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ACS102-5T1

STMicroelectronics

ACS102-5T1 by STMicroelectronics

ACS102-5T1 by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max DC gate trigger current of 5 mA, non-repetitive peak on-state current of 8 A, and operates b/w -30 °C to 125°C. Ideal for compact surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 3,600 parts In-Stock

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3,600

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Digiode

USA . 2,881 parts In-Stock

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2,881

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Anansix

USA . 2,764 parts In-Stock

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2,764

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Vyrian

USA . 2,603 parts In-Stock

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2,603

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ComSIT Distribution GmbH

Germany . 2,025 parts In-Stock

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2,025

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ComSIT USA

USA . 2,025 parts In-Stock

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2,025

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ECAB

Sweden . 1,765 parts In-Stock

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1,765

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 326 parts In-Stock

1+ parts

$4.202

100+ parts

-

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$3.781

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326

$4.202

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$3.781

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MKK Technologies

India . 1,653 parts In-Stock

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$7.901

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1,653

$7.901

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DigiPath Technology Company

USA . 1,653 parts In-Stock

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$7.901

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1,653

$7.901

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AZTECH Wire

Italy . 927 parts In-Stock

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$20.790

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927

$20.790

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Perfect Parts

USA . 7,768 parts In-Stock

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7,768

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,889 parts In-Stock

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Parana Technologies

USA . 1,028 parts In-Stock

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$5.024

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1,028

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$5.024

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Northwest PG Solutions

USA . 765 parts In-Stock

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$3.410

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765

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$3.410

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Native Components

USA . 28 parts In-Stock

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$3.376

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28

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$3.376

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Overview

Elevate your projects with the ACS102-5T1 TRIAC from STMicroelectronics, a trusted leader in innovation. This high-quality component ensures reliable performance and seamless integration into various applications such as lighting control, motor management, and HVAC systems. Its compact design and built-in trigger element simplify installations while offering robust protection against voltage spikes. Experience enhanced efficiency and durability—choose ACS102-5T1 for your next design challenge!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent insulation and protects the internal components, making this TRIAC suitable for a variety of applications.

Maximum DC Gate Trigger Current: 5 mA

With a low gate trigger current, this TRIAC can be easily driven by low-power control circuits, enhancing energy efficiency.

Configuration: SINGLE WITH BUILT-IN TRIGGER ELEMENT IN SERIES WITH GATE

This configuration simplifies circuit design by integrating the triggering mechanism, thus reducing component count and improving reliability.

Non Repetitive Peak On-state Current: 8 A

The ability to handle high non-repetitive peak currents makes this TRIAC ideal for applications subjected to transient loads.

Surface Mount: YES

Being surface mount compatible allows for compact circuit designs and automated assembly processes, leading to reduced manufacturing costs.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on circuit boards, enabling more compact designs.

Terminal Form: GULL WING

The gull wing terminal form ensures strong mechanical and electrical connections, enhancing stability in various mounting environments.

Maximum On-state Current: 0.2 A

A maximum on-state current of 0.2 A allows it to perform effectively in low-power applications without overheating.

No. of Terminals: 8

The 8-terminal design facilitates versatile connections, making this TRIAC suitable for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes efficient board space usage, which is crucial for modern electronic devices.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures reliability and performance in higher-temperature environments.

Trigger Device Type: SNUBBERLESS TRIAC

Being a snubberless TRIAC means reduced power loss and improved efficiency, making it ideal for light dimming and motor control applications.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, this TRIAC can be used in applications in colder climates without performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal position provides flexible connection options within circuit designs, enhancing adaptability.

Maximum RMS On-state Current: 0.2 A

With a maximum RMS on-state current of 0.2 A, this TRIAC is well-suited for low-power switching applications.

Maximum DC Gate Trigger Voltage: 0.9 V

A low DC gate trigger voltage allows for simpler control circuitry, making it easier to implement in various designs.

Repetitive Peak Off-state Voltage: 500 V

The high repetitive peak off-state voltage capability makes this TRIAC ideal for use in high-voltage applications, ensuring durability against voltage spikes.

Technical Specifications

Triode For Alternating Current (TRIAC) ACS102-5T1 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

WITH BUILT IN CLAMPING STRUCTURE AND GATE LEVEL SHIFTER DRIVER

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

.9 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Non Repetitive Peak On-state Current:

8 A

No. of Elements:

1

No. of Terminals:

8

Maximum On-state Current:

.2 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.2 A

Repetitive Peak Off-state Voltage:

500 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

ACS102-5T1 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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