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NVMFS5844NLWFT3G

Onsemi

NVMFS5844NLWFT3G by Onsemi

NVMFS5844NLWFT3G by Onsemi is a single N-channel power FET with 61A max drain current and 107W max power dissipation. Utilizes metal-oxide semiconductor technology, operates up to 175°C, ideal for high-power applications in surface-mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,578 parts In-Stock

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Digiode

USA . 1,913 parts In-Stock

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Nova Conductors

Japan . 72 parts In-Stock

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Ampacity Inc.

Singapore . 1,260 parts In-Stock

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$11.050

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AZTECH Wire

Italy . 762 parts In-Stock

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Problanco Electronics

Mexico . 7,761 parts In-Stock

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TANS Electronics

Latvia . 4,131 parts In-Stock

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Kulean Microsystems

USA . 3,910 parts In-Stock

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Argo Parts USA

USA . 2,622 parts In-Stock

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Continental Prestige Electronics

USA . 1,235 parts In-Stock

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Corphita

USA . 942 parts In-Stock

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SupplyDigital Components

Austria . 917 parts In-Stock

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Corohmni

South Africa . 465 parts In-Stock

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UHIMA Technologies

Türkiye . 304 parts In-Stock

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Aranea Global

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Overview

Power up your projects with the NVMFS5844NLWFT3G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their N-CHANNEL Power Field Effect Transistors. Ideal for a range of applications, this FET offers a maximum drain current of 61A and a maximum power dissipation of 107W, making it perfect for high-performance devices. Trust Onsemi to deliver the power you need for your next project.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL FETs are preferred for high power applications due to their lower ON resistance and higher current carrying capacity.

Configuration

Single configuration FETs are easier to use and typically have lower capacitance, making them suitable for high-frequency applications.

Surface Mount

Surface mount FETs are easier to mount onto circuit boards, saving space and allowing for automated assembly.

Maximum Drain Current (Abs) (ID)

With a high maximum drain current, this FET can handle heavy loads and provide efficient power delivery.

Maximum Power Dissipation (Abs)

The high power dissipation capability ensures that the FET can operate at high power levels without overheating.

Field Effect Transistor Technology

MOSFET technology offers low on-resistance and fast switching speeds, making it ideal for power electronics applications.

Maximum Operating Temperature

With a high maximum operating temperature, this FET can withstand demanding environmental conditions without performance degradation.

Terminal Finish

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections.

Maximum Time At Peak Reflow Temperature (s)

The FET can be exposed to peak reflow temperatures for a sufficient duration during assembly without causing damage.

Peak Reflow Temperature °C

With a high peak reflow temperature, the FET can withstand the soldering process without compromising its electrical characteristics.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5844NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

61 A

Maximum Drain Current (ID):

61 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5844NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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