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NVMTS0D4N04CTXG

Onsemi

NVMTS0D4N04CTXG by Onsemi

NVMTS0D4N04CTXG by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage and 900A Pulsed Drain Current. Ideal for power applications, it features a built-in diode, 0.00045 ohm Drain-Source Resistance, and operates in Enhancement Mode. Suitable for automotive use with AEC-Q101 standard compliance.

Median Price

$10.276

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,762 parts In-Stock

1+ parts

$6.310

100+ parts

$5.930

1k+ parts

$5.360

10k+ parts

$5.360

5,762

$6.310

$5.930

$5.360

$5.360

DigiKey

USA . 2,588 parts In-Stock

1+ parts

$11.310

100+ parts

$6.617

1k+ parts

-

10k+ parts

$5.406

2,588

$11.310

$6.617

-

$5.406

Arrow

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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$10.795

33,000

-

-

-

$10.795

Verical

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$9.758

33,000

-

-

-

$9.758

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 257 parts In-Stock

1+ parts

$5.994

100+ parts

-

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-

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257

$5.994

-

-

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Nova Conductors

Japan . 79 parts In-Stock

1+ parts

$6.335

100+ parts

-

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79

$6.335

-

-

-

Flip Electronics

USA . 200,000 parts In-Stock

1+ parts

-

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200,000

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Vyrian

USA . 5,662 parts In-Stock

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5,662

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,660 parts In-Stock

1+ parts

$5.360

100+ parts

-

1k+ parts

-

10k+ parts

-

5,660

$5.360

-

-

-

Semicontronic

India . 5,492 parts In-Stock

1+ parts

$5.360

100+ parts

$5.226

1k+ parts

$5.199

10k+ parts

-

5,492

$5.360

$5.226

$5.199

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Corphita

USA . 782 parts In-Stock

1+ parts

$5.679

100+ parts

-

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782

$5.679

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-

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Corohmni

South Africa . 262 parts In-Stock

1+ parts

$6.084

100+ parts

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262

$6.084

-

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Microchip USA

USA . 6,828 parts In-Stock

1+ parts

$16.686

100+ parts

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6,828

$16.686

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

1+ parts

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200,000

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Kulean Microsystems

USA . 7,675 parts In-Stock

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7,675

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Lixinc

USA . 6,837 parts In-Stock

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6,837

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Problanco Electronics

Mexico . 4,427 parts In-Stock

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4,427

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Argo Parts USA

USA . 4,025 parts In-Stock

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4,025

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SupplyDigital Components

Austria . 3,708 parts In-Stock

1+ parts

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3,708

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TANS Electronics

Latvia . 3,542 parts In-Stock

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3,542

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Perfect Parts

USA . 3,248 parts In-Stock

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3,248

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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3,000

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$6.208

1k+ parts

$6.018

10k+ parts

$5.892

2,000

-

$6.208

$6.018

$5.892

UHIMA Technologies

Türkiye . 481 parts In-Stock

1+ parts

-

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481

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Overview

Unleash the power of innovation with the NVMTS0D4N04CTXG by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors (FET), Onsemi delivers unparalleled quality and reliability. This N-CHANNEL transistor boasts a range of applications, from automotive to industrial electronics. With its optimal performance and efficiency, customers can expect superior results in their projects. Experience the value and benefits of this product, offering enhanced power management and durability for all your electronic needs. Elevate your designs with the NVMTS0D4N04CTXG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for a variety of environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher switching speeds compared to P-channel FETs, making them efficient for use in power applications.

Surface Mount: YES

The surface-mount capability simplifies the assembly process and allows for more compact designs in electronic circuits.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle higher voltages without any damage, providing a reliable performance in demanding applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be easily turned on and off, offering precise control over the power flow in the circuit.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating allows the FET to handle sudden spikes in current without failure, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 244 W

With a high power dissipation rating, this FET can handle significant power loads without overheating, ensuring reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making this FET ideal for power electronics applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to operate in harsh environments without performance degradation.

Maximum Drain-Source On Resistance: 0.00045 ohm

With low on-resistance, this FET minimizes power loss and heat generation, improving overall efficiency in power applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMTS0D4N04CTXG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

4454 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

558 A

Maximum Drain Current (ID):

558 A

Maximum Drain-Source On Resistance:

.00045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMTS0D4N04CTXG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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