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NVMTS0D7N06CTXG

Onsemi

NVMTS0D7N06CTXG by Onsemi

NVMTS0D7N06CTXG by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 900A IDM. Ideal for applications requiring high power dissipation, such as automotive systems due to AEC-Q101 standard compliance.

Median Price

$11.230

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,237 parts In-Stock

1+ parts

$11.230

100+ parts

$6.560

1k+ parts

$6.320

10k+ parts

$6.130

2,237

$11.230

$6.560

$6.320

$6.130

DigiKey

USA . 1,019 parts In-Stock

1+ parts

$11.230

100+ parts

$6.556

1k+ parts

-

10k+ parts

$5.356

1,019

$11.230

$6.556

-

$5.356

Newark

USA . 1,732 parts In-Stock

1+ parts

$13.470

100+ parts

$8.800

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-

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1,732

$13.470

$8.800

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Farnell

UK . 1,732 parts In-Stock

1+ parts

-

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$4.710

1k+ parts

$4.620

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-

1,732

-

$4.710

$4.620

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Element14

Singapore . 1,732 parts In-Stock

1+ parts

-

100+ parts

$9.490

1k+ parts

$9.310

10k+ parts

-

1,732

-

$9.490

$9.310

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,990 parts In-Stock

1+ parts

$9.348

100+ parts

-

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1,990

$9.348

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Vyrian

USA . 733 parts In-Stock

1+ parts

$9.840

100+ parts

-

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733

$9.840

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,557 parts In-Stock

1+ parts

$8.856

100+ parts

-

1k+ parts

-

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1,557

$8.856

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-

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Corohmni

South Africa . 130 parts In-Stock

1+ parts

$9.840

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130

$9.840

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Microchip USA

USA . 5,890 parts In-Stock

1+ parts

$16.532

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5,890

$16.532

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Component Stockers USA

USA . 1,463 parts In-Stock

1+ parts

$86.570

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1,463

$86.570

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iodParts Technologies Inc.

India . 8,016 parts In-Stock

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8,016

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TANS Electronics

Latvia . 7,942 parts In-Stock

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7,942

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Problanco Electronics

Mexico . 4,857 parts In-Stock

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4,857

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SupplyDigital Components

Austria . 2,659 parts In-Stock

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2,659

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Kulean Microsystems

USA . 1,124 parts In-Stock

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1,124

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UHIMA Technologies

Türkiye . 884 parts In-Stock

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884

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Overview

Discover the NVMTS0D7N06CTXG by Onsemi, a top-quality Power Field Effect Transistor with unmatched performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL FET offers a range of applications for power management systems. With a maximum DS Breakdown Voltage of 60V and an impressive Maximum Pulsed Drain Current of 900A, this transistor is designed to deliver exceptional power efficiency. Say goodbye to overheating issues with its Maximum Power Dissipation of 294.6W and enjoy seamless operation in temperatures ranging from -55 °C to 175°C. Upgrade your power systems today with the NVMTS0D7N06CTXG for enhanced performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and reliability of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them a good choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps with protection against reverse polarity and voltage spikes, enhancing the reliability of the FET.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and improving overall design flexibility.

Maximum Drain-Source On Resistance: 0.00072 ohm

The low on-resistance of the FET results in minimal power losses and high efficiency in power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature tolerance allows the FET to perform reliably in harsh environments with elevated temperatures.

Technical Specifications

Power Field Effect Transistors (FET) NVMTS0D7N06CTXG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1754 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

464 A

Maximum Drain Current (ID):

464 A

Maximum Drain-Source On Resistance:

.00072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

174 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMTS0D7N06CTXG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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