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BTB04-400D

STMicroelectronics

BTB04-400D by STMicroelectronics

STMicroelectronics' BTB04-400D is a 4A TRIAC with 400V repetitive peak off-state voltage. It operates b/w -40 to 110 °C, with a max DC gate trigger current of 5mA and voltage of 2.5V. Ideal for applications requiring precise AC power control in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,928 parts In-Stock

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2,928

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Digiode

USA . 2,401 parts In-Stock

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Anansix

USA . 1,383 parts In-Stock

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1,383

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IDEA Electronic Components Group

UK . 206 parts In-Stock

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$2.035

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$1.832

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206

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$1.832

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MKK Technologies

India . 2,233 parts In-Stock

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$3.827

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$3.827

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DigiPath Technology Company

USA . 2,233 parts In-Stock

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$3.827

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$3.827

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Corphita

USA . 4,877 parts In-Stock

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Parana Technologies

USA . 857 parts In-Stock

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$2.433

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857

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Northwest PG Solutions

USA . 552 parts In-Stock

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552

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Perfect Parts

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Native Components

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FE SAS

France . 40 parts In-Stock

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Overview

Elevate your electrical projects with the BTB04-400D from STMicroelectronics, a top-quality TRIAC that guarantees reliability and performance. Manufactured by a trusted industry leader, this TRIAC is designed for a wide range of applications, offering customers exceptional value and benefits. With its durable construction and advanced features, this product ensures seamless operation and efficiency in various electronic systems. Upgrade your projects with the BTB04-400D and experience the advantages of superior quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the TRIAC, ensuring a longer lifespan.

Maximum DC Gate Trigger Current: 5 mA

Allows for precise control and triggering of the TRIAC, contributing to its reliability in various applications.

Configuration: SINGLE

Simplified design makes installation and integration easier, ideal for straightforward applications.

Package Shape: RECTANGULAR

Compact shape enables easy mounting and placement in electronic circuits or systems.

Terminal Form: THROUGH-HOLE

Ensures secure connections and stability in circuit board mounting, reducing the risk of disconnection or damage.

Maximum Leakage Current: 0.75 mA

Low leakage current minimizes power loss and enhances the efficiency of the TRIAC.

No. of Terminals: 3

Simplifies the connection process and reduces the complexity of wiring, making it user-friendly.

Package Style (Meter): FLANGE MOUNT

Enables easy mounting and secure attachment to surfaces, improving the stability of the TRIAC during operation.

Maximum Operating Temperature: 110 °C

Wide temperature range allows for versatility in various environmental conditions, ensuring reliable performance.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Specific trigger device type for efficient and accurate response in controlling AC current, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Supports operation in low-temperature environments, enhancing the TRIAC's versatility and usability.

Terminal Finish: MATTE TIN

Provides a reliable and durable terminal finish that resists corrosion and ensures long-lasting performance.

Terminal Position: SINGLE

Simplified terminal configuration for easy connection and integration with other components in the circuit.

Maximum RMS On-state Current: 4 A

High on-state current rating allows for the handling of substantial loads, making it suitable for a variety of power applications.

Maximum DC Gate Trigger Voltage: 2.5 V

Low trigger voltage requirement for gate triggering operations, offering energy efficiency and precise control.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage capability for reliable and safe operation in controlling AC power circuits.

Maximum Holding Current: 15 mA

Sufficient holding current to maintain the on-state of the TRIAC, ensuring stable performance under varying load conditions.

Reference Standard: UL RECOGNIZED

Compliance with UL standards ensures safety and reliability in electrical applications, providing peace of mind to users.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB04-400D attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

15 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.75 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB04-400D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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