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M74HC126YRM13TR

STMicroelectronics

M74HC126YRM13TR by STMicroelectronics

M74HC126YRM13TR by STMicroelectronics is a 4-function bus driver with 3-STATE output, operating at a supply voltage range of 2V to 6V. It features a propagation delay of 105ns and is designed for automotive applications with AEC-Q100 screening. This CMOS technology transceiver comes in a small outline package, making it suitable for compact designs in automotive electronics.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 60 parts In-Stock

1+ parts

$0.140

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$0.140

-

-

-

DigiKey

USA . 2,140 parts In-Stock

1+ parts

$0.460

100+ parts

$0.251

1k+ parts

$0.213

10k+ parts

$0.195

2,140

$0.460

$0.251

$0.213

$0.195

Mouser Electronics

USA . 4,731 parts In-Stock

1+ parts

$1.100

100+ parts

$0.418

1k+ parts

$0.280

10k+ parts

$0.202

4,731

$1.100

$0.418

$0.280

$0.202

Verical

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$0.140

1k+ parts

-

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60

-

$0.140

-

-

Chip1Stop

Japan . 60 parts In-Stock

1+ parts

-

100+ parts

-

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60

-

-

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,630 parts In-Stock

1+ parts

$0.123

100+ parts

-

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-

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4,630

$0.123

-

-

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Vyrian

USA . 1,744 parts In-Stock

1+ parts

$0.129

100+ parts

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1,744

$0.129

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Anansix

USA . 134 parts In-Stock

1+ parts

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134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,730 parts In-Stock

1+ parts

$0.116

100+ parts

-

1k+ parts

-

10k+ parts

-

2,730

$0.116

-

-

-

Microchip USA

USA . 3,712 parts In-Stock

1+ parts

$2.489

100+ parts

-

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10k+ parts

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3,712

$2.489

-

-

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Andel Nordic

Denmark . 997 parts In-Stock

1+ parts

$6.396

100+ parts

-

1k+ parts

$6.140

10k+ parts

$6.140

997

$6.396

-

$6.140

$6.140

IDEA Electronic Components Group

UK . 2,357 parts In-Stock

1+ parts

$29.888

100+ parts

-

1k+ parts

$26.899

10k+ parts

-

2,357

$29.888

-

$26.899

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MKK Technologies

India . 2,262 parts In-Stock

1+ parts

$56.203

100+ parts

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10k+ parts

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2,262

$56.203

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DigiPath Technology Company

USA . 2,262 parts In-Stock

1+ parts

$56.203

100+ parts

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2,262

$56.203

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Perfect Parts

USA . 11,200 parts In-Stock

1+ parts

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11,200

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Parana Technologies

USA . 805 parts In-Stock

1+ parts

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100+ parts

$35.736

1k+ parts

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10k+ parts

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805

-

$35.736

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-

Overview

Discover the unbeatable quality and reliability of the STMicroelectronics M74HC126YRM13TR Bus Driver & Transceivers. Manufactured by industry leader STMicroelectronics, this product offers unparalleled performance and durability for a wide range of automotive applications. With its advanced technology and innovative design, customers can trust in the exceptional value, benefits, and advantages that this product provides. Upgrade your system with the M74HC126YRM13TR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications where weight is a concern.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves valuable PCB space.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components, simplifying the design and reducing costs.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and performance standards for automotive applications, making this product a reliable choice.

Nominal Supply Voltage / Vsup (V): 4.5

The 4.5V supply voltage is commonly used in automotive systems, making this product compatible with many existing designs.

Propagation Delay (tpd): 105 ns

The low propagation delay ensures fast signal transmission, critical for efficient communication in automotive networks.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this product suitable for use in harsh automotive environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers M74HC126YRM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

105 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

M74HC126YRM13TR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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