Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HCF40174BE by STMicroelectronics is a CMOS latch with 6 functions, operating at temperatures from -40 to 85 °C. It has a load capacitance of 50 pF and can handle power supplies of 5/15V. This rectangular package with 16 terminals is ideal for industrial applications requiring positive edge triggering up to a frequency of 3.5 MHz.
Median Price
$1.385
Lifecycle Status
Suppliers In-Stock
18
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1k+
Component Electronics Inc.
1+ parts
$0.770
100+ parts
$0.580
1k+ parts
$0.500
10k+ parts
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TEDSS.com
$2.000
$1.420
PC Components Company LLC
Bristol Electronics
Vyrian
Digiode
ComSIT Distribution GmbH
Anansix
ECAB
Electronics Depot
Q Components
GES GmbH
Corel Iberica Componentes, S.L.
Ack Elektronik San.Tic.Ltd.Sti
Prism Electronics
LittleDiode
J2 Sourcing AB
Sinequanon
Native Components
$0.135
$0.130
Northwest PG Solutions
$0.149
$0.131
IDEA Electronic Components Group
$9.228
$8.305
MKK Technologies
$17.352
DigiPath Technology Company
Corphita
Kepictronics
Parana Technologies
$11.033
Assy Fe
Perfect Parts
Plastic and epoxy materials provide durability and reliability, making this product suitable for various industrial applications.
With 6 functions, this product offers versatile functionality and can be used in complex circuit designs.
Rectangular package shape allows for easy integration into circuit boards and compact designs.
With a low load capacitance of 50 pF, this product ensures efficient operation and minimal power consumption.
This product is compatible with power supplies of 5V/15V, offering flexibility in power requirements.
With 16 terminals, this product allows for easy connections and enables versatile connectivity options.
The in-line package style is suitable for applications where space-saving and compact design is essential.
With a high maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions.
Positive edge trigger type allows for precise timing control and reliable switching in digital circuits.
The low minimum operating temperature of -40 °C ensures reliable performance in extreme cold environments.
Tin/lead terminal finish provides good solderability and conductivity for secure connections in the circuit.
Dual terminal position offers flexibility in PCB layout and simplifies the assembly process.
Industrial temperature grade ensures reliable performance in a wide range of industrial applications.
With a maximum frequency of 3.5 MHz at nominal supply voltage, this product is suitable for high-speed applications.
CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.
Through-hole terminal form allows for easy soldering and secure mounting on the PCB.
With a terminal pitch of 2.54 mm, this product supports standard PCB layouts and facilitates easy integration into circuit designs.
Latches & Flip-Flops HCF40174BE attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics
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HCF40174BE Logic ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
1N4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002-T1-E3
Vishay Intertechnology
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358M
Texas Instruments
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
General Semiconductor
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Multicomp Pro
Panjit International
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CD40175BE
General Electric Solid State
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
NC7SZ175L6X-L22175
NC7SZ175L6X-L22175 by Onsemi is a latch with 6.2ns propagation delay, 1.8V nominal voltage, and 50pF load capacitance. Ideal for applications requiring fast response times in industrial settings due to its positive edge trigger type and high max frequency of 175MHz at a supply voltage range of 1.65V to 5.5V.
74AC74SC
Rochester Electronics
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
SN74LVC2G74DCUR
SN74LVC2G74DCUR by Texas Instruments is a latches & flip-flops IC with 5.9ns propagation delay, 1.8V nominal voltage, and 32A max I (ol). It is used in automotive applications due to its small size, low power consumption (0.01mA), and high operating temperature range (-40 to 125°C).
SN74HC273NE4
SN74HC273NE4 by Texas Instruments is an 8-bit latch with a propagation delay of 200 ns, operating at a supply voltage of 5V. It features positive edge triggering and a max frequency of 21 MHz, making it ideal for industrial applications requiring reliable data storage and retrieval in electronic circuits.
74LVC1G80GN,132
NXP Semiconductors
NXP Semiconductors' 74LVC1G80GN,132 is a latch with 3.3V supply, 13ns propagation delay, and 200MHz fmax. Ideal for automotive applications due to its small outline package and positive edge trigger type.
CD74HCT273M
Thomson Consumer Electronics
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
74HCT74D,652
NXP Semiconductors' 74HCT74D,652 is a dual-function latch with 14 terminals and a supply voltage of 5V. It features a propagation delay of 53ns, operating temperature range from -40 to 125°C, and peak reflow temperature of 260°C. Ideal for automotive applications due to its CMOS technology and high frequency capability up to 18MHz.
74VHC273MTC
74VHC273MTC by Onsemi is an 8-bit latch with a propagation delay of 12.5 ns at 3.3V, suitable for industrial applications. It operates on a supply voltage range of 2-5.5V, has a max frequency of 75 MHz, and features positive edge triggering in a small outline package ideal for surface mount designs.
74VHC175M
Fairchild Semiconductor
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
CD74ACT273M96
Intersil
5962-9321701QRA
Defense Logistics Agency
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
MC100EP131FA
MC100EP131FA by Onsemi is a 4-bit latch with 0.6 ns propagation delay, operating at -40 to 85 °C. It has a supply voltage of 3.3V and can handle up to 5.5V. Ideal for high-speed applications in industrial settings due to its ECL technology and max frequency of 3GHz.
CD4013BEX
Rca Solid State
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
SN74LVC74APW
SN74LVC74APW by Texas Instruments is a dual-function latch with 5.2ns propagation delay, ideal for automotive applications. Operating b/w -40 to 125°C, it supports a max frequency of 150MHz at a supply voltage range of 1.65V to 3.6V, making it suitable for high-speed and low-power designs.
SN54LS74AJ
Motorola
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
CD4013BPWRE4
CD4013BPWRE4 by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 300 ns propagation delay at 5V. It operates b/w -55 to 125°C, suitable for military applications. With a small outline package and surface mount capability, it offers high-speed performance up to 3.5 MHz.
74LVC1G80GV,125
NXP Semiconductors' 74LVC1G80GV,125 is a CMOS latch with 3.3V supply voltage and 50pF load capacitance. It operates at temperatures from -40 to 125°C, has a propagation delay of 13ns, and supports a max frequency of 200MHz. Ideal for automotive applications requiring positive edge triggering in compact designs.
NL17SZ74USG-L22190
NL17SZ74USG-L22190 by Onsemi is a 3-STATE latch with 8ns propagation delay and 32A max I (ol). It operates at -55 to 125 °C, with a supply voltage range of 1.65V to 5.5V. Ideal for applications requiring fast response time and low power consumption in compact designs.
74LCX112MTCX
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
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HCF4013BEY
STMicroelectronics
HCF4013BM
HCF4027BF
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF40174BEY
HCF4027BE
HCF40174BC1
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
HCF4027BM
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
HCF4013BE
HCF4013BM1
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
HCF40174BF
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF40174BM
HCF4027BC1
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
HCF4013YM013TR
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
HCF4027BEY
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
HCF4013BF
HCF4013BC1
HCF40174BM1
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
HCF4013M013TR
HCF40174M013TR
HCF40174BE
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