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BTB04-400T/F5

STMicroelectronics

BTB04-400T/F5 by STMicroelectronics

STMicroelectronics' BTB04-400T/F5 is a TRIAC with 400V repetitive peak off-state voltage, 4A max RMS on-state current, and 5mA max DC gate trigger current. It is used in applications requiring AC power control like dimmers and motor speed controllers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,419 parts In-Stock

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3,419

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Anansix

USA . 654 parts In-Stock

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654

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Vyrian

USA . 388 parts In-Stock

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388

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,093 parts In-Stock

1+ parts

$2.246

100+ parts

-

1k+ parts

$2.021

10k+ parts

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2,093

$2.246

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$2.021

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Northwest PG Solutions

USA . 1,021 parts In-Stock

1+ parts

$2.574

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1,021

$2.574

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MKK Technologies

India . 811 parts In-Stock

1+ parts

$4.223

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811

$4.223

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DigiPath Technology Company

USA . 811 parts In-Stock

1+ parts

$4.223

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811

$4.223

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Parana Technologies

USA . 2,096 parts In-Stock

1+ parts

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$2.685

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2,096

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$2.685

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Native Components

USA . 650 parts In-Stock

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$2.270

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650

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$2.270

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Corphita

USA . 309 parts In-Stock

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309

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Overview

Unlock the power of efficient and reliable electrical control with the BTB04-400T/F5 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality TRIAC components that are ideal for a wide range of applications. From lighting control to motor speed regulation, this TRIAC offers unmatched performance, durability, and precision. Experience seamless operation and peace of mind knowing that you have a trusted product that will meet your needs with ease. Choose STMicroelectronics for superior quality and exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Maximum DC Gate Trigger Current: 5 mA

Allows for precise control of the triac, ensuring stable performance and accurate switching.

Configuration: SINGLE

Simplified design with a single configuration makes installation and setup easy and straightforward.

Package Shape: RECTANGULAR

Compact rectangular shape allows for efficient placement and mounting within electronic devices or circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during installation.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Low leakage current ensures minimal power wastage and helps in energy-efficient operation.

No. of Terminals: 3

Simplified three-terminal setup for easy integration into circuit designs.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure attachment to other components or surfaces, enhancing stability.

Maximum Operating Temperature: 110 °C

Wide operating temperature range ensures the product can function effectively in various environments.

Trigger Device Type: TRIAC

Triac type trigger device offers efficient switching capabilities for AC circuits, making the product versatile.

Minimum Operating Temperature: -40 °C

Operational at low temperatures, enabling use in cold environments without compromising performance.

Terminal Position: SINGLE

Single terminal position simplifies installation and wiring procedures, reducing complexity.

Maximum RMS On-state Current: 4 A

High on-state current allows the product to handle heavier loads efficiently and safely.

Maximum DC Gate Trigger Voltage: 1.5 V

Low trigger voltage requirement ensures compatibility with various control circuits and devices.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage rating provides robust insulation and protection against voltage spikes.

Maximum Holding Current: 15 mA

Higher holding current capacity ensures the triac remains in the on-state reliably during operation.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB04-400T/F5 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

15 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

400 V

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB04-400T/F5 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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