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BTB04-400S/F5

STMicroelectronics

BTB04-400S/F5 by STMicroelectronics

STMicroelectronics BTB04-400S/F5 is a TRIAC with 400V repetitive peak off-state voltage, 4A max RMS on-state current, and 1.5V max DC gate trigger voltage. It's used in applications requiring AC power control like dimmers and motor speed controllers due to its single configuration and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,782 parts In-Stock

1+ parts

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3,782

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Anansix

USA . 2,539 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,539

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Vyrian

USA . 193 parts In-Stock

1+ parts

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193

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 755 parts In-Stock

1+ parts

$3.001

100+ parts

-

1k+ parts

$2.701

10k+ parts

-

755

$3.001

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$2.701

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MKK Technologies

India . 1,997 parts In-Stock

1+ parts

$5.643

100+ parts

-

1k+ parts

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10k+ parts

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1,997

$5.643

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DigiPath Technology Company

USA . 1,997 parts In-Stock

1+ parts

$5.643

100+ parts

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10k+ parts

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1,997

$5.643

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Northwest PG Solutions

USA . 1,473 parts In-Stock

1+ parts

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1,473

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Parana Technologies

USA . 1,020 parts In-Stock

1+ parts

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100+ parts

$3.588

1k+ parts

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1,020

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$3.588

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Corphita

USA . 735 parts In-Stock

1+ parts

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735

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Native Components

USA . 385 parts In-Stock

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385

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Overview

Enhance your electronic devices with the BTB04-400S/F5 by STMicroelectronics, a top-of-the-line TRIAC that guarantees quality and reliability. With a reputation for excellence in the industry, STMicroelectronics delivers unparalleled performance in their products, making them a trusted choice for professionals worldwide. Ideal for various applications, this TRIAC offers customers exceptional value, benefits, and advantages, ensuring seamless operation and efficiency. Upgrade your projects with the BTB04-400S/F5 and experience the difference in performance and quality today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, making it easier to handle and less prone to damage during transportation or installation.

Maximum DC Gate Trigger Current: 10 mA

The low maximum DC gate trigger current allows for efficient triggering of the device, ensuring reliable performance and reducing the risk of false triggering.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it easier to integrate the product into various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-saving design, allowing for easy mounting and integration into tight spaces.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure and reliable connections, reducing the risk of loose connections or signal interference.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

The low maximum repetitive peak off-state leakage current minimizes power loss and improves energy efficiency, making the product cost-effective and environmentally friendly.

No. of Terminals: 3

The three terminals provide flexibility in connection options, allowing for versatile use in different circuit configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy and secure mounting, ensuring stability and reliability in various operating conditions.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions, making it suitable for a wide range of industrial applications.

Trigger Device Type: TRIAC

The TRIAC trigger device type provides precise control and switching capabilities, making the product ideal for applications requiring high performance and accuracy.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments, expanding its usability across different temperature ranges.

Terminal Position: SINGLE

The single terminal position simplifies the connection process and ensures consistent performance, making it easier to use for both professionals and DIY enthusiasts.

Maximum RMS On-state Current: 4 A

The high maximum RMS on-state current rating enables the product to handle heavy loads, making it suitable for demanding applications that require high power output.

Maximum DC Gate Trigger Voltage: 1.5 V

The low maximum DC gate trigger voltage reduces power consumption and enhances efficiency, making the product cost-effective and environmentally friendly.

Repetitive Peak Off-state Voltage: 400 V

The high repetitive peak off-state voltage rating ensures reliable operation and protection against voltage spikes, making the product durable and long-lasting.

Minimum Critical Rate of Rise of Off-state Voltage: 10 V/us

The minimum critical rate of rise of off-state voltage protects the device from voltage surges and ensures stable performance in dynamic electrical environments.

Maximum Holding Current: 25 mA

The high maximum holding current ensures the device remains in the on-state even in the absence of a gate signal, providing continuous operation and reliability.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB04-400S/F5 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

10 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

25 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

400 V

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB04-400S/F5 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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