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BTB04-400T/F3

STMicroelectronics

BTB04-400T/F3 by STMicroelectronics

STMicroelectronics BTB04-400T/F3 is a TRIAC with 400V repetitive peak off-state voltage, 4A max RMS on-state current, and 5mA max DC gate trigger current. It's used in applications requiring AC power control like dimmers and motor speed controllers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,345 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,345

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Digiode

USA . 1,842 parts In-Stock

1+ parts

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-

1k+ parts

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1,842

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Vyrian

USA . 74 parts In-Stock

1+ parts

-

100+ parts

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74

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,265 parts In-Stock

1+ parts

$2.927

100+ parts

-

1k+ parts

$2.634

10k+ parts

-

2,265

$2.927

-

$2.634

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Native Components

USA . 562 parts In-Stock

1+ parts

$5.280

100+ parts

-

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-

10k+ parts

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562

$5.280

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MKK Technologies

India . 1,560 parts In-Stock

1+ parts

$5.503

100+ parts

-

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1,560

$5.503

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DigiPath Technology Company

USA . 1,560 parts In-Stock

1+ parts

$5.503

100+ parts

-

1k+ parts

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1,560

$5.503

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-

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Corphita

USA . 1,095 parts In-Stock

1+ parts

-

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1,095

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Parana Technologies

USA . 621 parts In-Stock

1+ parts

-

100+ parts

$3.499

1k+ parts

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621

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$3.499

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Northwest PG Solutions

USA . 205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.174

10k+ parts

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205

-

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$5.174

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Overview

Unlock the power of efficient and reliable electrical control with the STMicroelectronics BTB04-400T/F3 TRIAC. Crafted by a trusted manufacturer known for quality, this versatile component is designed to optimize performance in a variety of applications. Whether you're looking to enhance lighting systems, motor control, or heating equipment, this TRIAC delivers unmatched value, benefits, and advantages to meet your specific needs. Trust in STMicroelectronics to provide the innovation and precision you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the TRIAC, ensuring long-term reliability.

Maximum DC Gate Trigger Current: 5 mA

Low gate trigger current requirement enables efficient and reliable triggering of the TRIAC, leading to energy savings and improved performance.

Configuration: SINGLE

SINGLE configuration simplifies installation and wiring of the TRIAC, making it user-friendly and easy to integrate into electronic circuits.

Surface Mount: YES

Surface mount capability allows for easy and space-efficient mounting on PCBs, saving valuable board space and enhancing design flexibility.

Package Shape: RECTANGULAR

RECTANGULAR shape provides versatility in placement and mounting options, making the TRIAC suitable for various electronic applications.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Low off-state leakage current ensures minimal power consumption and heat generation when the TRIAC is in the off-state, enhancing energy efficiency.

No. of Terminals: 2

2 terminals simplify connectivity and wiring requirements, making the TRIAC easy to incorporate into electronic circuits and systems.

Package Style (Meter): FLANGE MOUNT

FLANGE MOUNT package style enables secure and stable mounting of the TRIAC, ensuring reliability and longevity in various operating conditions.

Maximum Operating Temperature: 110 °C

High maximum operating temperature tolerance allows the TRIAC to function effectively in demanding environments without the risk of overheating or performance degradation.

Trigger Device Type: TRIAC

TRIAC trigger device type provides efficient and precise control over switching operations, making the TRIAC suitable for a wide range of AC applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance even in harsh and extreme cold environments, making the TRIAC versatile and resilient.

Maximum RMS On-state Current: 4 A

High on-state current rating allows the TRIAC to handle moderate to high power loads with efficiency and reliability, making it ideal for various AC switching applications.

Maximum DC Gate Trigger Voltage: 1.5 V

Low gate trigger voltage requirement ensures efficient and responsive triggering of the TRIAC, leading to precise control and operation in electronic circuits.

Case Connection: MAIN TERMINAL 2

MAIN TERMINAL 2 case connection provides a secure and reliable electrical connection point for the TRIAC, ensuring stable performance and operation in different applications.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage rating allows the TRIAC to withstand voltage spikes and surges, enhancing its durability and reliability in AC switching operations.

Maximum Holding Current: 15 mA

High holding current capability ensures stable and secure latching of the TRIAC in the on-state, preventing unintentional switching or tripping for consistent performance.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB04-400T/F3 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

15 mA

JESD-30 Code:

R-PSFM-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

400 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB04-400T/F3 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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