Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
HCF4013M013TR by STMicroelectronics is a dual D-type flip-flop with a 300 ns propagation delay, operating at 5V nominal supply. It features a military temperature grade and supports frequencies up to 3.5 MHz, ideal for reliable data storage in various applications. Its compact SOIC package ensures efficient surface mounting in space-constrained designs.
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This durable package material ensures reliability and protection from environmental factors, making the product suitable for various applications.
The fast propagation delay allows for quicker signal processing, making it ideal for high-speed applications.
Surface mount technology enables compact designs and easy integration into modern PCB layouts.
With two functions, this device provides versatility and can be utilized in more complex circuit designs.
The rectangular shape is standard for many applications, allowing for efficient space utilization on PCBs.
Operating at a nominal 5V ensures compatibility with common logic levels and simplifies power supply design.
A low load capacitance contributes to faster switching speeds and reduced power consumption, enhancing performance.
Dual supply voltage allows for greater flexibility in circuit design, accommodating a variety of logic levels.
Fourteen terminals provide ample connection options for integration into various circuits and functionalities.
The small outline package style optimizes board space, enabling more compact designs and efficient use of real estate.
Consistent propagation delay ensures predictable performance in timing-critical applications.
The high operating temperature rating makes this device suitable for use in demanding and high-temperature environments.
Positive edge triggering enhances signal integrity, making the device responsive to the accurate timing of input signals.
With an extended operating temperature range, this product can function effectively in extreme conditions.
The high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing reliability.
Dual terminal positioning provides flexibility in circuit layout and enhances compatibility with various designs.
A low seated height facilitates easier integration into flat or compact designs, helping to optimize device footprint.
The narrow width makes it suitable for space-constrained applications, allowing for denser PCB layouts.
Complementary output allows for versatile application, enhancing signal performance in circuits.
The lower supply voltage requirement improves power efficiency, making it suitable for battery-powered applications.
Extended time at peak reflow temperature aids in proper soldering processes, ensuring durable connections.
The high peak reflow temperature supports compatibility with lead-free solder, making it environmentally friendly.
A compact length optimizes space on the PCB while maintaining effectiveness in circuit functions.
Military-grade specifications ensure durability and reliability in harsh environments, suitable for defense and aerospace applications.
The ability to operate at high maximum frequency enhances performance in fast-switching applications.
CMOS technology offers low power consumption and high noise immunity, making it efficient for various applications.
Gull wing terminals provide excellent solder joint strength and reduce stress on connections, enhancing reliability.
Tape and reel packing method allows for automatic placement and easy handling in high-volume production.
The standard terminal pitch provides compatibility with a wide range of PCB designs, ensuring ease of integration.
A minimum frequency capability supports a variety of low-speed applications, adding to its versatility.
High maximum supply voltage capability expands the potential applications, allowing for use in high-performance circuits.
Latches & Flip-Flops HCF4013M013TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics
Family:
JESD-30 Code:
JESD-609 Code:
Length:
Load Capacitance (CL):
Logic IC Type:
Maximum Frequency At Nominal Supply:
Moisture Sensitivity Level (MSL):
No. of Bits:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output Polarity:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Packing Method:
Peak Reflow Temperature (C):
Power Supplies (V):
Propagation Delay At Nominal Supply:
Propagation Delay (tpd):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Trigger Type:
Width:
Minimum fmax:
HCF4013M013TR Logic ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N7002
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
1N4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM317T
Tt Electronics Plc
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Qualification Status: Not Qualified; JESD-30 Code: R-PSFM-T3;
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99-7-F
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SMMBT3904LT1G
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
New England Semiconductor
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Transys Electronics
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
CD74AC174M
CD74AC174M by Texas Instruments is a 6-bit latch with a propagation delay of 18.9 ns, suitable for military-grade applications. It operates at a max frequency of 68 MHz and has a power supply current of 0.16 mA, making it ideal for high-speed digital systems requiring low power consumption. The device features positive edge triggering and is designed for surface mount installation in small outline packages.
SN74HC109DR
SN74HC109DR by Texas Instruments is a dual-function latches & flip-flops IC with 2 bits, 58ns propagation delay, and 50pF load capacitance. It operates at a nominal voltage of 5V and has a max frequency of 25MHz. Ideal for industrial applications requiring positive edge triggering in compact designs.
TPIC6B273DWG4
TPIC6B273DWG4 by Texas Instruments is an 8-bit latch with a propagation delay of 150 ns at 5V, suitable for automotive applications. It features open-drain output characteristics and positive edge trigger type, operating b/w -40 to 125°C. This small outline package has a terminal pitch of 1.27mm and is surface mountable.
74HCT74D,652
Nexperia
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
SN74HC112DRG4
SN74HC112DRG4 by Texas Instruments is a dual-function latches & flip-flops IC with 2 bits, operating at 5V. It has a propagation delay of 155ns and can handle load capacitance up to 50pF. Ideal for industrial applications requiring negative edge triggering and complementary output polarity.
CD74HC73MT
CD74HC73MT by Texas Instruments is a dual-function latches & flip-flops IC with 2 bits, 40ns propagation delay, and 50pF load capacitance. It operates at a supply voltage of 4.5V, has a max frequency of 20MHz, and is suitable for military-grade applications requiring negative edge triggering in small outline packages.
74LCX74MX
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
SN74HC74NSR
SN74HC74NSR by Texas Instruments is a dual-function latches & flip-flops IC with 14 terminals. It operates at a supply voltage range of 2-6V, has a propagation delay of 220ns, and can handle load capacitance up to 50pF. Ideal for industrial applications requiring positive edge triggering and complementary output polarity.
SN74HC74DBRG4
SN74HC74DBRG4 by Texas Instruments is a dual-function latches & flip-flops IC with 2 functions, operating at a nominal voltage of 5V. It has a propagation delay of 220ns and can handle load capacitance up to 50pF. Ideal for industrial applications requiring positive edge triggering, this CMOS technology-based IC comes in a small outline package with dual terminal position.
SN74HC74PWRE4
SN74HC74PWRE4 by Texas Instruments is a dual-function latches & flip-flops IC with 14 terminals. It operates at a nominal voltage of 5V and has a load capacitance of 50pF. With a max frequency of 29MHz, it is ideal for industrial applications requiring positive edge triggering and complementary output polarity.
74LVC1G79GW,125
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;
CD4044BPWRE4
Rochester Electronics
R-S LATCH; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
74VHC175MX
74VHC175MX by Onsemi is a CMOS latch with 4 bits, operating at a supply voltage of 2-5.5 V and featuring a propagation delay of 10.5 ns. With a max frequency of 125 MHz, it is ideal for industrial applications requiring fast data processing in compact designs.
CD4043BDW
CD4043BDW by Texas Instruments is a 4-bit latch with a propagation delay of 140 ns at 5V. It features a 3-STATE output and operates in temperatures ranging from -55 to 125°C. Ideal for military-grade applications requiring high-level triggering and low power consumption.
5962-9321701QRA
The Texas Instruments 5962-9321701QRA is an 8-bit latch with a propagation delay of 7.5 ns at 5V, suitable for military applications. It operates b/w -55 to 125°C and has a max frequency of 150 MHz, making it ideal for high-speed signal processing in harsh environments. With MIL-PRF-38535 Class Q screening, this BICMOS technology flip-flop offers reliable performance in critical systems.
CD74AC112M
Rca Solid State
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
MC100EP131FAR2G
MC100EP131FAR2G by Onsemi is a 4-bit latch with 0.6 ns propagation delay, operating b/w -40 to 85 °C. It has a supply voltage of 3.3V and supports positive edge trigger type. Ideal for industrial applications requiring fast data processing in compact spaces due to its low profile flatpack design and complementary output polarity.
SN74HC273DWRE4
SN74HC273DWRE4 by Texas Instruments is an 8-bit latch with a propagation delay of 200 ns at 5V. It operates in industrial temperatures (-40 to 85°C) and has a max frequency of 21 MHz, making it suitable for applications requiring fast data storage and retrieval. With surface mount capability and small outline packaging, it offers versatility in compact electronic designs.
MC14044BDR2G
MC14044BDR2G by Onsemi is a 4-bit latch with 350 ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and has a load capacitance of 50 pF. Ideal for military applications due to its CMOS technology and small outline package style.
Defense Logistics Agency
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
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HCF4013BEY
STMicroelectronics
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
HCF4013BM
HCF4027BF
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF40174BEY
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF4027BE
HCF40174BC1
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
HCF4027BM
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
HCF4013BE
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
HCF4013BM1
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
HCF40174BF
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF40174BM
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
HCF4027BC1
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
HCF4013YM013TR
HCF4027BEY
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF4013BF
HCF40174BE
HCF4013BC1
HCF40174BM1
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
HCF40174M013TR
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