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NVMTS0D5N04M8TXG

Onsemi

NVMTS0D5N04M8TXG by Onsemi

NVMTS0D5N04M8TXG by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 522A ID, and 300W Power Dissipation. Ideal for power applications in automotive systems due to AEC-Q101 compliance and -55 to 175 °C operating range.

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TANS Electronics

Latvia . 7,114 parts In-Stock

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Kulean Microsystems

USA . 3,921 parts In-Stock

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Problanco Electronics

Mexico . 3,601 parts In-Stock

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Corphita

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Corohmni

South Africa . 185 parts In-Stock

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SupplyDigital Components

Austria . 93 parts In-Stock

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UHIMA Technologies

Türkiye . 32 parts In-Stock

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Overview

Experience superior performance and reliability with the NVMTS0D5N04M8TXG by Onsemi. As a leading manufacturer in the industry, Onsemi's Power Field Effect Transistors (FET) are designed to exceed expectations. This N-CHANNEL transistor offers enhanced functionality with a single configuration and built-in diode, making it ideal for a wide range of applications. With a maximum drain current of 522 A and a maximum power dissipation of 300 W, this transistor delivers unparalleled efficiency and power management. Trust Onsemi to provide top-quality products that offer exceptional value and benefits to our customers.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and have better performance compared to P-channel FETs, making this product a good choice for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current flow protection, increasing the reliability and safety of the circuit.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage provides protection against voltage spikes and ensures the durability of the FET in harsh operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and are commonly used in power switching applications, making this product versatile and easy to integrate into various circuits.

Maximum Drain Current (Abs) (ID): 522 A

The high maximum drain current capability allows for efficient power handling, making this FET suitable for high-current applications.

Maximum Power Dissipation (Abs): 300 W

The high power dissipation capability ensures the FET can withstand high power levels without overheating, making it reliable for heavy-duty applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high switching speeds and low switching losses, making this product ideal for high-frequency and high-power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature range allows for reliable operation in extreme temperature conditions, expanding the range of applications this FET can be used in.

Transistor Element Material: SILICON

Silicon-based FETs offer high reliability and consistent performance, making this product a durable and long-lasting choice for power switching applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the FET can operate in cold environments, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.00058 ohm

The low on-resistance reduces power losses and improves efficiency, making this FET a good choice for high-performance power applications.

Maximum Feedback Capacitance (Crss): 260 pF

The low feedback capacitance helps in reducing signal distortion and improving high-frequency performance, making this FET suitable for high-speed switching applications.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures the FET meets automotive quality and reliability standards, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMTS0D5N04M8TXG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

522 A

Maximum Drain Current (ID):

522 A

Maximum Drain-Source On Resistance:

.00058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

260 pF

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVMTS0D5N04M8TXG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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