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5962-8606306YX

STMicroelectronics

5962-8606306YX by STMicroelectronics

5962-8606306YX by STMicroelectronics is a military-grade EPROM with a 32Kx8 organization, operating at 5V. It features asynchronous mode and a max access time of 120 ns, ideal for high-reliability applications in harsh environments. Its ceramic, metal-sealed package ensures durability.

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5962-8606306YX by STMicroelectronics
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Digiode

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Anansix

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IDEA Electronic Components Group

UK . 1,935 parts In-Stock

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$1.764

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Northwest PG Solutions

USA . 1,088 parts In-Stock

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$3.419

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MKK Technologies

India . 1,743 parts In-Stock

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DigiPath Technology Company

USA . 1,743 parts In-Stock

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$3.685

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Parana Technologies

USA . 837 parts In-Stock

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$2.343

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Corphita

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Native Components

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Supply Digital

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Overview

Unlock unparalleled reliability and performance with the 5962-8606306YX EPROM from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a robust solution ideal for military and aerospace applications. This exceptional UVPROM ensures data integrity across extreme temperatures, offering peace of mind in critical environments. Elevate your projects with advanced memory technology that guarantees efficiency and longevity—experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed co-fired package ensures high durability and reliability, making it suitable for harsh environments.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact electronic designs, saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape provides a standard footprint for various circuit board designs.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for faster data access and processing, enhancing overall performance.

Nominal Supply Voltage / Vsup: 5V

Operating at a nominal 5V makes it compatible with a wide range of electronic systems.

No. of Terminals: 32

Having 32 terminals allows for flexible connection and integration options in complex circuits.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style with a window is ideal for applications that require UV exposure for programming or erasing.

Maximum Operating Temperature: 125 °C

With a maximum temperature rating of 125 °C, this EPROM can function reliably in high-heat environments.

Organization: 32KX8

The 32Kx8 organization indicates efficient memory management, suitable for various applications needing 256KB of memory.

Minimum Operating Temperature: -55 °C

The ability to operate at -55 °C ensures performance in extreme cold climates, perfect for military and aerospace applications.

Terminal Position: QUAD

Quad terminal positioning offers better alignment and stability during PCB assembly.

Maximum Seated Height: 3.3 mm

The low seated height allows for compact designs, accommodating thinner devices.

Width: 11.43 mm

A width of 11.43 mm fits well in various layouts, providing flexibility in design.

Minimum Supply Voltage: 4.5V

A minimum operating voltage of 4.5V allows for varied power supply options in many applications.

Length: 13.97 mm

The compact length makes it ideal for space-constrained applications.

Temperature Grade: MILITARY

Designed to military standards, it ensures high reliability and performance under rigorous conditions.

Technology: CMOS

CMOS technology enables low power consumption, making it energy efficient.

Parallel or Serial: PARALLEL

Parallel data access allows for faster read and write operations, enhancing performance.

Terminal Form: NO LEAD

No-lead terminals reduce parasitic inductance and improve performance in high-speed applications.

No. of Words: 32768 words

With a capacity of 32768 words, it is suitable for applications needing significant data storage.

Memory Width: 8

An 8-bit memory width aligns with common data bus architectures, facilitating easier integration.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for compatibility with various PCB layouts and improves solderability.

No. of Words Code: 32K

Offering 32K words of code storage, it is perfect for a wide range of embedded applications.

Maximum Supply Voltage: 5.5V

A maximum supply voltage of 5.5V provides a margin for power supply fluctuations, ensuring stability.

Memory Density: 262144 bit

With a density of 262144 bits, it offers substantial storage, catering to memory-intensive applications.

Memory IC Type: UVPROM

As a UVPROM, it allows for reprogrammability and flexibility in design changes.

Maximum Access Time: 120 ns

A maximum access time of 120 ns ensures that this EPROM meets high-speed performance requirements.

Technical Specifications

EPROM 5962-8606306YX attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

120 ns

JESD-30 Code:

R-CQCC-N32

Length:

13.97 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32KX8

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

5962-8606306YX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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