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ACS102-5T1-TR

STMicroelectronics

ACS102-5T1-TR by STMicroelectronics

ACS102-5T1-TR by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max DC gate trigger current of 5 mA, non-repetitive peak on-state current of 8 A, and operates b/w -30 °C to 125°C. Ideal for compact surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,325 parts In-Stock

1+ parts

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8,325

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Anansix

USA . 2,700 parts In-Stock

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2,700

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Digiode

USA . 1,941 parts In-Stock

1+ parts

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1,941

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ECAB

Sweden . 1,690 parts In-Stock

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1,690

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,272 parts In-Stock

1+ parts

$2.767

100+ parts

-

1k+ parts

$2.491

10k+ parts

-

1,272

$2.767

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$2.491

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MKK Technologies

India . 2,369 parts In-Stock

1+ parts

$5.204

100+ parts

-

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2,369

$5.204

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DigiPath Technology Company

USA . 2,369 parts In-Stock

1+ parts

$5.204

100+ parts

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2,369

$5.204

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Native Components

USA . 810 parts In-Stock

1+ parts

$6.208

100+ parts

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810

$6.208

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AZTECH Wire

Italy . 1,050 parts In-Stock

1+ parts

$15.010

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1,050

$15.010

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Corphita

USA . 3,952 parts In-Stock

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3,952

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Northwest PG Solutions

USA . 2,287 parts In-Stock

1+ parts

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$6.084

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2,287

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$6.084

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A-Z Elektronik GmbH

Germany . 2,160 parts In-Stock

1+ parts

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2,160

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Alle Elektronik GmbH

Germany . 1,440 parts In-Stock

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1,440

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Parana Technologies

USA . 466 parts In-Stock

1+ parts

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$3.309

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466

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$3.309

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Overview

Unlock the potential of your applications with the ACS102-5T1-TR from STMicroelectronics, a premier choice in TRIAC technology. Renowned for their exceptional quality and reliability, STMicroelectronics delivers unmatched performance that enhances your designs. This compact, surface-mount device excels in controlling AC loads with ease, offering robust thermal management and minimal power loss. Elevate your projects with a trusted solution that promises efficiency and longevity, ensuring you stand out in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for diverse applications.

Maximum DC Gate Trigger Current: 5 mA

A low gate trigger current makes this TRIAC energy-efficient, allowing it to operate effectively without requiring significant power input.

Configuration: SINGLE WITH BUILT-IN TRIGGER ELEMENT IN SERIES WITH GATE

This configuration simplifies circuit design and integration, providing reliability and reduced component count in the application.

Non Repetitive Peak On-state Current: 8 A

A high non-repetitive peak on-state current enables the TRIAC to handle brief surges in current, enhancing its robustness in dynamic circuit conditions.

Surface Mount: YES

Being surface mount compatible provides flexibility in design and saves space on printed circuit boards, making it ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, facilitating easier layout and integration into compact designs.

Terminal Form: GULL WING

Gull wing terminals promote soldering ease and reliability, which is vital for ensuring a robust connection and preventing mechanical stress.

Maximum On-state Current: 0.2 A

A manageable maximum on-state current allows for precise control in low-power applications, making it suitable for various electronic switching operations.

No. of Terminals: 8

With 8 terminals, the product offers versatility in connection options, facilitating easy integration into circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact installations, contributing to space efficiency in modern electronic devices.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and performance in demanding environments, extending the product's lifespan.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design minimizes electrical noise and improves reliability in applications where transient voltage spikes might occur.

Minimum Operating Temperature: -30 °C

A low minimum operating temperature allows the product to function effectively in cold environments, expanding its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes improve corrosion resistance and ensure better electrical connectivity, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates flexibility in PCB design and simplifies routing, making it easier to incorporate into various layouts.

Maximum RMS On-state Current: 0.2 A

A steady maximum RMS on-state current capability ensures consistent performance in AC applications, making it a reliable choice for controlling loads.

Maximum DC Gate Trigger Voltage: 0.9 V

A low trigger voltage enhances power efficiency and allows compatibility with low-voltage circuits, facilitating its use in a wide range of devices.

Repetitive Peak Off-state Voltage: 500 V

A high repetitive peak off-state voltage ensures the TRIAC can withstand significant voltage without failure, making it suitable for use in high-voltage applications.

Technical Specifications

Triode For Alternating Current (TRIAC) ACS102-5T1-TR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

WITH BUILT IN CLAMPING STRUCTURE AND GATE LEVEL SHIFTER DRIVER

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

.9 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Non Repetitive Peak On-state Current:

8 A

No. of Elements:

1

No. of Terminals:

8

Maximum On-state Current:

.2 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.2 A

Repetitive Peak Off-state Voltage:

500 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

ACS102-5T1-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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