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5962-8751502JA

STMicroelectronics

5962-8751502JA by STMicroelectronics

5962-8751502JA by STMicroelectronics is a military-grade EPROM with a 5V supply, featuring asynchronous operation and a max access time of 55 ns. It has an organization of 8Kx8 and operates in extreme temperatures from -55 °C to 125°C. Ideal for reliable data storage in defense applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,643 parts In-Stock

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Anansix

USA . 1,366 parts In-Stock

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1,366

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Vyrian

USA . 474 parts In-Stock

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Freelance Electronics

USA . 3 parts In-Stock

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NAC Semi

USA . 1 parts In-Stock

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Native Components

USA . 382 parts In-Stock

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$0.265

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$0.254

382

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Northwest PG Solutions

USA . 2,209 parts In-Stock

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$0.291

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$0.257

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$0.291

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$0.257

IDEA Electronic Components Group

UK . 1,788 parts In-Stock

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$3.343

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$3.009

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1,788

$3.343

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$3.009

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MKK Technologies

India . 2,024 parts In-Stock

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$6.287

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$6.287

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DigiPath Technology Company

USA . 2,024 parts In-Stock

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$6.287

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$6.287

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Corphita

USA . 3,800 parts In-Stock

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Supply Digital

USA . 2,622 parts In-Stock

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Parana Technologies

USA . 1,708 parts In-Stock

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$3.997

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$3.997

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Overview

Elevate your projects with the STMicroelectronics 5962-8751502JA EPROM, a superior choice for those demanding reliability and performance. Crafted from high-quality ceramic and glass-sealed materials, this military-grade component excels in extreme conditions, ensuring durability even at -55 °C to 125°C. Ideal for aerospace, defense, and industrial applications, it offers fast access times and robust data retention, delivering unmatched value and peace of mind for engineers and designers alike.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package offers enhanced durability and protection against environmental factors, making it suitable for military and aerospace applications.

Screening Level: 38535Q/M; 38534H; 883B

High screening levels ensure reliability and performance in critical applications, meeting stringent military standards.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs and simplifies mounting processes.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides faster access times and simpler interfacing in various digital circuits.

Input/Output Type: COMMON

Common I/O type facilitates compatibility with a wide range of devices and reduces complexity in design.

Nominal Supply Voltage / Vsup: 5V

Standard supply voltage ensures easy integration with common power supplies in digital systems.

Power Supplies: 5V

Stable power supply simplifies design considerations and promotes better reliability in end applications.

No. of Terminals: 24

The 24 terminals provide ample I/O options while keeping the package compact, making it suitable for various design needs.

Package Style (Meter): IN-LINE, WINDOW

The in-line package style with a window enables easy access for UV erasure, enhancing usability in prototype and production environments.

Maximum Operating Temperature: 125 °C

High operating temperature limit allows for use in extreme conditions, making it ideal for military applications.

Organization: 8K x 8

This memory organization offers efficient data storage for applications requiring moderate memory capacity.

Output Characteristics: 3-STATE

3-state output characteristics allow easy interfacing with multiple devices and help in reducing bus contention.

Minimum Operating Temperature: -55 °C

Low operating temperature range ensures reliable performance in harsh environments, making it suitable for military and aerospace use.

Terminal Finish: TIN LEAD

Tin-lead terminal finish improves solderability and reliability in connections, especially in high-reliability applications.

Terminal Position: DUAL

Dual terminal position enhances the mounting flexibility, making it easier to fit into various PCB layouts.

Maximum Seated Height: 5.72 mm

Compact height ensures compatibility with low-profile designs while still providing robust performance.

Width: 15.24 mm

This width provides a compact footprint, allowing efficient use of available space on the circuit board.

Minimum Supply Voltage (Vsup): 4.5V

Lower supply voltage requirement enhances versatility in power supply design and integration.

Length: 32.135 mm

This length is optimal for maintaining a balanced design without compromising on performance or connectivity.

Temperature Grade: MILITARY

Military-grade temperature specs ensure reliability in extreme conditions, making this product a top choice for defense sectors.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient for various applications.

Parallel or Serial: PARALLEL

Parallel operation enables faster data transfer rates for applications requiring quick access to memory.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances durability and is a preferred choice for high-reliability applications.

No. of Words: 8192 words

With 8192 words of storage, it is suitable for data-intensive applications requiring reasonable memory capacity.

Memory Width: 8

An 8-bit memory width balances performance and resource allocation, meeting common design needs.

Terminal Pitch: 2.54 mm

2.54 mm terminal pitch provides compatibility with standard PCB layouts, facilitating easier integration.

No. of Words Code: 8K

Having 8K words of code allows for effective programming and storage of reusable data in embedded systems.

Maximum Supply Voltage (Vsup): 5.5V

The maximum supply voltage supports flexibility for variations in power supply circuits.

Memory Density: 65536 bit

With a memory density of 65536 bits, it is ideal for applications requiring significant data handling capabilities.

Memory IC Type: UVPROM

UVPROM type memory allows for easy reprogrammability, catering to dynamic application requirements.

Maximum Access Time: 55 ns

Fast access time of 55 ns enables quick read and write operations, essential for high-performance computing tasks.

Technical Specifications

EPROM 5962-8751502JA attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T24

JESD-609 Code:

e0

Length:

32.135 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.72 mm

Sub-Category:

EPROMs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

5962-8751502JA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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