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BTB04-400T

STMicroelectronics

BTB04-400T by STMicroelectronics

STMicroelectronics' BTB04-400T is a 4A TRIAC with 400V repetitive peak off-state voltage. It operates b/w -40 to 110 °C, suitable for various AC applications. Featuring a max DC gate trigger current of 5mA, it is UL recognized and ideal for controlling power in industrial systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,566 parts In-Stock

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4,566

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Vyrian

USA . 2,402 parts In-Stock

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2,402

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Anansix

USA . 351 parts In-Stock

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351

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ECAB

Sweden . 50 parts In-Stock

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50

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,507 parts In-Stock

1+ parts

$3.935

100+ parts

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$3.541

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1,507

$3.935

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$3.541

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MKK Technologies

India . 1,689 parts In-Stock

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$7.399

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1,689

$7.399

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DigiPath Technology Company

USA . 1,689 parts In-Stock

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$7.399

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1,689

$7.399

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Parana Technologies

USA . 1,084 parts In-Stock

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$4.705

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1,084

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$4.705

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Northwest PG Solutions

USA . 972 parts In-Stock

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972

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Native Components

USA . 513 parts In-Stock

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513

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Corphita

USA . 364 parts In-Stock

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364

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Overview

Discover the BTB04-400T by STMicroelectronics, a top-quality TRIAC perfect for various applications. Manufactured by industry leader STMicroelectronics, this TRIAC offers reliable performance and durability. With a maximum RMS on-state current of 4A and repetitive peak off-state voltage of 400V, this product provides exceptional value and benefits to customers looking for high-quality components. Ideal for a range of uses, this TRIAC is a versatile choice for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum DC Gate Trigger Current: 5 mA

Allows for precise control and triggering of the TRIAC, enhancing the performance of the product.

Configuration: SINGLE

Simplified design with a single configuration makes it easy to integrate into various electronic systems.

Package Shape: RECTANGULAR

Compact shape allows for easy mounting and installation in limited spaces.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and connection to other electronic components.

Maximum Leakage Current: 0.75 mA

Low leakage current ensures energy efficiency and prevents unnecessary power loss.

No. of Terminals: 3

Provides necessary connections for effective operation of the TRIAC.

Package Style (Meter): FLANGE MOUNT

Allows for secure mounting and stability in different applications.

Maximum Operating Temperature: 110 °C

Can withstand high temperatures, suitable for a wide range of operating environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Offers efficient triggering and control capabilities for various alternating current applications.

Minimum Operating Temperature: -40 °C

Capable of operating in cold temperatures without compromising performance.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant terminal finish for long-term use.

Terminal Position: SINGLE

Simplified terminal configuration for easy connection to external circuits.

Maximum RMS On-state Current: 4 A

Capable of handling high currents, making it suitable for various electrical loads.

Maximum DC Gate Trigger Voltage: 2.5 V

Low trigger voltage requirement for efficient control and operation.

Repetitive Peak Off-state Voltage: 400 V

Can handle high off-state voltages, ensuring reliable performance in different applications.

Minimum Critical Rate of Rise of Commutation Voltage: 1 V/us

Fast rate of rise ensures quick and efficient switching between on and off states.

Minimum Critical Rate of Rise of Off-state Voltage: 10 V/us

Quick rate of rise minimizes the risk of voltage spikes and ensures stable operation.

Maximum Holding Current: 15 mA

Sufficient holding current for maintaining the on-state without triggering unintentionally.

Reference Standard: UL RECOGNIZED

Compliance with safety standards for reliable and safe operation in various applications.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB04-400T attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

1 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

10 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

15 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.75 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB04-400T Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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