Loading...

5962-87515023A

STMicroelectronics

5962-87515023A by STMicroelectronics

5962-87515023A by STMicroelectronics is a military-grade EPROM with a ceramic, metal-sealed package. It operates asynchronously at 5V, features an access time of 55 ns, and supports temperatures from -55 °C to 125°C. Ideal for reliable data storage in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

5962-87515023A by STMicroelectronics
Compare Share

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,288

-

-

-

-

Anansix

USA . 2,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,257

-

-

-

-

Vyrian

USA . 164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

164

-

-

-

-

Sunrise Surplus Inc.

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 764 parts In-Stock

1+ parts

$1.312

100+ parts

-

1k+ parts

-

10k+ parts

-

764

$1.312

-

-

-

Northwest PG Solutions

USA . 278 parts In-Stock

1+ parts

$1.443

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$1.443

-

-

-

IDEA Electronic Components Group

UK . 1,299 parts In-Stock

1+ parts

$5.491

100+ parts

-

1k+ parts

$4.942

10k+ parts

-

1,299

$5.491

-

$4.942

-

MKK Technologies

India . 2,094 parts In-Stock

1+ parts

$10.325

100+ parts

-

1k+ parts

-

10k+ parts

-

2,094

$10.325

-

-

-

DigiPath Technology Company

USA . 2,094 parts In-Stock

1+ parts

$10.325

100+ parts

-

1k+ parts

-

10k+ parts

-

2,094

$10.325

-

-

-

Corphita

USA . 4,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,246

-

-

-

-

Parana Technologies

USA . 1,619 parts In-Stock

1+ parts

-

100+ parts

$6.565

1k+ parts

-

10k+ parts

-

1,619

-

$6.565

-

-

Overview

Unlock unparalleled reliability and performance with the 5962-87515023A EPROM by STMicroelectronics. Renowned for excellence, STMicroelectronics combines cutting-edge technology with military-grade quality, ensuring this product meets the highest standards. Ideal for mission-critical applications, this ceramic, metal-sealed component thrives in extreme environments, delivering consistent performance from -55 °C to 125°C. Enhance your designs with trust, durability, and superior efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This robust packaging offers excellent durability and protection against environmental factors, ensuring reliability in harsh conditions.

Surface Mount: YES

Surface mount technology allows for more efficient use of board space and improved manufacturability, making it suitable for compact designs.

Package Shape: RECTANGULAR

A rectangular shape facilitates easy integration into various circuit layouts, promoting versatile application.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster data access without needing a clock signal, increasing operational efficiency.

Nominal Supply Voltage / Vsup: 5V

Standard operating voltage simplifies design requirements and makes it compatible with common power supplies.

No. of Terminals: 28

With 28 terminals, this IC provides ample connectivity options for various interfacing needs in complex applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging allows for efficient heat dissipation and provides a solid mechanical interface for connections.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in thermal environments, making it suitable for demanding applications.

Organization: 8KX8

This memory organization provides a good balance between capacity and access speed, enhancing performance in data-intensive tasks.

Minimum Operating Temperature: -55 °C

The wide operating temperature range ensures functionality in extreme environments, especially useful in military and aerospace applications.

Terminal Finish: TIN LEAD

The tin-lead finish provides excellent solderability, ensuring reliable and durable connections in various applications.

Terminal Position: QUAD

Quad terminal positioning allows for flexible layout options on PCBs, facilitating easier routing and design.

Minimum Supply Voltage (Vsup): 4.5V

A low minimum supply voltage ensures compatibility with low-power applications, increasing its range of use.

Temperature Grade: MILITARY

The military temperature grade guarantees higher durability and performance in challenging conditions, making this part ideal for defense applications.

Technology: CMOS

CMOS technology allows for lower power consumption and faster switching speeds, enhancing overall efficiency and performance.

Parallel or Serial: PARALLEL

Parallel reading enables faster data access speeds, making it ideal for applications requiring quick data retrieval.

Terminal Form: NO LEAD

No lead design helps reduce the footprint and allows for higher density board layouts.

No. of Words: 8192 words

Offering 8192 words, this memory provides significant capacity for storing large amounts of data in compact form.

Memory Width: 8

An 8-bit memory width is ideal for many applications, balancing efficiency and storage capabilities.

No. of Words Code: 8K

With 8K words, this memory provides sufficient storage for many applications, making it versatile for various use cases.

Maximum Supply Voltage (Vsup): 5.5V

The maximum supply voltage offers flexibility in system design, allowing users to operate safely within a defined voltage range.

Memory Density: 65536 bit

The density of 65536 bits enables efficient data storage, suitable for applications requiring significant data handling.

Memory IC Type: UVPROM

As a UVPROM type memory, it allows for data erasure and reprogramming, offering flexibility for applications that need periodic updates.

Maximum Access Time: 55 ns

A maximum access time of 55 ns provides fast data retrieval, making it suitable for time-sensitive applications.

Technical Specifications

EPROM 5962-87515023A attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

JESD-30 Code:

R-CQCC-N28

JESD-609 Code:

e0

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Trade Compliance

5962-87515023A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20