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M74HC126YTTR

STMicroelectronics

M74HC126YTTR by STMicroelectronics

M74HC126YTTR by STMicroelectronics is a 4-function bus driver with 105 ns propagation delay. It operates b/w -40 to 125 °C and supports a supply voltage range of 2-6 V. Ideal for automotive applications, this CMOS technology chip comes in a small outline package with dual terminals and true output polarity.

Median Price

$0.418

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,243 parts In-Stock

1+ parts

$0.550

100+ parts

$0.300

1k+ parts

$0.256

10k+ parts

$0.234

2,243

$0.550

$0.300

$0.256

$0.234

Rochester

USA . 49,656 parts In-Stock

1+ parts

-

100+ parts

$0.287

1k+ parts

$0.238

10k+ parts

$0.213

49,656

-

$0.287

$0.238

$0.213

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,755 parts In-Stock

1+ parts

$0.363

100+ parts

-

1k+ parts

-

10k+ parts

-

1,755

$0.363

-

-

-

Vyrian

USA . 4,677 parts In-Stock

1+ parts

$0.382

100+ parts

-

1k+ parts

-

10k+ parts

-

4,677

$0.382

-

-

-

Greenchips

USA . 140,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

140,000

-

-

-

-

SIE Connect GmbH - GreenChips

Germany . 140,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

140,000

-

-

-

-

Anansix

USA . 1,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,081

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 18,224 parts In-Stock

1+ parts

$0.325

100+ parts

-

1k+ parts

-

10k+ parts

-

18,224

$0.325

-

-

-

Corphita

USA . 2,205 parts In-Stock

1+ parts

$0.344

100+ parts

-

1k+ parts

-

10k+ parts

-

2,205

$0.344

-

-

-

Component Stockers USA

USA . 169 parts In-Stock

1+ parts

$1.020

100+ parts

$0.710

1k+ parts

-

10k+ parts

-

169

$1.020

$0.710

-

-

Microchip USA

USA . 3,518 parts In-Stock

1+ parts

$2.905

100+ parts

-

1k+ parts

-

10k+ parts

-

3,518

$2.905

-

-

-

IDEA Electronic Components Group

UK . 607 parts In-Stock

1+ parts

$19.377

100+ parts

-

1k+ parts

$17.439

10k+ parts

-

607

$19.377

-

$17.439

-

MKK Technologies

India . 2,357 parts In-Stock

1+ parts

$36.437

100+ parts

-

1k+ parts

-

10k+ parts

-

2,357

$36.437

-

-

-

DigiPath Technology Company

USA . 2,357 parts In-Stock

1+ parts

$36.437

100+ parts

-

1k+ parts

-

10k+ parts

-

2,357

$36.437

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 10,709 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,709

-

-

-

-

Perfect Parts

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,800

-

-

-

-

Parana Technologies

USA . 1,212 parts In-Stock

1+ parts

-

100+ parts

$23.168

1k+ parts

-

10k+ parts

-

1,212

-

$23.168

-

-

Overview

Enhance your automotive applications with the M74HC126YTTR bus driver & transceiver by STMicroelectronics. With a high-quality build and AEC-Q100 screening level, this product offers unparalleled reliability and performance. The 3-STATE output characteristics provide flexibility, while the small outline package ensures space-saving design. Trust STMicroelectronics for innovative solutions that elevate your projects to new heights. Experience the value and benefits of the M74HC126YTTR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for automotive applications.

Surface Mount: YES

Surface mount capability enables easy and efficient assembly onto circuit boards, saving time and effort in the manufacturing process.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, simplifies the design, and saves space on the PCB.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability and quality standards for automotive electronics, making it a dependable choice for vehicle applications.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V is commonly used in automotive systems, ensuring compatibility and efficient power consumption.

No. of Terminals: 14

Having a sufficient number of terminals allows for versatile connectivity options and integration within complex circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB, making it ideal for compact automotive electronic designs.

Propagation Delay (tpd): 105 ns

Low propagation delay of 105 ns ensures fast and efficient signal transmission, crucial for real-time applications in automotive systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, the product can withstand high temperature environments commonly encountered in automotive applications.

Output Characteristics: 3-STATE

3-STATE output characteristics provide flexibility in driving multiple loads, enabling efficient control of connected devices in automotive systems.

Minimum Operating Temperature: -40 °C

The product's minimum operating temperature of -40 °C ensures reliable performance even in extreme cold conditions, common in automotive environments.

Terminal Position: DUAL

Dual terminal position allows for robust and secure connections, enhancing the reliability and stability of the product in automotive applications.

No. of Ports: 2

Having two ports provides flexibility for input and output connections, allowing for versatile interfacing with other components in automotive systems.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm ensures low profile and compact integration on the PCB, suitable for space-constrained automotive designs.

Width: 4.4 mm

The narrow width of 4.4 mm allows for efficient space utilization on the PCB, enabling compact and streamlined automotive electronic layouts.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other components in automotive systems, enhancing overall system reliability.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V accommodates low power operation and ensures compatibility with a wide range of automotive power sources.

Length: 5 mm

The compact length of 5 mm facilitates space-saving integration on the PCB, making it suitable for automotive applications with limited board space.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation over a wide range of temperature variations, meeting the stringent requirements of automotive electronics.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation, making it ideal for automotive applications requiring efficient and reliable performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure surface mounting and robust mechanical connection, enhancing the durability and longevity of the product in automotive environments.

Packing Method: TR

TR packing method ensures convenient handling and storage of the product, simplifying the manufacturing and assembly process in automotive applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for precise and compact mounting on the PCB, enabling high-density integration and efficient use of board space in automotive designs.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, the product can accommodate a wide range of automotive power systems while ensuring reliable and stable operation under varying voltage conditions.

Technical Specifications

Bus Driver & Transceivers M74HC126YTTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Propagation Delay (tpd):

105 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC126YTTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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