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M74HC573M1R

STMicroelectronics

M74HC573M1R by STMicroelectronics

STMicroelectronics M74HC573M1R is an 8-bit bus driver with 33ns propagation delay, operating at a supply voltage of 4.5V. It features 3-STATE output characteristics and is suitable for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

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Vyrian

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Digiode

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R&J Components

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Infinite Electronics LLP

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Anansix

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ComSIT Distribution GmbH

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Lighthouse Electronics, Inc.

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Electronic Expediters

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ABC Electronics Ltd.

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Zilex Electronics Inc.

Canada . 173 parts In-Stock

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Ashlea Components Ltd

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Whistler Technology

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Semi Source

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PC Components Company LLC

USA . 54 parts In-Stock

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Bristol Electronics

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Prism Electronics

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Atlantic Semiconductor

USA . 40 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 35 parts In-Stock

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Diverse Electronics

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Component Sense

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ACDS - Activité Composants Distribution Service

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Andel Nordic

Denmark . 2,579 parts In-Stock

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$6.697

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$6.429

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$6.429

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$6.429

Ampacity Inc.

Singapore . 1,539 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 381 parts In-Stock

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IDEA Electronic Components Group

UK . 1,911 parts In-Stock

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MKK Technologies

India . 733 parts In-Stock

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DigiPath Technology Company

USA . 733 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

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Kepictronics

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Corphita

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Microchip USA

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Parana Technologies

USA . 1,904 parts In-Stock

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Perfect Parts

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Assy Fe

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Cyclops Electronics Ltd (Excess)

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Montclair Electronics, Inc.

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Overview

Unlock seamless communication and reliable data transfer with the M74HC573M1R by STMicroelectronics. Crafted with precision and expertise, this bus driver and transceiver is designed to meet the highest industry standards. Ideal for a wide range of applications, this product offers unparalleled value, efficiency, and performance. Experience fast propagation delay, low power consumption, and robust output characteristics that ensure smooth operation every time. Trust STMicroelectronics to deliver quality components that elevate your projects to new heights. Choose the M74HC573M1R for unbeatable reliability and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the component, ensuring a longer lifespan and reliable performance.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission possibilities, making this product versatile and adaptable to various bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5V is a commonly used voltage level in many electronic systems, ensuring compatibility and ease of integration with existing setups.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing for high impedance states when needed, which can be advantageous in complex bus systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this bus driver and transceiver efficient and reliable in operation.

Technical Specifications

Bus Driver & Transceivers M74HC573M1R attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

BROADSIDE VERSION OF 373

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

235 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

M74HC573M1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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