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HCF4013BM1

STMicroelectronics

HCF4013BM1 by STMicroelectronics

HCF4013BM1 by STMicroelectronics is a CMOS latches & flip-flops IC with 2 functions, 300 ns propagation delay at 5V. It has positive edge trigger, operates b/w -55 to 125 °C, and supports up to 3-20 V supplies. Ideal for military-grade applications requiring high-frequency operation in compact designs.

Median Price

$28.822

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 45 parts In-Stock

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$28.822

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Digital Electronic Gebert Verwaltungs UG

Germany . 4,950 parts In-Stock

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Sea View Technologies

USA . 4,900 parts In-Stock

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Bristol Electronics

USA . 4,500 parts In-Stock

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Vyrian

USA . 2,464 parts In-Stock

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Anansix

USA . 1,273 parts In-Stock

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Digiode

USA . 1,069 parts In-Stock

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Microfarads

USA . 1,012 parts In-Stock

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Zilex Electronics Inc.

Canada . 797 parts In-Stock

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797

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ACDS - Activité Composants Distribution Service

France . 500 parts In-Stock

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Sunrise Surplus Inc.

USA . 250 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 230 parts In-Stock

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ABC Electronics Ltd.

UK . 194 parts In-Stock

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Component Electronics Inc.

Canada . 31 parts In-Stock

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Semi Source

USA . 10 parts In-Stock

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IDEA Electronic Components Group

UK . 763 parts In-Stock

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$9.801

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$8.821

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763

$9.801

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MKK Technologies

India . 1,749 parts In-Stock

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$18.430

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$18.430

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DigiPath Technology Company

USA . 1,749 parts In-Stock

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$18.430

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Metaverse IC Inc.

Canada . 6,200 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 1,890 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,860 parts In-Stock

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Northwest PG Solutions

USA . 1,752 parts In-Stock

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Parana Technologies

USA . 1,499 parts In-Stock

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$11.718

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Alle Elektronik GmbH

Germany . 1,240 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Native Components

USA . 653 parts In-Stock

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Assy Fe

Spain . 501 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 500 parts In-Stock

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Glotronic Ltd.

UK . 400 parts In-Stock

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Kepictronics

USA . 83 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 10 parts In-Stock

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Overview

Unlock endless possibilities with the HCF4013BM1 from STMicroelectronics, a leading manufacturer known for top-quality electronic components. This latches & flip-flops device offers reliable performance and versatility in various applications. Experience seamless operation and enhanced functionality with this product, providing value and benefits that cater to your specific needs. Upgrade your projects with ease using the HCF4013BM1 and discover the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch durable and resistant to environmental factors, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 300 ns

The low propagation delay ensures fast response times, making this latch suitable for time-sensitive applications.

Surface Mount: YES

The ability to be surface mounted allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Functions: 2

Having multiple functions in a single component helps in simplifying the circuit design and reducing the overall complexity of the system.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common nominal supply voltage of 5V makes this latch compatible with a wide range of circuits and devices.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable operation and compatibility with various external components in the circuit.

Power Supplies (V): 5/15

Support for dual power supplies at 5V and 15V provides flexibility in choosing the appropriate power source for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic designs and applications with limited space.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise and reliable switching, allowing for accurate timing control in sequential operations.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances the latch's electrical conductivity and corrosion resistance, ensuring reliable performance over time.

Technology: CMOS

The CMOS technology used in this latch offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuits.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in harsh environmental conditions and high temperature settings, making this latch suitable for industrial and defense applications.

Technical Specifications

Latches & Flip-Flops HCF4013BM1 attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

12 MHz

Trade Compliance

HCF4013BM1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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