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NVMFS5834NLWFT1G

Onsemi

NVMFS5834NLWFT1G by Onsemi

NVMFS5834NLWFT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 276A IDM, and 0.0136 ohm RDS(on). It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package ideal for automotive applications due to AEC-Q101 compliance.

Median Price

$0.484

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,085 parts In-Stock

1+ parts

-

100+ parts

$0.475

1k+ parts

$0.395

10k+ parts

$0.352

1,085

-

$0.475

$0.395

$0.352

Verical

USA . 1,085 parts In-Stock

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$0.493

10k+ parts

$0.440

1,085

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$0.493

$0.440

Distributors (In-Stock)

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Vyrian

USA . 8,589 parts In-Stock

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Digiode

USA . 2,270 parts In-Stock

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2,270

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Distributors (Availability)

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AZTECH Wire

Italy . 760 parts In-Stock

1+ parts

$15.020

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760

$15.020

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TANS Electronics

Latvia . 8,226 parts In-Stock

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SupplyDigital Components

Austria . 4,615 parts In-Stock

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Kulean Microsystems

USA . 4,023 parts In-Stock

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4,023

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,332 parts In-Stock

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Corphita

USA . 1,871 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 356 parts In-Stock

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356

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Problanco Electronics

Mexico . 352 parts In-Stock

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Metaverse IC Inc.

Canada . 350 parts In-Stock

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Corohmni

South Africa . 183 parts In-Stock

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Overview

Unleash the power of the NVMFS5834NLWFT1G by Onsemi! As a leading manufacturer in the field, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for a wide range of applications. With a single configuration and built-in diode, this N-channel transistor offers unmatched reliability and efficiency. Experience the benefits of enhanced performance and durability with a maximum drain current of 14A and a low on-resistance of 0.0136 ohm. Trust Onsemi to provide exceptional products that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in one direction, ideal for many circuit applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with built-in diode for reverse current protection.

Surface Mount: YES

Easy to mount on PCBs, saving space and enhancing circuit board layout.

Minimum DS Breakdown Voltage: 40 V

Provides a high level of voltage protection for the device.

Maximum Pulsed Drain Current (IDM): 276 A

Can handle high current loads during peak operations.

Avalanche Energy Rating (EAS): 48 mJ

Ability to withstand energy spikes and protect the device from damage.

Maximum Power Dissipation (Abs): 107 W

Efficiently dissipates heat to maintain optimal performance under high power conditions.

Maximum Operating Temperature: 175 °C

Can operate reliably in high-temperature environments.

Maximum Drain-Source On Resistance: 0.0136 ohm

Minimizes power loss and heat generation in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5834NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

48 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.0136 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

276 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5834NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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