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ACS108-5SN-TR

STMicroelectronics

ACS108-5SN-TR by STMicroelectronics

ACS108-5SN-TR by STMicroelectronics is a TRIAC designed for AC control applications. It features a max RMS on-state current of 0.8 A, non-repetitive peak on-state current of 8 A, and operates b/w -30 °C to 125°C. Ideal for compact surface mount designs with built-in trigger elements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,283 parts In-Stock

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Digiode

USA . 2,230 parts In-Stock

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2,230

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Anansix

USA . 387 parts In-Stock

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387

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Distributors (Availability)

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Native Components

USA . 102 parts In-Stock

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$0.968

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102

$0.968

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Northwest PG Solutions

USA . 1,452 parts In-Stock

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$1.065

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$1.065

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IDEA Electronic Components Group

UK . 1,358 parts In-Stock

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$3.916

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$3.524

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$3.916

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$3.524

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MKK Technologies

India . 461 parts In-Stock

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$7.363

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461

$7.363

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DigiPath Technology Company

USA . 461 parts In-Stock

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$7.363

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461

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Metaverse IC Inc.

Canada . 88,168 parts In-Stock

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Kepictronics

USA . 27,860 parts In-Stock

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27,860

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Corphita

USA . 2,791 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,246 parts In-Stock

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$4.682

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$4.682

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Overview

Unlock seamless control with the ACS108-5SN-TR by STMicroelectronics, a premium TRIAC designed for reliability and efficiency. Renowned for its top-tier quality and innovative engineering, STMicroelectronics ensures this compact solution excels in applications from household appliances to industrial automation. Enjoy exceptional performance with minimal energy loss, making your designs smarter and more sustainable. Elevate your projects with trusted technology that stands the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures reliability and longevity in various applications.

Maximum DC Gate Trigger Current: 10 mA

A low trigger current requirement enhances energy efficiency and compatibility with low-power circuits.

Configuration: SINGLE WITH BUILT-IN TRIGGER ELEMENT IN SERIES WITH GATE

This configuration simplifies circuit design and reduces the need for additional components.

Non Repetitive Peak On-state Current: 8 A

Handles high peak currents, making it suitable for applications that require robust performance during transient events.

Surface Mount: YES

Surface mount technology enables compact designs and efficient automated assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCB layouts.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability, ensuring strong connections and reliability.

Maximum On-state Current: 0.8 A

Handles moderate currents, ideal for controlling loads in many common applications.

No. of Terminals: 4

The four-terminal configuration allows for versatile circuit designs and simplified connections.

Package Style (Meter): SMALL OUTLINE

The small outline package facilitates efficient use of space in compact electronic devices.

Maximum Operating Temperature: 125 °C

A higher operating temperature rating ensures reliability in thermal challenging environments.

Trigger Device Type: TRIAC

Utilizing TRIAC technology offers bidirectional control of current, making it suitable for AC applications.

Minimum Operating Temperature: -30 °C

This low operating temperature range allows use in cold or outdoor environments without performance degradation.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and corrosion resistance, prolonging product life.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility on circuit boards.

Maximum RMS On-state Current: 0.8 A

With a maximum RMS on-state current of 0.8 A, this TRIAC is suitable for a variety of load control applications.

Maximum DC Gate Trigger Voltage: 1 V

A low gate trigger voltage minimizes power loss and improves circuit efficiency.

Repetitive Peak Off-state Voltage: 500 V

This high off-state voltage allows the TRIAC to be used in high-voltage applications, ensuring versatility.

Technical Specifications

Triode For Alternating Current (TRIAC) ACS108-5SN-TR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

WITH BUILT IN CLAMPING STRUCTURE AND GATE LEVEL SHIFTER DRIVER

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Non Repetitive Peak On-state Current:

8 A

No. of Elements:

1

No. of Terminals:

4

Maximum On-state Current:

.8 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

500 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

ACS108-5SN-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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