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HCF40174M013TR

STMicroelectronics

HCF40174M013TR by STMicroelectronics

HCF40174M013TR by STMicroelectronics is a 6-bit CMOS latch with a 5V nominal voltage and operates at temperatures from -55 °C to 125 °C. It features a propagation delay of 300 ns and supports frequencies up to 3.5 MHz, making it ideal for military applications. Its compact SO package ensures efficient surface mounting in various electronic designs.

Median Price

-

Lifecycle Status

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3

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1k+

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Vyrian

USA . 1,766 parts In-Stock

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1,766

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Digiode

USA . 307 parts In-Stock

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307

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Anansix

USA . 133 parts In-Stock

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133

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IDEA Electronic Components Group

UK . 1,526 parts In-Stock

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$30.123

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$27.110

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1,526

$30.123

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$27.110

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MKK Technologies

India . 651 parts In-Stock

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$56.644

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651

$56.644

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DigiPath Technology Company

USA . 651 parts In-Stock

1+ parts

$56.644

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651

$56.644

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Corphita

USA . 843 parts In-Stock

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Parana Technologies

USA . 641 parts In-Stock

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$36.016

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641

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$36.016

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Northwest PG Solutions

USA . 359 parts In-Stock

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$4.032

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359

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Native Components

USA . 164 parts In-Stock

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$3.991

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$3.991

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Overview

Unlock the potential of your designs with the HCF40174M013TR from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This versatile 6-bit latch offers exceptional performance and reliability, ideal for a range of applications from consumer electronics to military devices. Its compact surface-mount design ensures easy integration, while its robust temperature tolerance guarantees consistent operation in challenging environments. Experience superior efficiency and peace of mind with this cutting-edge component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy as the package body ensures protection against environmental factors, making the latch robust and reliable.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern PCB layouts, enhancing space efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the circuit board and can easily fit into various applications.

No. of Bits: 6

With 6 bits, this latch and flip-flop can handle multiple data input and output, making it suitable for complex applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with a wide range of digital logic circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for efficient signal handling and minimizes delays in signal transmission.

Power Supplies (V): 5/15

Support for dual power supplies (5V and 15V) provides flexibility for various applications, enhancing device compatibility.

No. of Terminals: 16

With 16 terminals, this component can interface with multiple connections, catering to complex circuit requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for higher integration density on circuit boards without sacrificing performance.

Propagation Delay (tpd): 300 ns

A propagation delay of 300 ns ensures that the product can handle relatively fast signal changes, enhancing overall circuit performance.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125 °C makes this product suitable for industrial and high-temperature environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for predictable timing performance, improving synchronization in digital circuits.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C ensures reliable performance in extreme cold environments, making it ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish provides superior corrosion resistance and improved solderability, enhancing reliability and longevity.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options, facilitating easier integration into various circuit layouts.

Maximum Seated Height: 1.75 mm

A low maximum seated height ensures compatibility with low-profile designs and compact electronic assemblies.

Width: 3.9 mm

A compact width of 3.9 mm improves layout flexibility in restricted spaces on PCBs.

Output Polarity: TRUE

True output polarity simplifies circuit design by directly providing the expected signal levels without inversion.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3V expands the range of applications in low-power environments.

Length: 9.9 mm

A manageable length of 9.9 mm allows for efficient PCB layout while maintaining optimal performance.

Temperature Grade: MILITARY

Classified under military grade standards, this product guarantees reliability in harsh and critical operational environments.

Maximum Frequency At Nominal Supply: 3500000 Hz

Capable of operating at a maximum frequency of 3.5 MHz ensures this latch can handle moderate-speed applications effectively.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form allows for easier soldering and improved connection integrity on PCBs.

Packing Method: TR

The tape and reel (TR) packing method ensures efficient handling and easy automatic assembly in manufacturing processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm makes this latch suitable for both space-constrained applications and easy component placement.

Minimum fmax: 8 MHz

A minimum frequency maximum of 8 MHz ensures basic operations can be performed reliably in standard applications.

Maximum Supply Voltage (Vsup): 20 V

A maximum supply voltage of 20V allows this product to function effectively in high-voltage environments, increasing its versatility.

Technical Specifications

Latches & Flip-Flops HCF40174M013TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5/15

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

8 MHz

Trade Compliance

HCF40174M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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