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BTB41-700B

STMicroelectronics

BTB41-700B by STMicroelectronics

STMicroelectronics' BTB41-700B is a TRIAC with 700V repetitive peak off-state voltage, 45A max RMS on-state current, and 100mA DC gate trigger current. Ideal for applications requiring precise AC power control in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,980 parts In-Stock

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Vyrian

USA . 4,335 parts In-Stock

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4,335

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Anansix

USA . 1,134 parts In-Stock

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Pegasus Components GmbH

Germany . 121 parts In-Stock

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ECAB

Sweden . 15 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 721 parts In-Stock

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$2.339

100+ parts

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$2.105

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721

$2.339

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$2.105

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MKK Technologies

India . 211 parts In-Stock

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$4.398

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DigiPath Technology Company

USA . 211 parts In-Stock

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$4.398

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211

$4.398

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Parana Technologies

USA . 2,253 parts In-Stock

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$2.796

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$2.796

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Corphita

USA . 958 parts In-Stock

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Northwest PG Solutions

USA . 794 parts In-Stock

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Native Components

USA . 472 parts In-Stock

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Overview

Unlock the power of reliable and efficient electrical control with the BTB41-700B by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality products like this TRIAC that are ideal for a wide range of applications. From lighting control to motor speed regulation, this TRIAC offers exceptional value with its high performance and durability. Experience seamless operation and peace of mind knowing you have a trusted product at your disposal. Elevate your projects with the BTB41-700B and discover the difference it makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and insulation for the internal components, ensuring durability and reliability.

Maximum DC Gate Trigger Current: 100 mA

Allows for precise and efficient control of the triac's switching.

Configuration: SINGLE

Simplifies the setup and makes it easy to integrate into circuits.

Package Shape: RECTANGULAR

Facilitates easy mounting and placement in various electronic devices.

Terminal Form: THROUGH-HOLE

Enables secure and stable connections within a circuit.

Maximum Leakage Current: 4 mA

Ensures minimal power loss when the triac is in the off-state.

No. of Terminals: 3

Simplifies the wiring process and reduces complexity in circuit design.

Package Style (Meter): FLANGE MOUNT

Provides a sturdy and reliable mounting option for industrial applications.

Maximum Operating Temperature: 125 °C

Allows the triac to operate efficiently in a wide range of temperature conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Offers precise triggering and control for improved performance.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in low-temperature environments.

Terminal Position: SINGLE

Simplifies the installation process and reduces the risk of wiring errors.

Maximum RMS On-state Current: 45 A

Can handle high currents, making it suitable for heavy-duty applications.

Maximum DC Gate Trigger Voltage: 2.5 V

Requires low trigger voltage for switching, improving energy efficiency.

Repetitive Peak Off-state Voltage: 700 V

Provides a high voltage tolerance, suitable for various industrial applications.

Maximum Holding Current: 80 mA

Supports reliable holding of current in on-state, ensuring stable operation.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB41-700B attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Maximum DC Gate Trigger Current:

100 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

80 mA

JESD-30 Code:

R-PSFM-T3

Maximum Leakage Current:

4 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

45 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB41-700B Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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