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HCF4027BF

STMicroelectronics

HCF4027BF by STMicroelectronics

HCF4027BF by STMicroelectronics is a CMOS latch with 2 functions, operating at -40 to 85 °C. It has a load capacitance of 50 pF and supports power supplies from 3V to 15V. Ideal for industrial applications requiring a master-slave trigger type in an inline package style.

Median Price

$2.080

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TEDSS.com

USA . 15 parts In-Stock

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$2.080

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15

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Vyrian

USA . 3,891 parts In-Stock

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Digiode

USA . 2,951 parts In-Stock

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2,951

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Anansix

USA . 1,286 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,220 parts In-Stock

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Electronic Expediters

USA . 56 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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LWI Electronics Inc

India . 4 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,346 parts In-Stock

1+ parts

$28.032

100+ parts

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$25.229

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2,346

$28.032

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$25.229

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MKK Technologies

India . 179 parts In-Stock

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$52.713

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179

$52.713

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DigiPath Technology Company

USA . 179 parts In-Stock

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$52.713

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179

$52.713

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Parana Technologies

USA . 1,672 parts In-Stock

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$33.517

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$33.517

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Corphita

USA . 1,192 parts In-Stock

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Native Components

USA . 730 parts In-Stock

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730

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Northwest PG Solutions

USA . 335 parts In-Stock

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Overview

Unleash the power of seamless data processing with the HCF4027BF by STMicroelectronics. Crafted from high-quality ceramic materials, this master-slave latches and flip-flops device offers unparalleled reliability and performance. With 2 functions packed into its rectangular package, it is perfect for industrial applications that demand precision and efficiency. Experience the value of smooth operation, low power consumption, and wide temperature range capabilities that only STMicroelectronics can deliver. Upgrade your technology arsenal with the HCF4027BF and stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good protection against temperature variations and ensures durability, making this product suitable for industrial applications.

No. of Functions: 2

Having multiple functions in a single device increases efficiency and saves space in electronic circuits.

Load Capacitance (CL): 50 pF

Low load capacitance helps in faster switching and reduced power consumption, making the product energy-efficient.

Power Supplies (V): 3/15

Compatible with dual power supply voltages, offering flexibility in different system configurations.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in a circuit, enabling versatile applications.

Maximum Frequency At Nominal Supply: 3500000 Hz

High maximum frequency capability allows for fast operation and precise timing in digital systems.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of devices.

Technical Specifications

Latches & Flip-Flops HCF4027BF attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

MASTER-SLAVE

Trade Compliance

HCF4027BF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-25-133-5823, 5962251335823

NIIN

251335823

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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