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M93S46-BN6P

STMicroelectronics

M93S46-BN6P by STMicroelectronics

M93S46-BN6P by STMicroelectronics is a 1024-bit EEPROM with a synchronous operating mode and a max clock frequency of 2 MHz. It features hardware/software write protection and operates b/w -40 °C to 85 °C, making it ideal for industrial applications. With an endurance of 1M write/erase cycles, it's perfect for reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,233 parts In-Stock

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Digiode

USA . 1,957 parts In-Stock

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1,957

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Anansix

USA . 926 parts In-Stock

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926

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IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$2.597

100+ parts

-

1k+ parts

$2.337

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961

$2.597

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$2.337

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MKK Technologies

India . 1,618 parts In-Stock

1+ parts

$4.884

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1,618

$4.884

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DigiPath Technology Company

USA . 1,618 parts In-Stock

1+ parts

$4.884

100+ parts

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1,618

$4.884

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Corphita

USA . 1,157 parts In-Stock

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1,157

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Parana Technologies

USA . 52 parts In-Stock

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$3.105

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52

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$3.105

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Overview

Unlock unparalleled performance with the M93S46-BN6P EEPROM from STMicroelectronics, a leader in reliable semiconductor solutions. Designed for diverse applications, this robust memory chip ensures data integrity even in extreme conditions, making it ideal for industrial environments. With features like dual write protection and impressive endurance, it delivers exceptional value and peace of mind. Elevate your projects with quality you can trust—experience the STMicroelectronics difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and protection against environmental factors, ensuring reliable performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on printed circuit boards (PCBs), facilitating easier integration into designs.

Operating Mode: SYNCHRONOUS

Synchronous operation provides faster data access, making this EEPROM suitable for high-speed applications.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5 V is common, ensuring compatibility with a wide range of systems and designs.

Power Supplies (V): 5

With a standard powering requirement of 5 V, this product is versatile for various applications.

No. of Terminals: 8

The 8 terminals provide necessary connectivity while keeping the design compact and efficient.

Package Style (Meter): IN-LINE

In-line package style is ideal for through-hole mounting, simplifying assembly processes.

Maximum Operating Temperature: 85 °C

Rated for a maximum operating temperature of 85 °C, it caters to industrial applications requiring reliability under heat.

Organization: 64X16

The 64X16 organization enables efficient data management and retrieval, suitable for various data storage applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this EEPROM is suitable for extreme environmental conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and ensures long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for versatile PCB design options and easier alignment during assembly.

Write Protection: HARDWARE/SOFTWARE

The option for both hardware and software write protection safeguards data integrity, making it a secure choice for critical applications.

Maximum Seated Height: 5.33 mm

A compact seated height ensures the product can fit into tighter spaces, ideal for space-constrained designs.

Maximum Clock Frequency (fCLK): 2 MHz

A clock frequency of 2 MHz allows for fast data transfer rates, enhancing overall system performance.

Width: 7.62 mm

At a width of 7.62 mm, it fits conveniently on most PCB layouts, making it easy to integrate into various projects.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation under typical conditions with a wide operating range.

Length: 9.27 mm

The compact length of 9.27 mm helps in saving space on PCBs while providing sufficient memory capacity.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures, this EEPROM is designed for rugged applications that require high reliability.

Technology: CMOS

CMOS technology provides low power consumption, which is ideal for battery-operated devices.

Parallel or Serial: SERIAL

The serial interface simplifies connection and reduces the number of pins needed, facilitating easier integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mounting options and are ideal for prototyping and production.

Maximum Supply Current: 2 mA

A maximum supply current of 2 mA ensures efficient power usage, enhancing battery life in portable applications.

No. of Words: 64 words

With 64 words of storage, this EEPROM can accommodate essential data without excessive complexity.

Memory Width: 16

A memory width of 16 bits allows for the storage of larger data values, increasing functionality for applications.

Minimum Data Retention Time: 40 years

The minimum data retention time of 40 years ensures longevity of stored data, reducing the need for frequent updates.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is standard for many PCB designs, enhancing compatibility and simplifying assembly.

No. of Words Code: 64

The 64 words code offers sufficient storage for a variety of applications, ranging from firmware settings to small data storage.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, this EEPROM supports compatibility with various power supply configurations.

Endurance: 1,000,000 Write/Erase Cycles

An endurance rating of 1,000,000 write/erase cycles enhances its suitability for applications requiring frequent data updates.

Serial Bus Type: MICROWIRE

The MICROWIRE serial bus type allows for simple communication protocols, making integration into existing systems easier.

Maximum Write Cycle Time (tWC): 5 ms

With a maximum write cycle time of just 5 ms, this EEPROM supports efficient data writing, crucial for high-performance applications.

Memory Density: 1024 bit

A memory density of 1024 bits provides ample space for necessary data while keeping the form factor compact.

Memory IC Type: EEPROM

As an EEPROM memory type, it offers non-volatile storage, ensuring data remains intact even when power is off.

Maximum Standby Current: 0.000015 Amp

A maximum standby current of only 0.000015 Amp indicates extremely low power consumption during idle states, ideal for energy-efficient designs.

Technical Specifications

EEPROM M93S46-BN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000015 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M93S46-BN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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