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NVTFS5811NLTWG

Onsemi

NVTFS5811NLTWG by Onsemi

NVTFS5811NLTWG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 354A IDM, and 0.01 ohm RDS(on). Ideal for applications requiring high power dissipation in a small outline package. Enhances performance in electronic devices operating at up to 175 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,965 parts In-Stock

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Digiode

USA . 1,018 parts In-Stock

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AZTECH Wire

Italy . 106 parts In-Stock

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$18.220

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QUARKTWIN TECHNOLOGY LTD

USA . 24,194 parts In-Stock

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TANS Electronics

Latvia . 7,370 parts In-Stock

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Problanco Electronics

Mexico . 6,697 parts In-Stock

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SupplyDigital Components

Austria . 3,822 parts In-Stock

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Kulean Microsystems

USA . 2,890 parts In-Stock

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Corphita

USA . 1,118 parts In-Stock

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UHIMA Technologies

Türkiye . 841 parts In-Stock

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Corohmni

South Africa . 482 parts In-Stock

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Overview

Unleash the power of innovation with the NVTFS5811NLTWG by Onsemi. This high-quality Power Field Effect Transistor (FET) offers unparalleled performance and reliability, making it a must-have for a wide range of applications. From enhancing efficiency in power supplies to optimizing motor control systems, this N-CHANNEL transistor with a built-in diode delivers exceptional value and benefits to customers. Trust Onsemi's expertise and experience in semiconductor technology to take your projects to the next level. Elevate your designs with the NVTFS5811NLTWG and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components, making the product long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics such as lower on-state resistance and higher current carrying capability compared to P-channel FETs, making this product a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, making the product more efficient and versatile.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 40 V

The high minimum breakdown voltage ensures robustness and reliability in power applications, making the product suitable for a wide range of voltage requirements.

Package Shape: SQUARE

The square package shape offers a compact design, allowing for efficient use of board space and easy integration into various electronic systems.

Maximum Pulsed Drain Current (IDM): 354 A

The high maximum pulsed drain current capability enables the product to handle sudden surges of power without failure, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 65 mJ

The high avalanche energy rating indicates the product's ability to withstand transient voltage spikes, ensuring reliable operation in rugged environments.

Maximum Drain Current (Abs) (ID): 40 A

The high maximum drain current rating allows the product to handle high power loads efficiently, making it ideal for power management applications.

No. of Terminals: 5

The five terminals provide flexibility in circuit connections and options for different configurations, enhancing the product's versatility.

Maximum Power Dissipation (Abs): 21 W

The high maximum power dissipation rating indicates the product's ability to dissipate heat effectively, ensuring reliable operation under high power conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-saving benefits and ease of handling during assembly, making the product suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR technology offers high performance and efficiency, making the product a reliable choice for power management applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating allows the product to operate in harsh environments without performance degradation, ensuring reliability in challenging conditions.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, providing high performance and durability for the product in various applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish offers good solderability and corrosion resistance, ensuring secure connections and long-term reliability in use.

Maximum Drain Current (ID): 16 A

The high maximum drain current rating allows the product to handle high power loads efficiently, making it ideal for power management applications.

Maximum Drain-Source On Resistance: 0.01 ohm

The low maximum drain-source on resistance minimizes power loss and improves efficiency in power conversion applications, making the product a suitable choice for demanding tasks.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and layout, allowing for easy integration into various electronic systems and configurations.

Case Connection: DRAIN

The drain case connection simplifies circuit design and provides efficient heat dissipation, ensuring the product's reliability and performance in power applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS5811NLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

65 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

354 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVTFS5811NLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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