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M74HC126RM13TR

STMicroelectronics

M74HC126RM13TR by STMicroelectronics

M74HC126RM13TR by STMicroelectronics is a CMOS bus driver with 4 functions, featuring a propagation delay of 22 ns and operating voltage range of 2-6 V. It supports dual ports and has a max output current of 6 A. Ideal for high-speed data transmission in military applications.

Median Price

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Lifecycle Status

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1k+

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Prism Electronics

USA . 10,000 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 9,000 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 5,572 parts In-Stock

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Martec Srl

Italy . 4,151 parts In-Stock

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Bristol Electronics

USA . 4,151 parts In-Stock

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Digiode

USA . 3,932 parts In-Stock

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Resion

USA . 2,500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,944 parts In-Stock

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Anansix

USA . 889 parts In-Stock

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Greenchips

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455

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SIE Connect GmbH - GreenChips

Germany . 455 parts In-Stock

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LWI Electronics Inc

India . 22 parts In-Stock

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AZTECH Wire

Italy . 246 parts In-Stock

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$9.020

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$9.020

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Andel Nordic

Denmark . 3,964 parts In-Stock

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$10.419

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$10.002

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$10.002

3,964

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$10.002

IDEA Electronic Components Group

UK . 101 parts In-Stock

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$18.540

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$16.686

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Microchip USA

USA . 105 parts In-Stock

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$26.990

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MKK Technologies

India . 2,269 parts In-Stock

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$34.863

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DigiPath Technology Company

USA . 2,269 parts In-Stock

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$34.863

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Component Stockers USA

USA . 296 parts In-Stock

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$99.990

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Perfect Parts

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Assy Fe

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Authorized Procurement Solutions

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Corphita

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Parana Technologies

USA . 2,304 parts In-Stock

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Infinite Electronics LLP (Excess)

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Cyclops Electronics Ltd (Excess)

UK . 1,944 parts In-Stock

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Kepictronics

USA . 1,435 parts In-Stock

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Overview

Experience unparalleled reliability with the M74HC126RM13TR from STMicroelectronics, a leader in cutting-edge semiconductor technology. This versatile bus driver offers exceptional performance for various applications, including industrial automation and consumer electronics. With its robust design and efficient power management, it ensures seamless data transmission while minimizing energy consumption. Trust STMicroelectronics to deliver quality and innovation that drive your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and a favorable weight-to-strength ratio, making the product suitable for a variety of applications.

Propagation Delay At Nominal Supply: 22 ns

With a low propagation delay, this product supports high-speed communications, making it ideal for fast data transfer applications.

Surface Mount: YES

The surface mount design allows for easy integration into compact circuits, optimizing space utilization in PCB layouts.

No. of Functions: 4

Offering multiple functions in a single package enhances versatility, allowing for more complex circuitry without increasing component count.

Package Shape: RECTANGULAR

The rectangular shape is standard for many PCB layouts, facilitating easy handling and installation.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V offers a balance between performance and efficiency.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for efficient signal processing while minimizing delays due to charging and discharging times.

Power Supplies (V): 2/6

Compatible with a wide range of supply voltages (2V to 6V), this product provides flexibility in power supply design.

No. of Terminals: 14

The presence of 14 terminals enables robust connectivity, allowing for multiple input and output options.

Package Style (Meter): SMALL OUTLINE

The small outline style aids in producing compact electronic designs, which are increasingly in demand in modern electronics.

Maximum I (ol): 6 Amp

The capability to handle up to 6 Amps makes this device suitable for powering various high-performance components.

Propagation Delay (tpd): 160 ns

A maximum propagation delay of 160 ns ensures that even less time-sensitive applications remain functional and responsive.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is well-suited for environments exposed to extreme heat, enhancing reliability.

Output Characteristics: 3-STATE

The 3-state output characteristic adds flexibility in multi-device configurations, allowing for easy bus-sharing among components.

Minimum Operating Temperature: -55 °C

A wide temperature range enables this product to be used in harsh environments, making it suitable for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, promoting longevity.

Terminal Position: DUAL

Dual terminal positioning enhances design flexibility and simplifies the product integration process.

No. of Ports: 2

Having two ports allows for easy interfacing with multiple devices, increasing interoperability.

Maximum Seated Height: 1.75 mm

A compact seated height contributes to low-profile designs, making it easier to accommodate in space-constrained applications.

Width: 3.9 mm

With a narrow width, this component is ideal for fitting into tight spaces, essential for modern electronic devices.

Output Polarity: TRUE

True output polarity ensures consistent performance in specific applications requiring positive logic levels.

Minimum Supply Voltage (Vsup): 2 V

Working down to a minimum of 2V allows for energy-efficient designs, important for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum time of 40 seconds at peak reflow temperature ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 260

This high reflow temperature capability allows for reliable solder joint formation, essential for mass production.

Length: 8.65 mm

The compact length promotes ergonomic PCB design while maintaining connectivity and performance.

Temperature Grade: MILITARY

Meeting military temperature standards confirms reliability and is essential for defense and aerospace applications.

Technology: CMOS

The CMOS technology ensures low power consumption while providing high-speed performance, making it ideal for modern electronics.

Terminal Form: GULL WING

Gull wing terminals provide stability and ease of soldering, enhancing the assembly process during manufacturing.

Packing Method: TR

The TR packing method facilitates automated assembly processes, reducing production time and costs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with a wide range of PCB layouts, enhancing design flexibility.

Control Type: ENABLE HIGH

Using a high enable control type simplifies logic design in digital circuits, ensuring ease of integration.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V ensures versatility for various applications, from low-power to higher-demand devices.

Technical Specifications

Bus Driver & Transceivers M74HC126RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

M74HC126RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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