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24AA024-I/MSG

Microchip Technology

24AA024-I/MSG by Microchip Technology

24AA024-I/MSG by Microchip Technology is a small outline EEPROM with 256x8 organization, I2C control byte 1010DDDR, and 2048-bit memory density. It operates in industrial temperature range (-40 to 85 °C) with max clock frequency of 0.4 MHz. Ideal for applications requiring reliable non-volatile memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 1,361 parts In-Stock

1+ parts

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1,361

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Vyrian

USA . 803 parts In-Stock

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803

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,682 parts In-Stock

1+ parts

$2.650

100+ parts

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1,682

$2.650

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Corohmni

South Africa . 55 parts In-Stock

1+ parts

$3.461

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55

$3.461

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AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$19.798

100+ parts

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803

$19.798

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Continental Prestige Electronics

USA . 6,994 parts In-Stock

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6,994

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Argo Parts USA

USA . 3,031 parts In-Stock

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3,031

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Fulton Briggs Corp.

USA . 2,959 parts In-Stock

1+ parts

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2,959

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Unlock endless possibilities with the 24AA024-I/MSG by Microchip Technology. As a leading manufacturer in the industry, Microchip guarantees top-notch quality and reliability. This EEPROM device offers unparalleled value with its ease of use, high endurance, and wide operating temperature range. Perfect for industrial applications that require data storage and retrieval, this product ensures seamless performance and long-lasting durability. Trust Microchip Technology to provide you with the best solutions for your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for long-term use.

Surface Mount: YES

Being surface mountable makes installation easy and efficient, especially in compact electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transmitted and received in a coordinated and precise manner, improving overall performance.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is efficient and suitable for various electronic applications.

Power Supplies (V): 2/5

Compatible with a range of power supplies, offering flexibility in system integration.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for different configurations and applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style saves space and allows for denser PCB layouts, ideal for compact devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the EEPROM can withstand harsh environmental conditions.

Organization: 256X8

The organization of 256x8 offers a good balance between memory capacity and access speed.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the EEPROM can function reliably in various environmental conditions.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures reliable and long-lasting performance with a large number of write/erase cycles.

Memory IC Type: EEPROM

Being an EEPROM memory IC, it allows for non-volatile storage of data, which is essential for many applications.

Technical Specifications

EEPROM 24AA024-I/MSG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA024-I/MSG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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