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BTB41-600B

STMicroelectronics

BTB41-600B by STMicroelectronics

STMicroelectronics' BTB41-600B is a TRIAC with 600V repetitive peak off-state voltage, 40A max RMS on-state current, and 100mA DC gate trigger current. Ideal for applications requiring precise AC power control in industrial equipment and lighting systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,340 parts In-Stock

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2,340

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Digiode

USA . 261 parts In-Stock

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261

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Vyrian

USA . 206 parts In-Stock

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206

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Fibra_Brandt Electronic GMBH

Germany . 200 parts In-Stock

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200

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ECAB

Sweden . 67 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$3.181

100+ parts

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$2.863

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1,433

$3.181

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$2.863

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MKK Technologies

India . 1,278 parts In-Stock

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$5.982

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$5.982

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DigiPath Technology Company

USA . 1,278 parts In-Stock

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$5.982

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1,278

$5.982

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A-Z Elektronik GmbH

Germany . 6,207 parts In-Stock

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Corphita

USA . 4,768 parts In-Stock

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4,768

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Alle Elektronik GmbH

Germany . 4,138 parts In-Stock

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Northwest PG Solutions

USA . 2,141 parts In-Stock

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Parana Technologies

USA . 1,481 parts In-Stock

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$3.804

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$3.804

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Native Components

USA . 178 parts In-Stock

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178

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Assy Fe

Spain . 112 parts In-Stock

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Kepictronics

USA . 80 parts In-Stock

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Overview

Discover the BTB41-600B by STMicroelectronics, a top-quality Triode For Alternating Current (TRIAC) that offers reliable performance and durability. Manufactured by industry-leading STMicroelectronics, this TRIAC is perfect for a wide range of applications. With a maximum RMS On-state current of 40 A and a repetitive peak off-state voltage of 600 V, this product ensures optimal functionality and efficiency. Whether you're in need of a TRIAC for industrial, commercial, or residential use, the BTB41-600B delivers exceptional value and benefits to customers looking for a high-performance solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the TRIAC, ensuring a longer lifespan.

Maximum DC Gate Trigger Current: 100 mA

Allows for efficient and reliable triggering of the TRIAC, ensuring consistent performance.

Configuration: SINGLE

Simplified design with single configuration makes installation and operation easier.

Package Shape: RECTANGULAR

Compact rectangular shape allows for easy integration into various electronic devices and circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during installation.

Maximum Leakage Current: 4 mA

Low leakage current ensures minimal power loss and enhances the efficiency of the TRIAC.

No. of Terminals: 3

Simplified three-terminal configuration for easy connectivity and compatibility with different circuit designs.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure and stable mounting of the TRIAC in various applications.

Maximum Operating Temperature: 110 °C

Wide operating temperature range enables the TRIAC to function effectively in different environmental conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4 quadrant logic level design allows for precise triggering and control over the TRIAC's conduction.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without compromising its performance and reliability.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and ensures secure electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and ensures proper connectivity.

Maximum RMS On-state Current: 40 A

High RMS on-state current rating enables the TRIAC to handle heavy loads without overheating.

Maximum DC Gate Trigger Voltage: 2.5 V

Low gate trigger voltage ensures efficient and reliable triggering of the TRIAC.

Case Connection: MAIN TERMINAL 2

Clear indication of the main terminal connection for easy installation and wiring.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage rating ensures reliable isolation and protection against voltage spikes.

Maximum Holding Current: 80 mA

High holding current allows the TRIAC to remain in the on-state even after the gate signal is removed.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB41-600B attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

100 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

80 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

4 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

40 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB41-600B Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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