Loading...

M29F200BT70M6E

STMicroelectronics

M29F200BT70M6E by STMicroelectronics

M29F200BT70M6E from STMicroelectronics is a 2Mb NOR Flash memory with a 5V supply, featuring a max access time of 70 ns and endurance of 100K write/erase cycles. It operates asynchronously in an industrial temp range (-40 °C to 85°C). Ideal for embedded applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,298

-

-

-

-

Anansix

USA . 1,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,876

-

-

-

-

Digiode

USA . 1,752 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,752

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 17 parts In-Stock

1+ parts

$2.786

100+ parts

-

1k+ parts

$2.507

10k+ parts

-

17

$2.786

-

$2.507

-

MKK Technologies

India . 498 parts In-Stock

1+ parts

$5.238

100+ parts

-

1k+ parts

-

10k+ parts

-

498

$5.238

-

-

-

DigiPath Technology Company

USA . 498 parts In-Stock

1+ parts

$5.238

100+ parts

-

1k+ parts

-

10k+ parts

-

498

$5.238

-

-

-

AZTECH Wire

Italy . 921 parts In-Stock

1+ parts

$11.890

100+ parts

-

1k+ parts

-

10k+ parts

-

921

$11.890

-

-

-

Component Stockers USA

USA . 789 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

789

$99.990

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,723

-

-

-

-

Parana Technologies

USA . 1,264 parts In-Stock

1+ parts

-

100+ parts

$3.331

1k+ parts

-

10k+ parts

-

1,264

-

$3.331

-

-

Corphita

USA . 122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

122

-

-

-

-

Microchip USA

USA . 108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

108

-

-

-

-

Overview

Unlock the full potential of your projects with the M29F200BT70M6E Flash Memory from STMicroelectronics. Renowned for their exceptional quality and innovation, STMicroelectronics delivers this robust NOR type memory solution that ensures reliable performance in industrial applications. With impressive endurance, fast access times, and versatile temperature ratings, this memory chip seamlessly integrates into your designs, enhancing efficiency and reliability while providing outstanding value. Elevate your technology with ST's trusted expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction provides robust protection, ensuring reliability in various environments.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and supports automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape enables optimal fitting on standard PCBs, promoting versatility in design.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for quicker data access and control, enhancing overall performance.

Nominal Supply Voltage / Vsup: 5V

A standard supply voltage that simplifies integration with common electronic systems.

Power Supplies (V): 5V

Compatible with a variety of power management systems, ensuring widespread usability.

No. of Terminals: 44

Ample terminal count supports various connections, enhancing integration flexibility.

Package Style (Meter): SMALL OUTLINE

Small outline packaging allows for compact designs, ideal for space-constrained applications.

Alternate Memory Width: 8

Support for different memory widths caters to diverse data handling needs.

Maximum Operating Temperature: 85 °C

Operating at high temperatures makes this product suitable for demanding industrial applications.

Organization: 128KX16

This organization format enables efficient data storage and management.

Minimum Operating Temperature: -40 °C

Able to operate in extreme cold conditions, enhancing reliability in harsh environments.

No. of Sectors/Size: 1,2,1,3

The flexible sector configuration allows for customizable memory management.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance.

Terminal Position: DUAL

Dual position terminals support multiple mounting orientations, providing design versatility.

Maximum Seated Height: 3 mm

A low profile that aids in compact designs and minimizes overall device height.

Width: 12.6 mm

A moderate width ensuring compatibility with various PCB layouts.

Minimum Supply Voltage (Vsup): 4.5V

The acceptable minimum voltage supports a wide range of power supply scenarios.

Type: NOR TYPE

NOR flash is known for fast read speeds, making it ideal for applications requiring rapid data access.

Length: 28.5 mm

Compact length accommodates efficient board layout without compromising performance.

Programming Voltage (V): 5

Standard programming voltage simplifies interfacing with other components.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure long-term reliability in challenging conditions.

Technology: CMOS

CMOS technology offers low power consumption and high performance.

Parallel or Serial: PARALLEL

Parallel interface allows for faster data transfer speeds compared to serial options.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering, ensuring reliable connections.

Sector Size (Words): 16K,8K,32K,64K

Variable sector sizes provide flexibility for different data storage needs.

Maximum Supply Current: 20 mA

Low maximum current requirement enhances efficiency and reduces heat generation.

No. of Words: 131072 words

Sufficient word count for a wide range of applications, from simple data storage to more complex tasks.

Toggle Bit: YES

Toggle bit functionality allows for more efficient status checking during operations.

Memory Width: 16

A memory width of 16 bits can effectively handle larger data sets, improving overall speed.

Terminal Pitch: 1.27 mm

Standard terminal pitch ensures compatibility with various circuit designs.

No. of Words Code: 128K

The 128K code provides a clear capacity reference for potential applications.

Command User Interface: YES

User-friendly command interface facilitates straightforward programming and control.

Ready or Busy: YES

Indication of ready or busy status simplifies monitoring during data operations.

Maximum Supply Voltage (Vsup): 5.5V

Flexibility in supply voltage levels allows compatibility with various systems.

Endurance: 100000 Write/Erase Cycles

High endurance rating signifies durability, making it suitable for frequently updated memory applications.

Boot Block: TOP

Top boot block configuration simplifies system design by providing a dedicated boot sector.

Memory Density: 2097152 bit

High memory density makes efficient use of space while providing ample storage.

Memory IC Type: FLASH

Flash memory type is ideal for applications that require non-volatile storage with fast access.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current minimizes energy consumption when not in use.

Maximum Access Time: 70 ns

Fast access time enhances performance in applications where speed is critical.

Data Polling: YES

Data polling capability provides real-time feedback for efficient data management.

Technical Specifications

Flash Memory M29F200BT70M6E attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

TOP BOOT BLOCK

Alternate Memory Width:

8

Boot Block:

TOP

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

28.5 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

1,2,1,3

No. of Terminals:

44

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP44,.63

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

3 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12.6 mm

Trade Compliance

M29F200BT70M6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20