Loading...

M93S46-BN6TP

STMicroelectronics

M93S46-BN6TP by STMicroelectronics

M93S46-BN6TP by STMicroelectronics is a 1024-bit EEPROM with a 5V supply, operating in synchronous mode. It features an industrial temperature range (-40 °C to 85 °C) and supports a max clock frequency of 2 MHz. Ideal for applications requiring reliable data storage in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,881

-

-

-

-

Anansix

USA . 2,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,358

-

-

-

-

Vyrian

USA . 2,290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,290

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,883 parts In-Stock

1+ parts

$2.659

100+ parts

-

1k+ parts

$2.393

10k+ parts

-

1,883

$2.659

-

$2.393

-

MKK Technologies

India . 1,054 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,054

$5.000

-

-

-

DigiPath Technology Company

USA . 1,054 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,054

$5.000

-

-

-

Corphita

USA . 3,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,445

-

-

-

-

Parana Technologies

USA . 1,735 parts In-Stock

1+ parts

-

100+ parts

$3.179

1k+ parts

-

10k+ parts

-

1,735

-

$3.179

-

-

Overview

Unlock unparalleled reliability and performance with the M93S46-BN6TP EEPROM from STMicroelectronics. Designed for industrial applications, this robust memory solution operates flawlessly in extreme temperatures, ensuring data integrity when it matters most. With its compact design and efficient synchronous operation, it’s perfect for embedded systems, automotive controls, and consumer electronics. Trust in STMicroelectronics' legacy of innovation and quality to elevate your projects and enhance your product's capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability in various operating environments, making it suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into circuit designs, optimizing space and layout on PCBs.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates, enhancing overall performance in applications requiring quick memory access.

Nominal Supply Voltage / Vsup: 5 V

Operating at a standard supply voltage of 5 V ensures compatibility with a wide range of systems and devices.

No. of Terminals: 8

With 8 terminals, this EEPROM provides a compact design while still supporting necessary functionality for various applications.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and assembly processes, making it user-friendly for manufacturers.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this EEPROM is suited for industrial environments where heat resistance is crucial.

Organization: 64X16

The 64X16 organization allows for efficient data storage and retrieval, enabling effective management of memory resources.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this EEPROM ideal for applications in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good solderability and corrosion resistance, improving reliability over time.

Terminal Position: DUAL

The dual terminal position enhances flexibility in PCB design, allowing for various layout configurations.

Maximum Seated Height: 5.33 mm

A maximum seated height of 5.33 mm allows for compatibility with low-profile designs, saving space in compact applications.

Maximum Clock Frequency (fCLK): 2 MHz

The 2 MHz clock frequency enables quick data transactions, making the EEPROM suitable for applications requiring swift data handling.

Width: 7.62 mm

The compact width of 7.62 mm accommodates tight spaces without sacrificing performance or functionality.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V allows for operation in varied electrical environments while maintaining stability.

Length: 9.27 mm

The length of 9.27 mm contributes to a compact footprint, ideal for densely populated circuit boards.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees performance in challenging environments, ideal for industrial and automotive applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it advantageous for battery-powered devices.

Parallel or Serial: SERIAL

Serial communication reduces pin count and PCB space, making this EEPROM suitable for space-constrained designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides mechanical stability and durability, ensuring reliable connections in demanding applications.

No. of Words: 64 words

With 64 words available, this EEPROM provides a practical amount of memory for many mid-sized data storage tasks.

Memory Width: 16

A memory width of 16 bits allows for efficient data handling and increases data throughput.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is standard in many electronic applications, facilitating easy integration with existing designs.

No. of Words Code: 64

Providing 64 words of memory supports straightforward and effective coding solutions for applications requiring simple data storage.

Maximum Supply Voltage (Vsup): 5.5 V

The tolerance for a maximum of 5.5 V supply voltage enhances flexibility and safety margins in power supply design.

Serial Bus Type: MICROWIRE

Utilizing a MICROWIRE serial bus type ensures compatibility with various devices while simplifying interfacing and communication.

Maximum Write Cycle Time (tWC): 10 ms

The quick maximum write cycle time of 10 ms ensures efficient programming and data updating, suitable for dynamic applications.

Memory Density: 1024 bit

With a memory density of 1024 bits, this EEPROM efficiently meets the storage needs of low to mid-range applications.

Memory IC Type: EEPROM

As an EEPROM, this memory IC provides non-volatile storage, retaining data without power, making it perfect for critical data retention.

Technical Specifications

EEPROM M93S46-BN6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

2 MHz

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

MICROWIRE

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

M93S46-BN6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19