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M27C1024-70F1X

STMicroelectronics

M27C1024-70F1X by STMicroelectronics

M27C1024-70F1X by STMicroelectronics is a 64Kx16 UVPROM with a max access time of 70 ns, operating at 5V. It features a ceramic, glass-sealed package and operates asynchronously. Ideal for commercial applications requiring reliable data storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,018 parts In-Stock

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4,018

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Anansix

USA . 2,271 parts In-Stock

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2,271

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Vyrian

USA . 2,137 parts In-Stock

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2,137

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IDEA Electronic Components Group

UK . 1,947 parts In-Stock

1+ parts

$5.397

100+ parts

-

1k+ parts

$4.857

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1,947

$5.397

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$4.857

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MKK Technologies

India . 915 parts In-Stock

1+ parts

$10.148

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915

$10.148

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DigiPath Technology Company

USA . 915 parts In-Stock

1+ parts

$10.148

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915

$10.148

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Corphita

USA . 2,057 parts In-Stock

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2,057

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Parana Technologies

USA . 157 parts In-Stock

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$6.453

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157

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$6.453

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Overview

Elevate your projects with the M27C1024-70F1X EPROM from STMicroelectronics—a trusted leader in cutting-edge semiconductor solutions. This high-quality, ceramic-glass-sealed memory device offers unmatched durability and reliability for a wide range of applications, from industrial automation to consumer electronics. Experience rapid access times and efficient operation, ensuring your designs stand out. Choose the M27C1024-70F1X for excellence you can depend on!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed construction provides superior durability and protection against environmental factors, ensuring reliable performance.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization in circuit designs, making it versatile for various applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for greater flexibility in system timing, enabling faster response times in read and write operations.

Input/Output Type: COMMON

Common I/O configuration simplifies integration into existing systems, providing compatibility with a wide range of applications.

Nominal Supply Voltage / Vsup: 5V

Optimized for standard 5V systems, ensuring compatibility with a wide variety of electronic devices.

Power Supplies (V): 5V

Designed to operate on a 5V power supply, making it easy to integrate into low-power applications.

No. of Terminals: 40

A 40-terminal configuration provides ample connectivity options for various circuit designs, allowing for complex functionality.

Package Style (Meter): IN-LINE, WINDOW

The in-line, window package style ensures easy visibility and accessibility, facilitating debugging and testing.

Maximum Operating Temperature: 70 °C

Operates effectively up to 70 °C, making it suitable for applications in moderate temperature environments.

Organization: 64KX16

The 64Kx16 organization supports significant data storage per chip, allowing for efficient data management.

Output Characteristics: 3-STATE

3-state output allows for more efficient use of data buses, enabling multiple devices to share the same lines without conflicts.

Minimum Operating Temperature: 0 °C

Capable of operating in cold environments, enhancing usability across a wider range of applications.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability, improving the reliability of connections in circuit boards.

Terminal Position: DUAL

Dual-terminal positioning allows for flexible mounting options in circuit designs for easier integration.

Maximum Seated Height: 5.97 mm

The relatively low seated height facilitates installation in compact spaces, making it ideal for space-constrained applications.

Width: 15.24 mm

A compact width allows for efficient use of board space, maximizing design efficiency.

Minimum Supply Voltage (Vsup): 4.5 V

Allows operation in slightly lower voltage environments, enhancing flexibility for different power supply situations.

Length: 52.195 mm

The length optimization aids in fitting tightly into electronic designs while maintaining functional integrity.

Temperature Grade: COMMERCIAL

Commercial-grade components ensure stable performance under standard operating conditions, making them ideal for consumer electronics.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it suitable for energy-efficient applications.

Parallel or Serial: PARALLEL

Parallel processing allows for faster data transfers and reduced access times, enhancing overall system performance.

Terminal Form: THROUGH-HOLE

Through-hole configurations are robust and reliable, making them suitable for permanent installations.

Maximum Supply Current: 35 mA

The low supply current enhances energy efficiency, making it suitable for battery-powered applications.

No. of Words: 65536 words

With a capacity of 65536 words, it provides ample data storage for a variety of applications.

Memory Width: 16

A memory width of 16 bits allows for efficient data processing and is well-suited for 16-bit microcontrollers.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm ensures compatibility with common PCB layouts, enhancing design flexibility.

No. of Words Code: 64K

64K word capacity provides substantial storage for applications requiring significant data retention.

Maximum Supply Voltage (Vsup): 5.5 V

Support for up to 5.5 V allows for some headroom in power supply stability, making it reliable under fluctuating conditions.

Memory Density: 1048576 bits

High memory density supports extensive data storage capabilities, suitable for complex data applications.

Memory IC Type: UVPROM

UVPROM technology allows for reprogrammability, adding versatility to applications needing frequent data updates.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current enhances energy efficiency, making it ideal for low-power applications.

Maximum Access Time: 70 ns

Fast access time of 70 ns supports quick data retrieval, conducive for responsive applications.

Technical Specifications

EPROM M27C1024-70F1X attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T40

JESD-609 Code:

e3

Length:

52.195 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

40

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX16

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.97 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C1024-70F1X Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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