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24LC256-I/SNREL

Microchip Technology

24LC256-I/SNREL by Microchip Technology

24LC256-I/SNREL by Microchip is a 32KX8 EEPROM with I2C control byte. Operating at 4.5V, it offers 1000000 write/erase cycles and -40 to 85°C temperature range. Ideal for industrial applications requiring reliable data storage in a compact, low-power package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 1,962 parts In-Stock

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1,962

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Vyrian

USA . 518 parts In-Stock

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518

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Nova Conductors

Japan . 31 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,406 parts In-Stock

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$2.120

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$2.120

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Corohmni

South Africa . 325 parts In-Stock

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$2.428

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325

$2.428

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$3.613

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$3.433

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$3.433

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20

$3.613

$3.433

$3.433

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Semicontronic

India . 330 parts In-Stock

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$5.000

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$4.875

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$4.850

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330

$5.000

$4.875

$4.850

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AZTECH Wire

Italy . 784 parts In-Stock

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$10.251

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784

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Argo Parts USA

USA . 4,590 parts In-Stock

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West Coast Incorporated

USA . 3,194 parts In-Stock

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Continental Prestige Electronics

USA . 2,892 parts In-Stock

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Modulus Dynamics

Lithuania . 700 parts In-Stock

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700

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Robosynatics

Brazil . 450 parts In-Stock

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450

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Lucentia Tech

USA . 450 parts In-Stock

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$2.758

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$2.758

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$2.758

450

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$2.758

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$2.758

Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Microchip Technology with the 24LC256-I/SNREL EEPROM. This versatile memory IC offers customers a durable and efficient solution for various applications. With its high endurance of 1,000,000 write/erase cycles and wide operating temperature range, this product ensures long-lasting performance in industrial settings. Trust Microchip Technology to deliver superior products that meet your needs with precision and excellence. Elevate your projects with the 24LC256-I/SNREL today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protects the internal components of the EEPROM, making it reliable for long-term use.

Operating Mode: SYNCHRONOUS

The synchronous operation mode ensures accurate data transfer and communication with other devices, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 4.5

With a nominal supply voltage of 4.5V, this EEPROM is compatible with a wide range of systems and can be easily integrated into various circuits.

Organization: 32KX8

The organization of 32KX8 provides a high memory density and optimal data storage capacity, making it suitable for applications that require large amounts of data storage.

Endurance: 1000000 Write/Erase Cycles

The high endurance capability of 1,000,000 write/erase cycles ensures reliable and long-lasting performance of the EEPROM, making it ideal for frequent data read/write operations.

Technical Specifications

EEPROM 24LC256-I/SNREL attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES

Maximum Clock Frequency (fCLK):

.4 MHz

Command User Interface:

NO

Data Polling:

YES

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Page Size (words):

64

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Reverse Pinout:

NO

Screening Level:

ISO/TS-16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000015 Amp

Maximum Supply Current:

.4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Toggle Bit:

NO

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC256-I/SNREL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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