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M93S56-MN6

STMicroelectronics

M93S56-MN6 by STMicroelectronics

M93S56-MN6 by STMicroelectronics is a 2048-bit EEPROM with a synchronous operating mode and a max clock frequency of 2 MHz. It features hardware/software write protection and operates within -40 °C to 85 °C, making it ideal for industrial applications. With an endurance of 1M write/erase cycles, it's perfect for reliable data storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,325 parts In-Stock

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8,325

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Anansix

USA . 2,426 parts In-Stock

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2,426

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Digiode

USA . 2,101 parts In-Stock

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2,101

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ComSIT Distribution GmbH

Germany . 1,300 parts In-Stock

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1,300

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GES GmbH

Germany . 182 parts In-Stock

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182

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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20

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IDEA Electronic Components Group

UK . 1,036 parts In-Stock

1+ parts

$4.234

100+ parts

-

1k+ parts

$3.810

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1,036

$4.234

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$3.810

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MKK Technologies

India . 577 parts In-Stock

1+ parts

$7.961

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577

$7.961

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DigiPath Technology Company

USA . 577 parts In-Stock

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$7.961

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577

$7.961

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AZTECH Wire

Italy . 1,128 parts In-Stock

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$12.490

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1,128

$12.490

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QUARKTWIN TECHNOLOGY LTD

USA . 8,678 parts In-Stock

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8,678

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Microchip USA

USA . 3,219 parts In-Stock

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Corphita

USA . 2,330 parts In-Stock

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2,330

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Parana Technologies

USA . 883 parts In-Stock

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$5.062

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883

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$5.062

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Overview

Unlock the power of reliable memory solutions with STMicroelectronics' M93S56-MN6 EEPROM. Known for its exceptional quality and commitment to innovation, STMicroelectronics brings you a versatile chip perfect for industrial applications, ensuring data retention even in extreme temperatures. Experience seamless integration, robust write protection features, and impressive endurance, making it an ideal choice for your next project. Elevate your designs with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material ensures long-lasting performance in various applications.

Surface Mount: YES

Facilitates compact and efficient PCB designs, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

Standard shape allows for easy integration with existing board layouts.

Operating Mode: SYNCHRONOUS

Synchronization improves data transfer rates, enhancing overall system performance.

Nominal Supply Voltage / Vsup: 5 V

Common operating voltage compatible with many electronic systems and components.

Power Supplies (V): 5

Simplifies power management by requiring only a single supply voltage.

No. of Terminals: 8

Standard terminal count supports various interfacing options while keeping designs simple.

Package Style (Meter): SMALL OUTLINE

Compact size makes it ideal for modern electronics with limited space.

Maximum Operating Temperature: 85 C

High operating temperature range makes it suitable for industrial applications.

Organization: 128X16

Effective memory organization enables efficient data storage and retrieval.

Minimum Operating Temperature: -40 C

Wide temperature range allows for operation in extreme environmental conditions.

Terminal Position: DUAL

Dual terminal positioning allows for better routing options on the PCB.

Write Protection: HARDWARE/SOFTWARE

Flexible write protection mechanisms enhance data security and integrity.

Maximum Seated Height: 1.75 mm

Low profile design aids in fitting into tight spaces without compromising functionality.

Maximum Clock Frequency (fCLK): 2 MHz

Allows for faster data communication and improved overall system responsiveness.

Width: 3.9 mm

Compact width contributes to space-efficient designs.

Minimum Supply Voltage (Vsup): 4.5 V

Ensures reliable operation at lower supply voltage, improving energy efficiency.

Length: 4.9 mm

Short length complements compact board designs while maintaining functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications ensuring durability and reliability.

Technology: CMOS

Low power consumption technology contributes to energy efficiency and longer device lifespan.

Parallel or Serial: SERIAL

Serial communication reduces pin count and simplifies PCB layout.

Terminal Form: GULL WING

Gull wing terminals provide better soldering and mechanical stability.

Maximum Supply Current: 2 mA

Low current requirements enhance energy efficiency, ideal for battery-operated devices.

No. of Words: 128 words

Ample word count for storing necessary data, suitable for moderate applications.

Memory Width: 16

Broader memory width supports larger data sizes, improving data handling capabilities.

Minimum Data Retention Time: 40 (years)

Long data retention assurance provides reliability in critical applications.

Terminal Pitch: 1.27 mm

Standard pitch enables compatibility with a variety of circuit board designs.

No. of Words Code: 128

Consistent coding allows for straightforward programming and integration.

Maximum Supply Voltage (Vsup): 5.5 V

Flexible voltage tolerance allows for a wider range of supply options.

Endurance: 1,000,000 Write/Erase Cycles

High endurance enhances reliability for applications requiring frequent data updates.

Serial Bus Type: MICROWIRE

Supported micro wire protocol ensures compatibility with various microcontroller architectures.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time improves data processing speed and efficiency.

Memory Density: 2048 bit

Adequate memory density suitable for many applications requiring non-volatile memory.

Memory IC Type: EEPROM

Reprogrammable non-volatile memory type is ideal for data storage that needs frequent updates.

Maximum Standby Current: 0.000015 Amp

Minimized standby current supports energy-efficient designs, extending battery life in portable devices.

Technical Specifications

EEPROM M93S56-MN6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000015 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M93S56-MN6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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