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HCF4013M013TR

STMicroelectronics

HCF4013M013TR by STMicroelectronics

HCF4013M013TR by STMicroelectronics is a dual D-type flip-flop with a 300 ns propagation delay, operating at 5V nominal supply. It features a military temperature grade and supports frequencies up to 3.5 MHz, ideal for reliable data storage in various applications. Its compact SOIC package ensures efficient surface mounting in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

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Vyrian

USA . 6,952 parts In-Stock

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Bristol Electronics

USA . 5,626 parts In-Stock

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Atlantic Semiconductor

USA . 5,596 parts In-Stock

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Anansix

USA . 2,580 parts In-Stock

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EMSNET

USA . 2,500 parts In-Stock

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A2Z Electronics, Inc.

USA . 2,214 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,190 parts In-Stock

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PC Components Company LLC

USA . 1,980 parts In-Stock

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Martec Srl

Italy . 1,790 parts In-Stock

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Digiode

USA . 1,753 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,655 parts In-Stock

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J2 Sourcing AB

Sweden . 1,483 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,304 parts In-Stock

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SPM Sales

USA . 450 parts In-Stock

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450

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A&K Electronics

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Rotakorn

Sweden . 184 parts In-Stock

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Inventory MP

USA . 30 parts In-Stock

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LittleDiode

UK . 8 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 56 parts In-Stock

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$16.320

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$16.320

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IDEA Electronic Components Group

UK . 1,273 parts In-Stock

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$26.712

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$24.041

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Native Components

USA . 50 parts In-Stock

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$31.640

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$30.374

50

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Northwest PG Solutions

USA . 2,128 parts In-Stock

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$34.804

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MKK Technologies

India . 1,502 parts In-Stock

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$50.231

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DigiPath Technology Company

USA . 1,502 parts In-Stock

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$50.231

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 28,837 parts In-Stock

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Microchip USA

USA . 5,841 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,771 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 3,943 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 3,943 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,847 parts In-Stock

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Corphita

USA . 2,373 parts In-Stock

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Kepictronics

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Assy Fe

Spain . 1,095 parts In-Stock

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Metaverse IC Inc.

Canada . 822 parts In-Stock

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S.R.D Solutions

India . 500 parts In-Stock

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500

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Parana Technologies

USA . 222 parts In-Stock

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$31.938

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222

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$31.938

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Overview

Unlock the potential of your designs with the HCF4013M013TR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-quality dual D-type flip-flop delivers reliable performance in diverse applications, from consumer electronics to industrial automation. With its robust military-grade specifications and superior build, you can count on enhanced functionality and efficiency. Elevate your projects with this essential component that ensures long-lasting durability and exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable package material ensures reliability and protection from environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 300 ns

The fast propagation delay allows for quicker signal processing, making it ideal for high-speed applications.

Surface Mount: YES

Surface mount technology enables compact designs and easy integration into modern PCB layouts.

No. of Functions: 2

With two functions, this device provides versatility and can be utilized in more complex circuit designs.

Package Shape: RECTANGULAR

The rectangular shape is standard for many applications, allowing for efficient space utilization on PCBs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal 5V ensures compatibility with common logic levels and simplifies power supply design.

Load Capacitance (CL): 50 pF

A low load capacitance contributes to faster switching speeds and reduced power consumption, enhancing performance.

Power Supplies (V): 5/15

Dual supply voltage allows for greater flexibility in circuit design, accommodating a variety of logic levels.

No. of Terminals: 14

Fourteen terminals provide ample connection options for integration into various circuits and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes board space, enabling more compact designs and efficient use of real estate.

Propagation Delay (tpd): 300 ns

Consistent propagation delay ensures predictable performance in timing-critical applications.

Maximum Operating Temperature: 125 °C

The high operating temperature rating makes this device suitable for use in demanding and high-temperature environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering enhances signal integrity, making the device responsive to the accurate timing of input signals.

Minimum Operating Temperature: -55 °C

With an extended operating temperature range, this product can function effectively in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing reliability.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit layout and enhances compatibility with various designs.

Maximum Seated Height: 1.75 mm

A low seated height facilitates easier integration into flat or compact designs, helping to optimize device footprint.

Width: 3.9 mm

The narrow width makes it suitable for space-constrained applications, allowing for denser PCB layouts.

Output Polarity: COMPLEMENTARY

Complementary output allows for versatile application, enhancing signal performance in circuits.

Minimum Supply Voltage (Vsup): 3 V

The lower supply voltage requirement improves power efficiency, making it suitable for battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 40

Extended time at peak reflow temperature aids in proper soldering processes, ensuring durable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature supports compatibility with lead-free solder, making it environmentally friendly.

Length: 8.65 mm

A compact length optimizes space on the PCB while maintaining effectiveness in circuit functions.

Temperature Grade: MILITARY

Military-grade specifications ensure durability and reliability in harsh environments, suitable for defense and aerospace applications.

Maximum Frequency At Nominal Supply: 3500000 Hz

The ability to operate at high maximum frequency enhances performance in fast-switching applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient for various applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint strength and reduce stress on connections, enhancing reliability.

Packing Method: TR

Tape and reel packing method allows for automatic placement and easy handling in high-volume production.

Terminal Pitch: 1.27 mm

The standard terminal pitch provides compatibility with a wide range of PCB designs, ensuring ease of integration.

Minimum fmax: 12 MHz

A minimum frequency capability supports a variety of low-speed applications, adding to its versatility.

Maximum Supply Voltage (Vsup): 20 V

High maximum supply voltage capability expands the potential applications, allowing for use in high-performance circuits.

Technical Specifications

Latches & Flip-Flops HCF4013M013TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

12 MHz

Trade Compliance

HCF4013M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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