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M74HC125RM13TR

STMicroelectronics

M74HC125RM13TR by STMicroelectronics

M74HC125RM13TR by STMicroelectronics is a CMOS bus driver with a 22 ns propagation delay and operates b/w 2-6 V. It features 4 functions in a compact 14-terminal package, ideal for military applications requiring robust performance. Its output characteristics include true polarity and 3-state capability.

Median Price

$0.001

Lifecycle Status

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1k+

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Arrow

USA . 36 parts In-Stock

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Digiode

USA . 3,753 parts In-Stock

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Component Electronics Inc.

Canada . 406 parts In-Stock

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$0.770

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$0.580

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ComSIT Distribution GmbH

Germany . 17,403 parts In-Stock

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Vyrian

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Dan-Mar Components

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Bristol Electronics

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J2 Sourcing AB

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Freddi Giovanni

Italy . 2,300 parts In-Stock

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Anansix

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Prism Electronics

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ACDS - Activité Composants Distribution Service

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Greenchips

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SIE Connect GmbH - GreenChips

Germany . 1,306 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 1,220 parts In-Stock

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Classic Components Corporation

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A2Z Electronics, Inc.

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Microfarads

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Corphita

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Benley Electronics

USA . 4 parts In-Stock

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Andel Nordic

Denmark . 2,159 parts In-Stock

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$2.972

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$2.853

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Microchip USA

USA . 380 parts In-Stock

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$8.382

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AZTECH Wire

Italy . 1,108 parts In-Stock

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$13.610

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Advanced Electronics

New Zealand . 37 parts In-Stock

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$17.750

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$16.153

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$14.555

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IDEA Electronic Components Group

UK . 203 parts In-Stock

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$18.365

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MKK Technologies

India . 516 parts In-Stock

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DigiPath Technology Company

USA . 516 parts In-Stock

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Component Stockers USA

USA . 283 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Assy Fe

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Parana Technologies

USA . 1,649 parts In-Stock

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Sternenhof Electronics (Excess)

Switzerland . 217 parts In-Stock

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Overview

Elevate your designs with the M74HC125RM13TR from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile bus driver and transceiver excels across various applications, ensuring reliability and efficiency. With its impressive propagation delay and robust temperature range, you can trust this component to deliver optimal performance under demanding conditions. Experience enhanced functionality and peace of mind with ST's renowned quality and innovation backing your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 22 ns

A low propagation delay indicates faster signal transmission, which enhances performance in high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of integration into modern electronic systems.

No. of Functions: 4

Having multiple functions in a single package adds versatility and reduces component count, leading to simplified designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs and supports efficient layout designs.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5 V provides flexibility for a wide range of applications in electronic circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF helps maintain signal integrity while minimizing energy consumption.

Power Supplies (V): 2/6

Supporting a voltage range of 2 to 6 V makes this product suitable for both low-power and standard applications.

No. of Terminals: 14

14 terminals provide adequate connectivity options for a variety of circuits, enhancing its application diversity.

Package Style (Meter): SMALL OUTLINE

The small outline style allows for compact installations and is ideal for space-constrained applications.

Maximum I (ol): 6 Amp

A maximum output current of 6 Amp ensures robust performance in demanding applications.

Propagation Delay (tpd): 160 ns

A reasonable propagation delay supports reliable communication in various circuit conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature rating increases thermal reliability in extreme conditions.

Output Characteristics: 3-STATE

3-state output is ideal for bus systems, enabling efficient communication and resource sharing among components.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature enhances the functionality of the product in frigid environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent solderability and corrosion resistance, contributing to long-term reliability.

Terminal Position: DUAL

Dual terminal positioning enhances the flexibility of PCB layouts and supports various mounting strategies.

No. of Ports: 2

With two ports, this product can effectively manage multiple connections, increasing its functionality in diverse applications.

Maximum Seated Height: 1.75 mm

A low seated height promotes efficient use of space, making it suitable for slim profile devices.

Width: 3.9 mm

A compact width facilitates versatile placement on circuit boards without compromising accessibility.

Output Polarity: TRUE

True output polarity simplifies signal interpretation and compatibility in digital systems.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum supply voltage of 2 V enhances compatibility with low-power systems.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds ensures reliable solder connections while accommodating modern manufacturing processes.

Peak Reflow Temperature °C: 260

The ability to withstand high reflow temperatures ensures durability during soldering processes.

Length: 8.65 mm

The length is optimized for space efficiency on PCBs, making it ideal for various applications.

Temperature Grade: MILITARY

Military grade specification ensures high reliability and performance under extreme conditions, suitable for critical applications.

Technology: CMOS

CMOS technology provides low power consumption along with high density and performance, fitting modern design needs.

Terminal Form: GULL WING

Gull wing terminal form is favored for its excellent solder joint reliability and ease of inspection.

Packing Method: TR

TR (tape and reel) packaging allows for efficient handling and automated assembly processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with a wide range of PCB designs and minimizes layout challenges.

Control Type: ENABLE LOW

The low-enable control type provides energy efficiency by allowing devices to shut down when not in use.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6 V enhances its usability in higher voltage applications, providing versatility.

Technical Specifications

Bus Driver & Transceivers M74HC125RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

M74HC125RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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