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M93S46-BN6TG

STMicroelectronics

M93S46-BN6TG by STMicroelectronics

M93S46-BN6TG by STMicroelectronics is a 1024-bit EEPROM with a synchronous operating mode and a max clock frequency of 2 MHz. It operates b/w -40 °C to 85 °C, making it ideal for industrial applications. This dual-terminal device features an in-line package for easy integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,366 parts In-Stock

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Anansix

USA . 1,857 parts In-Stock

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1,857

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Vyrian

USA . 676 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 476 parts In-Stock

1+ parts

$3.015

100+ parts

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$2.713

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476

$3.015

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$2.713

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MKK Technologies

India . 413 parts In-Stock

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$5.669

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413

$5.669

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DigiPath Technology Company

USA . 413 parts In-Stock

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$5.669

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413

$5.669

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Corphita

USA . 4,448 parts In-Stock

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Parana Technologies

USA . 666 parts In-Stock

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$3.605

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666

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$3.605

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Overview

Unlock unparalleled performance with the M93S46-BN6TG EEPROM from STMicroelectronics, a leader in reliable semiconductor solutions. Designed for diverse applications, this synchronous memory offers exceptional durability and efficiency, operating seamlessly in extreme temperatures. The compact, robust package ensures easy integration into your projects, giving you peace of mind while maximizing data retention. Choose STMicroelectronics for superior quality and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making it suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space during assembly and integration into circuits.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster data transfer rates, enhancing overall system performance.

Nominal Supply Voltage / Vsup: 5V

A 5V supply voltage is common in many digital systems, ensuring compatibility with a wide range of applications.

No. of Terminals: 8

The 8 terminals provide sufficient connections for reliable operation while maintaining a compact size.

Package Style (Meter): IN-LINE

In-line package style facilitates easy integration into PCB layouts, enhancing manufacturing efficiency.

Maximum Operating Temperature: 85 °C

This high maximum temperature rating allows for operation in various industrial environments without risk of failure.

Organization: 64X16

The 64x16 organization provides versatility in data storage and allows for efficient data management.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this EEPROM suitable for applications in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and reduces the risk of oxidation, improving reliability.

Terminal Position: DUAL

Dual terminal position enhances the stability of the connection to the PCB, reducing mechanical stress.

Maximum Seated Height: 5.33 mm

A maximum height of 5.33 mm is suitable for low-profile designs, allowing for space-saving installations.

Maximum Clock Frequency (fCLK): 2 MHz

A 2 MHz clock frequency allows for fast data access and retention, improving overall system performance.

Width: 7.62 mm

The compact width allows for efficient use of printed circuit board space.

Minimum Supply Voltage (Vsup): 4.5V

The minimum supply voltage ensures that the device can operate reliably even in low-power applications.

Length: 9.27 mm

A modest length aids in designing compact electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and longevity in harsh operational conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Parallel or Serial: SERIAL

Serial communication simplifies integration and minimizes the number of connections, reducing PCB complexity.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical stability and are often preferred for high-reliability applications.

No. of Words: 64 words

64 words of storage provides adequate capacity for various applications, balancing size and functionality.

Memory Width: 16

A memory width of 16 bits enables efficient data handling and storage operations.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is standard in many systems, facilitating compatibility and ease of layout.

No. of Words Code: 64

With 64 words, this EEPROM can effectively store a variety of small configuration datasets.

Maximum Supply Voltage (Vsup): 5.5V

A maximum supply voltage capability allows for flexibility in power supply design without compromising performance.

Serial Bus Type: MICROWIRE

Using the Microwire bus type simplifies interface design, enabling smooth data exchange with minimal hardware.

Maximum Write Cycle Time (tWC): 10 ms

With a maximum write cycle time of 10 ms, the device can accommodate applications requiring moderate write speeds.

Memory Density: 1024 bit

A memory density of 1024 bits strikes a balance between capacity and compactness, ideal for embedded systems.

Memory IC Type: EEPROM

As an EEPROM, the product offers non-volatile storage, retaining data even when power is removed, essential for many applications.

Technical Specifications

EEPROM M93S46-BN6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

2 MHz

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

MICROWIRE

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

M93S46-BN6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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