Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HCF4013BM by STMicroelectronics is a CMOS latches & flip-flops IC with 2 functions, 300 ns propagation delay at 5V. It has a trigger type of positive edge and operates in industrial temperature range. Ideal for applications requiring high-speed data storage and transfer.
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$3.661
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Provides durability and protection for the internal components of the latch, ensuring long-lasting performance.
Fast response time allows for quick data processing and reliable operation of the latch.
Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.
Compatible with common power supply voltages, making it versatile for a variety of applications.
Compact design and shape make it suitable for space-constrained environments.
Can withstand high temperatures, ideal for industrial environments where heat may be a factor.
Provides precise control over when the latch is triggered, ensuring accurate data capture.
Utilizes Complementary Metal-Oxide-Semiconductor technology for efficient power consumption and reliable performance.
Latches & Flip-Flops HCF4013BM attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics
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HCF4013BM Logic ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
1N4148
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
LL4148
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
M24308/2-1F
Souriau
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Body or Shell Style: RECEPTACLE; MIL Conformity: YES;
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
Vishay Intertechnology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Telefunken Microelectronics
Laube Technology
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
BAV99
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
2N2222A
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MM74HC273WMX
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
CD4044BPWG4
Texas Instruments
CD4044BPWG4 by Texas Instruments is a 4-bit latch with 300 ns propagation delay at 5V. It has a small outline package and operates in temperatures ranging from -55 to 125°C. Ideal for military-grade applications requiring low-level trigger type and true output polarity.
74LCX74MTC
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
SN74HC175DR
SN74HC175DR by Texas Instruments is a 4-bit latch with 38 ns propagation delay, suitable for industrial applications. It operates at a supply voltage of 5V, has a load capacitance of 50 pF, and supports a max frequency of 25 MHz. This CMOS technology flip-flop features positive edge triggering and can withstand temperatures from -40 to 85°C.
SN74HC74NE4
SN74HC74NE4 by Texas Instruments is a dual latches & flip-flops IC with 14 terminals. It operates at a supply voltage range of 2-6V and has a max frequency of 29MHz. With a propagation delay of 220ns, it is ideal for industrial applications requiring positive edge triggering and complementary output polarity.
SN74HC273DBR
SN74HC273DBR by Texas Instruments is an 8-bit latch with a propagation delay of 200 ns, operating at a supply voltage of 5V. It features positive edge triggering and CMOS technology, suitable for industrial applications requiring high frequency operation up to 21 MHz.
NC7SZ74K8X_NL
Fairchild Semiconductor's NC7SZ74K8X_NL is a CMOS latch with 7.5ns propagation delay, operating at 1.8V to 3.3V. It features a small outline package suitable for industrial applications, with a max frequency of 175MHz and dual terminal position for easy installation in compact spaces.
MM74HC273N
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
CD74AC273M96
Rca Solid State
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
MC74AC273DTR2G
Onsemi
MC74AC273DTR2G by Onsemi is an 8-bit latch with a supply voltage of 3.3/5V, operating at a max frequency of 75MHz. It features a propagation delay of 14.5ns and is ideal for industrial applications requiring positive edge triggering in a small outline package.
CD4013BEX
Intersil
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
74LVC1G74DP-Q100H
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
SN74HC273NSR
SN74HC273NSR by Texas Instruments is an 8-bit latch with a propagation delay of 200 ns, suitable for industrial applications. It operates at a supply voltage range of 2-6V and has a max frequency of 21 MHz. With surface mount capability and Gull Wing terminals, it offers efficient performance in compact designs.
CD4013BCMX
CD4013BCMX by National Semiconductor is a CMOS latches & flip-flops IC with 2 functions, 14 terminals, and 350 ns propagation delay. It operates b/w -40 to 85 °C and has a supply voltage range of 3-15 V. Ideal for industrial applications requiring positive edge triggering in compact designs.
MC100EP52DTG
MC100EP52DTG by Onsemi is a latches & flip-flops IC with 3.3V nominal voltage, 0.38ns propagation delay, and 4000000000Hz max frequency. It is used in applications requiring positive edge trigger type, such as industrial temperature grade environments.
74AUP1G79GW,125
NXP Semiconductors' 74AUP1G79GW,125 is a CMOS latch with 25.6 ns propagation delay and 30 pF load capacitance. It operates at supply voltages of 1.2V to 3.3V, making it ideal for automotive applications requiring fast response times and low power consumption in a compact form factor.
MC100EP51DTG
MC100EP51DTG by Onsemi is a latches & flip-flops IC with 0.5 ns propagation delay, 3.3V nominal voltage, and 3000000000 Hz max frequency. Ideal for industrial applications requiring positive edge trigger type and complementary output polarity in a small outline package.
HEF4013BT,652
HEF4013BT,652 by NXP Semiconductors is a CMOS latches & flip-flops IC with 2 functions. It operates at a max frequency of 7MHz, has a propagation delay of 220ns, and supports supply voltages from 3V to 15V. Ideal for industrial applications requiring positive edge triggering in compact designs.
SN74HC259DRG4
SN74HC259DRG4 by Texas Instruments is an 8-bit latches & flip-flops IC with a propagation delay of 28ns at 5V. It operates in industrial temperature range (-40 to 85°C) and has a max supply voltage of 6V. Ideal for applications requiring low-level trigger type and true output polarity, it comes in a small outline package with surface mount capability.
Rochester Electronics
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
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HCF4013BEY
STMicroelectronics
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
HCF4027BF
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF40174BEY
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF4027BE
HCF40174BC1
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
HCF4027BM
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
HCF4013BE
HCF4013BM1
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
HCF40174BF
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF40174BM
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
HCF4027BC1
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
HCF4013YM013TR
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
HCF4027BEY
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF4013BF
HCF40174BE
HCF4013BC1
HCF40174BM1
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
HCF4013M013TR
HCF40174M013TR
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