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HCF4013BE

STMicroelectronics

HCF4013BE by STMicroelectronics

HCF4013BE by STMicroelectronics is a CMOS latches & flip-flops IC with 2 functions, 14 terminals, and 300 ns propagation delay. It operates b/w -40 to 85 °C, has a supply voltage range of 3-15V, and is commonly used in industrial applications requiring positive edge triggering.

Median Price

$2.360

Lifecycle Status

Suppliers In-Stock

35

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 1,553 parts In-Stock

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$2.360

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$0.973

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$2.360

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Digiode

USA . 4,316 parts In-Stock

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$2.242

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Vyrian

USA . 2,250 parts In-Stock

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$2.360

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American Microsemiconductor Inc.

USA . 40 parts In-Stock

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Anansix

USA . 2,667 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,613 parts In-Stock

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QIE Inc.

USA . 705 parts In-Stock

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J2 Sourcing AB

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EPE Components Inc.

USA . 400 parts In-Stock

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Bristol Electronics

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ECAB

Sweden . 232 parts In-Stock

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LWI Electronics Inc

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Fibra_Brandt Electronic GMBH

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Inland Empire Components Inc.

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Ashlea Components Ltd

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Q Components

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LittleDiode

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Lakeview Electronics

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Elcom Components

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GES GmbH

Germany . 27 parts In-Stock

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A2Z Electronics, Inc.

USA . 26 parts In-Stock

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Component Sense

UK . 22 parts In-Stock

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$7.748

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$7.748

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$7.748

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$7.748

Sinequanon

UK . 19 parts In-Stock

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DF Sales Co.

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DF Sales Co.

USA . 15 parts In-Stock

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Sunrise Surplus Inc.

USA . 12 parts In-Stock

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Resion

USA . 10 parts In-Stock

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First Choice Components Inc.

USA . 10 parts In-Stock

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R&J Components

USA . 8 parts In-Stock

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Electronics Depot

USA . 8 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

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Prism Electronics

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MISTER SPROCKETS

USA . 2 parts In-Stock

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Electronic Expediters

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Distributors (Availability)

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Corphita

USA . 258 parts In-Stock

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$2.124

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IDEA Electronic Components Group

UK . 2,142 parts In-Stock

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$17.810

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$16.029

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MKK Technologies

India . 644 parts In-Stock

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$33.491

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$33.491

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DigiPath Technology Company

USA . 644 parts In-Stock

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$33.491

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A-Z Elektronik GmbH

Germany . 5,799 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,866 parts In-Stock

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Parana Technologies

USA . 1,814 parts In-Stock

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$21.295

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Infinite Electronics LLP (Excess)

. 1,001 parts In-Stock

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Native Components

USA . 759 parts In-Stock

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Perfect Parts

USA . 455 parts In-Stock

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455

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Cyclops Electronics Ltd (Excess)

UK . 272 parts In-Stock

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Northwest PG Solutions

USA . 185 parts In-Stock

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Kepictronics

USA . 152 parts In-Stock

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Assy Fe

Spain . 3 parts In-Stock

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Overview

Enhance your electronic designs with the HCF4013BE by STMicroelectronics. With a reputation for high-quality components, STMicroelectronics delivers reliable latches & flip-flops that are essential in various applications. From industrial automation to consumer electronics, this product offers customers value by providing efficient performance and versatility. Trust STMicroelectronics to provide you with the tools you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the latch and flip-flop, ensuring longevity and reliability.

No. of Functions: 2

Having 2 functions in one component allows for more efficient use of space on a circuit board, reducing the overall footprint of the design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this latch and flip-flop compatible with most common electronic systems and power sources.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into existing circuits and systems, with a straightforward layout for connections.

Propagation Delay (tpd): 300 ns

The fast propagation delay of 300 ns ensures quick response times, making this latch and flip-flop suitable for high-speed applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85 °C allows this latch and flip-flop to function reliably in various environmental conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and noise immunity, making this latch and flip-flop energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops HCF4013BE attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Additional Features:

LG_MAX

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

Length:

20 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

300 ns

Maximum Seated Height:

5.1 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

12 MHz

Trade Compliance

HCF4013BE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-444-4300, 5962144444300

NIIN

144444300

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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