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HCF4013BEY

STMicroelectronics

HCF4013BEY by STMicroelectronics

HCF4013BEY by STMicroelectronics is a CMOS latches & flip-flops IC with 2 functions, 300 ns propagation delay at 5V. It operates in the temperature range of -55 to 125°C and has a max frequency of 3.5 MHz. Ideal for military-grade applications requiring positive edge triggering and complementary output polarity.

Median Price

$0.820

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$0.150

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-

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50

$0.150

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American Microsemiconductor Inc.

USA . 30 parts In-Stock

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$0.820

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30

$0.820

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Component Electronics Inc.

Canada . 59 parts In-Stock

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$6.150

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$4.620

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$4.000

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59

$6.150

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$4.000

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Infinite Electronics LLP

India . 11,300 parts In-Stock

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Vyrian

USA . 8,582 parts In-Stock

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Anansix

USA . 1,213 parts In-Stock

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QIE Inc.

USA . 705 parts In-Stock

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705

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EPE Components Inc.

USA . 700 parts In-Stock

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700

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Bristol Electronics

USA . 700 parts In-Stock

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700

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ACDS - Activité Composants Distribution Service

France . 196 parts In-Stock

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Digiode

USA . 177 parts In-Stock

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Diverse Electronics

Canada . 125 parts In-Stock

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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Whistler Technology

UK . 15 parts In-Stock

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Ashlea Components Ltd

UK . 9 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5 parts In-Stock

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Resion

USA . 2 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,580 parts In-Stock

1+ parts

$0.150

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$0.147

6,580

$0.150

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$0.147

Argo Parts USA

USA . 4,236 parts In-Stock

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$0.150

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$0.146

4,236

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$0.146

Netroflash

USA . 100 parts In-Stock

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$0.150

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100

$0.150

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Component Stockers USA

USA . 19 parts In-Stock

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$0.670

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19

$0.670

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Microchip USA

USA . 462 parts In-Stock

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$1.387

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462

$1.387

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AZTECH Wire

Italy . 267 parts In-Stock

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$13.970

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267

$13.970

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IDEA Electronic Components Group

UK . 699 parts In-Stock

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$28.125

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$25.313

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Ampacity Inc.

Singapore . 621 parts In-Stock

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$37.000

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MKK Technologies

India . 273 parts In-Stock

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$52.888

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DigiPath Technology Company

USA . 273 parts In-Stock

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$52.888

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Lixinc

USA . 4,356 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Parana Technologies

USA . 841 parts In-Stock

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$33.628

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Corphita

USA . 735 parts In-Stock

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Perfect Parts

USA . 721 parts In-Stock

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Kepictronics

USA . 320 parts In-Stock

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Glotronic Ltd.

UK . 157 parts In-Stock

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Assy Fe

Spain . 150 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 105 parts In-Stock

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Overview

Experience the superior quality and reliability of the HCF4013BEY by STMicroelectronics, a leading manufacturer in the industry. This versatile latch & flip-flop device is perfect for a wide range of applications, offering customers exceptional value and performance. With its fast propagation delay and dual functions, this product provides seamless operation and efficiency. Trust STMicroelectronics to deliver innovative solutions that exceed your expectations. Elevate your projects with the HCF4013BEY today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and resistant to damage, ensuring the latch & flip-flop's longevity and reliability.

Propagation Delay at Nominal Supply: 300 ns

The low propagation delay of 300 ns ensures fast response and performance, making this latch & flip-flop suitable for high-speed applications.

No. of Functions: 2

With 2 functions, this latch & flip-flop offers versatility in functionality, allowing for more complex circuit designs and operations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems and applications.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures stable signal transmission and reception, preventing signal distortion and ensuring accuracy.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise control and timing of data input, allowing for reliable operation in critical applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable in various operating conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this latch & flip-flop can withstand harsh environmental conditions and high-temperature settings.

Minimum Operating Temperature: -55 °C

The wide temperature range of -55 to 125°C allows for operation in both extreme cold and hot environments, enhancing the product's versatility.

Maximum Frequency at Nominal Supply: 3500000 Hz

The high maximum frequency of 3.5 MHz ensures rapid data processing and operation, making this latch & flip-flop suitable for high-performance applications.

Technical Specifications

Latches & Flip-Flops HCF4013BEY attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

12 MHz

Trade Compliance

HCF4013BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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