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24LC128-I/STG

Microchip Technology

24LC128-I/STG by Microchip Technology

24LC128-I/STG by Microchip Technology is an EEPROM with 16KX8 organization, operating at 0.4 MHz clock frequency. It offers 1000000 Write/Erase Cycles endurance and uses I2C serial bus for applications requiring small outline, thin profile memory solutions.

Median Price

$0.790

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 438 parts In-Stock

1+ parts

$0.830

100+ parts

-

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438

$0.830

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Avnet

USA . 29 parts In-Stock

1+ parts

-

100+ parts

$0.749

1k+ parts

$0.702

10k+ parts

$0.656

29

-

$0.749

$0.702

$0.656

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$0.812

100+ parts

-

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26

$0.812

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VNN

France . 5,440 parts In-Stock

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5,440

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Vyrian

USA . 2,194 parts In-Stock

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2,194

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 159 parts In-Stock

1+ parts

$0.560

100+ parts

-

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159

$0.560

-

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Semicontronic

India . 73 parts In-Stock

1+ parts

$0.560

100+ parts

$0.546

1k+ parts

$0.543

10k+ parts

-

73

$0.560

$0.546

$0.543

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Argo Parts USA

USA . 2,646 parts In-Stock

1+ parts

$0.812

100+ parts

-

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2,646

$0.812

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Continental Prestige Electronics

USA . 868 parts In-Stock

1+ parts

$0.812

100+ parts

-

1k+ parts

-

10k+ parts

$0.796

868

$0.812

-

-

$0.796

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.812

100+ parts

$0.796

1k+ parts

-

10k+ parts

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100

$0.812

$0.796

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Aztec Data Supply Inc.

USA . 3,940 parts In-Stock

1+ parts

$3.160

100+ parts

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3,940

$3.160

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$5.347

100+ parts

$5.079

1k+ parts

$5.079

10k+ parts

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60

$5.347

$5.079

$5.079

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AZTECH Wire

Italy . 877 parts In-Stock

1+ parts

$5.660

100+ parts

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877

$5.660

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Corohmni

South Africa . 214 parts In-Stock

1+ parts

$5.743

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214

$5.743

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Fulton Briggs Corp.

USA . 2,037 parts In-Stock

1+ parts

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2,037

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Perfect Parts

USA . 603 parts In-Stock

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603

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Overview

Microchip Technology Infotainment Applications include everything from re-routing due to traffic delays, to providing intuitive visual, auditory, and tactile interfaces. This includes interfaces to the vehicle's distributed and networked subsystems like air conditioning, drivetrain, and body controls. Browse and access a host of media and content or catch up on social media through the onboard connectivity options.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the EEPROM, making it suitable for various industrial applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for efficient data transfer and communication with other synchronous devices, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 4.5

Stable supply voltage of 4.5V ensures reliable operation and consistent performance of the EEPROM.

Maximum Operating Temperature: 85 °C

High operating temperature range of up to 85°C makes this EEPROM suitable for use in harsh environments without compromising performance.

Maximum Clock Frequency (fCLK): 0.4 MHz

With a maximum clock frequency of 0.4 MHz, this EEPROM can operate at a high speed, allowing for faster data read and write operations.

Endurance: 1000000 Write/Erase Cycles

High endurance of 1,000,000 write/erase cycles ensures reliable and long-lasting data storage capabilities, making it a cost-effective choice for data-intensive applications.

Technical Specifications

EEPROM 24LC128-I/STG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC128-I/STG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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