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M74HC125B1R

STMicroelectronics

M74HC125B1R by STMicroelectronics

STMicroelectronics M74HC125B1R is a 4-function bus driver with 22ns propagation delay at 4.5V. It operates in a temperature range of -55 to 125°C, suitable for military-grade applications. The package style is in-line with dual terminals and output polarity is true, making it ideal for high-speed signal transmission.

Median Price

$0.169

Lifecycle Status

Suppliers In-Stock

15

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1k+

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Nova Conductors

Japan . 57 parts In-Stock

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$0.169

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Vyrian

USA . 8,224 parts In-Stock

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R&J Components

USA . 3,616 parts In-Stock

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Digiode

USA . 2,720 parts In-Stock

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Cogito LLC

Ukraine . 2,315 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,225 parts In-Stock

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Rebound Electronics

UK . 900 parts In-Stock

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Anansix

USA . 617 parts In-Stock

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Bristol Electronics

USA . 300 parts In-Stock

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300

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Atlantic Semiconductor

USA . 300 parts In-Stock

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J2 Sourcing AB

Sweden . 224 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 80 parts In-Stock

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Microfarads

USA . 77 parts In-Stock

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PC Components Company LLC

USA . 35 parts In-Stock

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LWI Electronics Inc

India . 3 parts In-Stock

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Distributors (Availability)

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Argo Parts USA

USA . 2,624 parts In-Stock

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$0.169

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$0.164

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$0.169

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Continental Prestige Electronics

USA . 2,426 parts In-Stock

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$0.169

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$0.166

2,426

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IDEA Electronic Components Group

UK . 962 parts In-Stock

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$9.581

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$8.623

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962

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$8.623

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AZTECH Wire

Italy . 823 parts In-Stock

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$13.469

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MKK Technologies

India . 1,659 parts In-Stock

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$18.016

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DigiPath Technology Company

USA . 1,659 parts In-Stock

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$18.016

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Ampacity Inc.

Singapore . 495 parts In-Stock

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$36.000

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Semicontronic

India . 184 parts In-Stock

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$52.000

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$50.700

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$50.440

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Kepictronics

USA . 6,200 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Perfect Parts

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Parana Technologies

USA . 1,989 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.157

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Assy Fe

Spain . 625 parts In-Stock

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Corphita

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ChipstoGo Electronic ltd

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Cyclops Electronics Ltd (Excess)

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Overview

Enhance your electronic designs with the high-quality M74HC125B1R by STMicroelectronics. This bus driver and transceiver offers unmatched reliability and performance, thanks to its reputable manufacturer. Whether you're working on industrial automation, telecommunications, or automotive applications, this versatile component provides exceptional value with its fast propagation delay and low power consumption. Trust in STMicroelectronics to deliver cutting-edge technology that meets your needs and exceeds your expectations. Experience the advantages of precision engineering and innovation with the M74HC125B1R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures quick signal transmission, making this transceiver suitable for high-speed communication applications.

No. of Functions: 4

Having 4 functions in one transceiver saves space and simplifies the circuit design, making it more efficient.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing circuit layouts, offering convenience in installation.

Nominal Supply Voltage / Vsup (V): 4.5

Stable supply voltage of 4.5V ensures consistent performance of the transceiver under normal operating conditions.

Load Capacitance (CL): 150 pF

The specified load capacitance of 150 pF ensures compatibility with a wide range of external devices, making it versatile in application.

Power Supplies (V): 2/6

Support for dual power supplies of 2V and 6V offers flexibility in voltage requirements, catering to various system configurations.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options, allowing for versatile connectivity in complex circuit setups.

Maximum I (ol): 6 Amp

High maximum output current of 6A allows the transceiver to drive high loads, making it suitable for demanding applications.

Propagation Delay (tpd): 160 ns

Despite a slightly higher propagation delay of 160 ns, the transceiver still offers fast signal transmission, meeting the needs of most applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this transceiver is suitable for use in harsh environmental conditions without compromising performance.

Output Characteristics: 3-STATE

3-STATE output characteristics provide flexibility in controlling the output signal, making it suitable for applications requiring tri-state logic operation.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature of -55°C, this transceiver can operate in cold environments without negative impact on performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures high conductivity and corrosion resistance, enhancing the reliability and longevity of the transceiver.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this transceiver energy-efficient and reliable in noisy environments.

Temperature Grade: MILITARY

Military-grade temperature rating ensures ruggedness and reliability in harsh conditions, making this transceiver suitable for mission-critical applications.

Technical Specifications

Bus Driver & Transceivers M74HC125B1R attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M74HC125B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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