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BTB40-600

STMicroelectronics

BTB40-600 by STMicroelectronics

STMicroelectronics' BTB40-600 is a TRIAC with 1.6V max on-state voltage, 50mA max DC gate trigger current, and 350A non-repetitive peak on-state current. It features G-MT1-MT2 quick connects and has a max leakage current of 4mA. Ideal for TRIAC applications requiring up to 80mA max holding current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,877 parts In-Stock

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4,877

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Anansix

USA . 1,783 parts In-Stock

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1,783

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Digiode

USA . 244 parts In-Stock

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244

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,113 parts In-Stock

1+ parts

$2.329

100+ parts

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1k+ parts

$2.096

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2,113

$2.329

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$2.096

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MKK Technologies

India . 854 parts In-Stock

1+ parts

$4.379

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854

$4.379

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DigiPath Technology Company

USA . 854 parts In-Stock

1+ parts

$4.379

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854

$4.379

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Corphita

USA . 4,225 parts In-Stock

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4,225

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Parana Technologies

USA . 1,831 parts In-Stock

1+ parts

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$2.784

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1,831

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$2.784

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Northwest PG Solutions

USA . 876 parts In-Stock

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876

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Native Components

USA . 740 parts In-Stock

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740

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Overview

Unleash the power of efficiency with the BTB40-600 by STMicroelectronics. Crafted by a globally recognized leader in semiconductor technology, this TRIAC device offers unrivaled quality and reliability. Ideal for a wide range of applications, this product ensures seamless performance and optimal control. Experience the value of precision engineering and elevate your projects to new heights with the BTB40-600. Trust in STMicroelectronics to deliver excellence every time.

Feature Benefit Bullets

Maximum On-state Voltage: 1.6 V

The low on-state voltage ensures efficient operation and minimal power dissipation, making this product a cost-effective choice.

Maximum DC Gate Trigger Current: 50 mA

The low gate trigger current requirement allows for easy and reliable control of the TRIAC, enhancing the overall performance of the product.

Non Repetitive Peak On-state Current: 350 A

The high peak on-state current capability enables the product to handle heavy loads or transient surges effectively, making it a reliable choice for demanding applications.

Quick Connects Description: G-MT1-MT2

The quick connects feature allows for convenient installation and maintenance of the product, saving time and effort in handling the TRIAC.

Maximum Leakage Current: 4 mA

The low leakage current helps improve the overall efficiency and reliability of the product by reducing unnecessary power loss and ensuring stable performance.

Trigger Device Type: TRIAC

Being a TRIAC, this product offers bidirectional control of alternating current, making it suitable for a wide range of AC power applications.

Maximum Holding Current: 80 mA

The high holding current capability ensures the TRIAC remains in the on state even under varying load conditions, enhancing the product's stability and performance.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB40-600 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Maximum DC Gate Trigger Current:

50 mA

Quick Connects Description:

G-MT1-MT2

Screw Terminals Description:

0

Maximum Holding Current:

80 mA

Maximum Leakage Current:

4 mA

Non Repetitive Peak On-state Current:

350 A

No. of Elements:

1

Maximum On-state Voltage:

1.6 V

Sub-Category:

TRIACs

Trigger Device Type:

Trade Compliance

BTB40-600 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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