMicroelectronics

M93S46-BN3TP by STMicroelectronics

M93S46-BN3TP by STMicroelectronics is a 1024-bit EEPROM with a 5V supply, ideal for automotive applications. It features a max clock frequency of 2 MHz and operates in synchronous mode. Its robust design withstands temperatures from -40 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,155

-

-

-

-

Vyrian

USA . 2,708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,708

-

-

-

-

Anansix

USA . 1,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,802

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,405 parts In-Stock

1+ parts

$3.153

100+ parts

-

1k+ parts

$2.838

10k+ parts

-

1,405

$3.153

-

$2.838

-

MKK Technologies

India . 2,056 parts In-Stock

1+ parts

$5.929

100+ parts

-

1k+ parts

-

10k+ parts

-

2,056

$5.929

-

-

-

DigiPath Technology Company

USA . 2,056 parts In-Stock

1+ parts

$5.929

100+ parts

-

1k+ parts

-

10k+ parts

-

2,056

$5.929

-

-

-

Corphita

USA . 2,803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,803

-

-

-

-

Parana Technologies

USA . 1,188 parts In-Stock

1+ parts

-

100+ parts

$3.770

1k+ parts

-

10k+ parts

-

1,188

-

$3.770

-

-

Overview

Unlock the power of innovation with the M93S46-BN3TP EEPROM from STMicroelectronics! Renowned for their commitment to quality and reliability, STMicroelectronics delivers this high-performance solution designed for automotive applications. With a robust temperature range and efficient synchronous operation, it ensures data integrity under demanding conditions. Elevate your projects with advanced memory technology that promises durability, faster access, and exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on circuit boards, facilitating ease of integration.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances performance and allows for more efficient data transfers compared to asynchronous counterparts.

Nominal Supply Voltage / Vsup: 5 V

Operating at a standard 5V makes this EEPROM compatible with many existing systems, ensuring easy integration.

No. of Terminals: 8

With 8 terminals, this EEPROM offers multiple connectivity options while maintaining a compact footprint.

Package Style (Meter): IN-LINE

The in-line package style is ideal for applications requiring slim profiles and straightforward integration into PCB layouts.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance in high-temperature environments, suitable for automotive applications.

Organization: 64X16

The 64x16 organization provides a balanced structure for data storage, optimizing space while allowing for efficient access.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this EEPROM is designed for extreme conditions, enhancing reliability in harsh environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish helps in reducing solderability issues and enhances reliability during assembly.

Terminal Position: DUAL

Dual terminal positions provide flexibility in design, allowing for easier layout options on the PCB.

Maximum Seated Height: 5.33 mm

A seated height of 5.33 mm ensures compatibility with standard socket designs, facilitating easy replacement and access.

Maximum Clock Frequency (fCLK): 2 MHz

With a clock frequency of up to 2 MHz, this EEPROM can handle moderate data transfer rates, suitable for various applications.

Width: 7.62 mm

A width of 7.62 mm ensures a compact design, making it a good fit for space-constrained applications.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V allows for operation under varied power conditions, enhancing versatility.

Length: 9.27 mm

The length of 9.27 mm contributes to the compactness of the design, making it easier to integrate into smaller devices.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this EEPROM meets rigorous standards for reliability in automotive electronics.

Technology: CMOS

CMOS technology provides low power consumption and high performance, making it suitable for battery-operated devices.

Parallel or Serial: SERIAL

Serial communication simplifies wiring and connections, reducing potential points of failure and optimizing design.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and are ideal for applications where durability is critical.

No. of Words: 64 words

With 64 words of memory, this EEPROM is adequate for small data storage tasks, making it ideal for embedded systems.

Memory Width: 16

The 16-bit memory width allows for efficient data handling, making it suitable for applications requiring compact data storage.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is a standard size, facilitating easier design and compatibility with other components.

No. of Words Code: 64

This feature indicates that it can handle a specific amount of coded information, suitable for dedicated applications.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum of 5.5V provides flexibility in power supply options, making it adaptable to various systems.

Serial Bus Type: MICROWIRE

The MICROWIRE serial bus type allows for easier communication with microcontrollers, ensuring seamless integration.

Maximum Write Cycle Time (tWC): 10 ms

The quick write cycle time of 10 ms allows for efficient data updates, suitable for applications requiring frequent data changes.

Memory Density: 1024 bit

With a memory density of 1024 bits, this EEPROM provides enough storage for specific needs in compact electronic devices.

Memory IC Type: EEPROM

As an EEPROM, it offers non-volatile memory storage, ensuring data retention even without power, making it essential for many applications.

Technical Specifications

EEPROM M93S46-BN3TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

2 MHz

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

MICROWIRE

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

M93S46-BN3TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19