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NVTFWS007N08HLTAG

Onsemi

NVTFWS007N08HLTAG by Onsemi

NVTFWS007N08HLTAG by Onsemi is a Power FET with 80V DS Breakdown Voltage, 347A IDM, and 1433mJ EAS. Ideal for applications requiring high power dissipation in a small outline package, such as automotive systems or industrial equipment.

Median Price

$1.050

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,037 parts In-Stock

1+ parts

$1.050

100+ parts

$0.604

1k+ parts

$0.542

10k+ parts

$0.485

1,037

$1.050

$0.604

$0.542

$0.485

Distributors (In-Stock)

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Vyrian

USA . 6,621 parts In-Stock

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Flip Electronics

USA . 4,500 parts In-Stock

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4,500

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Digiode

USA . 1,248 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 5,206 parts In-Stock

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$3.679

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$3.679

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AZTECH Wire

Italy . 914 parts In-Stock

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$11.990

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914

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Kulean Microsystems

USA . 6,290 parts In-Stock

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SupplyDigital Components

Austria . 4,940 parts In-Stock

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Problanco Electronics

Mexico . 3,121 parts In-Stock

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TANS Electronics

Latvia . 2,167 parts In-Stock

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UHIMA Technologies

Türkiye . 803 parts In-Stock

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Corphita

USA . 597 parts In-Stock

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Corohmni

South Africa . 443 parts In-Stock

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Overview

Unleash the power of innovation with the NVTFWS007N08HLTAG by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor is designed to exceed expectations in performance and reliability. Ideal for a wide range of applications, this N-CHANNEL FET with a built-in diode offers unparalleled value with its high-quality construction and cutting-edge technology. Say goodbye to compromises and hello to seamless functionality with the NVTFWS007N08HLTAG. Elevate your projects with the best in class from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the FET, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and increases efficiency in power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for high switching speeds and improved performance in power management.

Maximum Pulsed Drain Current (IDM): 347 A

High pulsed drain current capability ensures the FET can handle sudden power surges or spikes without damage.

Avalanche Energy Rating (EAS): 1433 mJ

High avalanche energy rating indicates the FET can withstand high-energy discharges, ensuring reliability in harsh conditions.

Maximum Power Dissipation (Abs): 79 W

High power dissipation rating allows the FET to handle large amounts of power without overheating.

Maximum Drain Current (ID): 71 A

High drain current rating enables the FET to carry large amounts of current without saturation, ensuring efficient power management.

Maximum Drain-Source On Resistance: 0.007 ohm

Low on-resistance reduces power losses and improves efficiency in power applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTFWS007N08HLTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1433 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

71 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

14.1 pF

JESD-30 Code:

S-PDSO-F8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

347 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVTFWS007N08HLTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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