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M74HC126TTR

STMicroelectronics

M74HC126TTR by STMicroelectronics

M74HC126TTR by STMicroelectronics is a CMOS bus driver with a 22 ns propagation delay and operates b/w 2-6 V. It features 4 functions, supports dual ports, and is ideal for high-speed data transmission in compact electronic designs. Its robust design withstands temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,060 parts In-Stock

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3,060

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Anansix

USA . 2,420 parts In-Stock

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2,420

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PC Components Company LLC

USA . 900 parts In-Stock

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900

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Bristol Electronics

USA . 900 parts In-Stock

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900

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Digiode

USA . 192 parts In-Stock

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192

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Distributors (Availability)

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Andel Nordic

Denmark . 3,822 parts In-Stock

1+ parts

$9.036

100+ parts

-

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$8.675

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$8.675

3,822

$9.036

-

$8.675

$8.675

Microchip USA

USA . 462 parts In-Stock

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$10.534

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-

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462

$10.534

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$19.280

100+ parts

$17.545

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$15.810

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-

500

$19.280

$17.545

$15.810

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AZTECH Wire

Italy . 194 parts In-Stock

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$20.510

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194

$20.510

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IDEA Electronic Components Group

UK . 2,065 parts In-Stock

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$27.755

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$24.979

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$27.755

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$24.979

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MKK Technologies

India . 2,187 parts In-Stock

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$52.191

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$52.191

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DigiPath Technology Company

USA . 2,187 parts In-Stock

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$52.191

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$52.191

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QUARKTWIN TECHNOLOGY LTD

USA . 12,290 parts In-Stock

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Metaverse IC Inc.

Canada . 11,590 parts In-Stock

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Corphita

USA . 4,622 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

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1,600

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Parana Technologies

USA . 1,265 parts In-Stock

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$33.185

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1,265

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$33.185

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Perfect Parts

USA . 1,004 parts In-Stock

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1,004

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Authorized Procurement Solutions

USA . 800 parts In-Stock

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800

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Overview

Elevate your designs with the M74HC126TTR from STMicroelectronics, a leading name in high-quality semiconductor solutions. This versatile bus driver enhances performance across various applications, boasting exceptional reliability and efficiency. With a compact design perfect for space-constrained projects, it ensures seamless data transmission while minimizing power consumption. Trust STMicroelectronics to deliver superior products that empower innovation and drive success in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers excellent durability and protection against environmental factors, making the product robust for various applications.

Propagation Delay At Nominal Supply: 22 ns

A low propagation delay enhances the speed of data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Being surface mount compatible allows for easy integration into modern electronic designs, resulting in a more compact and efficient circuit layout.

No. of Functions: 4

With four functions available in one device, this product provides versatility and simplifies design complexity, reducing the overall component count.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient space utilization on circuit boards, allowing for more components in a smaller area.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V balances performance with power consumption, making it an energy-efficient choice.

Load Capacitance (CL): 50 pF

A manageable load capacitance ensures compatibility with various circuits and minimizes signal attenuation, enhancing performance reliability.

Power Supplies (V): 2/6

The flexibility of operating at different power supplies (2V to 6V) allows for versatility in design and compatibility with various applications.

No. of Terminals: 14

With 14 terminals, this device provides ample connectivity options, enhancing integration into complex systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design facilitate compact placements in designs, improving overall device density.

Maximum I (ol): 6 Amp

Supporting a maximum output of 6 Amps enables this product to drive heavier loads, making it suitable for demanding applications.

Propagation Delay (tpd): 160 ns

While offering reasonable propagation delays, this device can still effectively meet various timing requirements in most applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures (up to 125 °C) ensures reliable performance in harsh environments, suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for flexible data handling in bus systems, optimizing communication between multiple devices.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this product is ideal for extreme environmental conditions, catering to military and aerospace needs.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing longevity and reliability.

Terminal Position: DUAL

Dual terminal position provides enhanced design flexibility and ease of routing in complex circuit layouts.

No. of Ports: 2

Having two ports enables the device to connect multiple channels, enhancing its usefulness in multi-device scenarios.

Maximum Seated Height: 1.2 mm

The low seated height ensures compatibility with space-constrained PCB designs, allowing for a more compact overall assembly.

Width: 4.4 mm

A narrow width allows for tighter placement on PCBs, optimizing space and layout flexibility.

Output Polarity: TRUE

True output polarity is beneficial for signal integrity in digital circuits by assuring consistent voltage levels.

Minimum Supply Voltage (Vsup): 2 V

Operating down to a minimum supply voltage of 2V enhances energy efficiency and allows compatibility with low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Enduring up to 30 seconds at peak reflow temperature guarantees robust soldering processes, ensuring reliability in assembly.

Peak Reflow Temperature °C: 260

Withstanding peak reflow temperatures of 260 °C makes this component suitable for modern surface-mount technology (SMT) assembly.

Length: 5 mm

A compact length of 5 mm contributes to the overall miniaturization of electronic devices, essential for today's portable applications.

Temperature Grade: MILITARY

The military-grade temperature classification ensures high reliability in critical applications, suitable for defense-related electronics.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this device efficient and reliable for a variety of applications.

Terminal Form: GULL WING

Gull wing terminals provide enhanced solderability and mechanical stability, simplifying PCB assembly procedures.

Packing Method: TR

The Tape and Reel packing method supports automated assembly processes, improving efficiency in manufacturing.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density PCB designs, enabling efficient use of space while ensuring reliable connections.

Control Type: ENABLE HIGH

With an ENABLE HIGH control type, this device allows for straightforward operation and integration into various control schemes.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V provides flexibility in powering the device under varying operational conditions, catering to diverse applications.

Technical Specifications

Bus Driver & Transceivers M74HC126TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

M74HC126TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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