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M74HC373M1R

STMicroelectronics

M74HC373M1R by STMicroelectronics

M74HC373M1R by STMicroelectronics is an 8-bit bus driver with a propagation delay of 31ns at 4.5V. It features a small outline package, operates b/w -55 to 125°C, and has a max seated height of 2.65mm. Ideal for applications requiring true output polarity and dual terminal position with a load capacitance of 150pF.

Median Price

$0.200

Lifecycle Status

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1k+

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Nova Conductors

Japan . 300 parts In-Stock

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DF Sales Co.

USA . 30 parts In-Stock

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$0.200

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DF Sales Co.

USA . 30 parts In-Stock

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Forefront Electronics and Design

USA . 10 parts In-Stock

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$24.500

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ComSIT Distribution GmbH

Germany . 3,800 parts In-Stock

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Digiode

USA . 2,927 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Anansix

USA . 757 parts In-Stock

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MISTER SPROCKETS

USA . 624 parts In-Stock

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LWI Electronics Inc

India . 578 parts In-Stock

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Semi Source

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Elcom Components

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Vyrian

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GES GmbH

Germany . 120 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 102 parts In-Stock

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Electronic Expediters

USA . 60 parts In-Stock

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Sea View Technologies

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Bristol Electronics

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Resion

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,003 parts In-Stock

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$0.106

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$0.104

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Argo Parts USA

USA . 297 parts In-Stock

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$0.106

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$0.103

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IDEA Electronic Components Group

UK . 393 parts In-Stock

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$9.768

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$8.791

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Andel Nordic

Denmark . 3,143 parts In-Stock

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$10.885

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$10.450

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AZTECH Wire

Italy . 209 parts In-Stock

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$11.902

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Semicontronic

India . 296 parts In-Stock

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$11.700

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MKK Technologies

India . 230 parts In-Stock

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$18.367

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DigiPath Technology Company

USA . 230 parts In-Stock

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Ampacity Inc.

Singapore . 598 parts In-Stock

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Perfect Parts

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Corphita

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Netroflash

USA . 2,000 parts In-Stock

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Assy Fe

Spain . 1,387 parts In-Stock

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Parana Technologies

USA . 198 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 120 parts In-Stock

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Kepictronics

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Overview

Power up your electronics with the STMicroelectronics M74HC373M1R bus driver & transceiver. Manufactured by a trusted industry leader, this high-quality product offers 8 bits of reliable performance in a compact, rectangular package. With a low propagation delay and 3-state output characteristics, this versatile component is ideal for a wide range of applications. Whether you're a hobbyist or a professional, the value and benefits of this product are unmatched. Upgrade your projects today with the M74HC373M1R from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in transportation vehicles like buses.

Propagation Delay At Nominal Supply: 31 ns

The low propagation delay ensures quick signal transmission, important for real-time communication in bus systems.

Surface Mount: YES

Surface mount capability makes installation and maintenance of the product easier, saving time and effort during assembly.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission and processing capabilities, suitable for handling complex bus control tasks.

Nominal Supply Voltage / Vsup (V): 4.5

The optimal supply voltage ensures efficient and reliable performance of the product within the specified range.

Load Capacitance (CL): 150 pF

The specified load capacitance helps in stabilizing the signal transmission and reducing noise interference, ensuring smooth operation of the bus driver.

Power Supplies (V): 2/6

Having multiple power supply options allows for flexibility in different bus system setups, accommodating varying voltage requirements.

Output Characteristics: 3-STATE

The 3-STATE output feature enables the bus driver to control the bus lines effectively, allowing for bus sharing and minimizing conflicts between connected devices.

Technical Specifications

Bus Driver & Transceivers M74HC373M1R attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

265 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

M74HC373M1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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