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NVMFS4C05NT3G

Onsemi

NVMFS4C05NT3G by Onsemi

NVMFS4C05NT3G by Onsemi is a N-CHANNEL FET with 116A ID and 79W power dissipation. Ideal for high-power applications, it operates at up to 175 °C, making it suitable for industrial use in demanding environments. With surface mount configuration and matte tin finish, it offers reliable performance in various power systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Flip Electronics

USA . 200,000 parts In-Stock

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Vyrian

USA . 11,220 parts In-Stock

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Digiode

USA . 1,042 parts In-Stock

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Microchip USA

USA . 4,482 parts In-Stock

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$4.905

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AZTECH Wire

Italy . 142 parts In-Stock

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$21.650

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Perfect Parts

USA . 114,856 parts In-Stock

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Problanco Electronics

Mexico . 6,434 parts In-Stock

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SupplyDigital Components

Austria . 4,370 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 2,473 parts In-Stock

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TANS Electronics

Latvia . 2,155 parts In-Stock

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Corphita

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Corohmni

South Africa . 213 parts In-Stock

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UHIMA Technologies

Türkiye . 154 parts In-Stock

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Overview

Enhance your power management systems with the NVMFS4C05NT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that provide exceptional performance and reliability. This N-CHANNEL FET offers a maximum drain current of 116A and a maximum power dissipation of 79W, making it ideal for a wide range of applications. Upgrade your projects with this single configuration, surface mount transistor that operates at a maximum temperature of 175 °C. Trust Onsemi to deliver innovative technology and superior products that exceed your expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high electron mobility and low ON-state resistance, making them efficient for power applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and control compared to multi-channel configurations, making them more reliable for power applications.

Surface Mount: YES

Surface mount technology allows for compact and lightweight designs, ideal for portable or space-constrained applications.

Maximum Drain Current (Abs) (ID): 116 A

High maximum drain current rating allows for handling of large power loads without the risk of damage or overheating.

Maximum Power Dissipation (Abs): 79 W

High power dissipation rating ensures the FET can handle high-power applications without overheating or failure.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high switching speeds and low input capacitance, making it suitable for high-frequency applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows for reliable performance in harsh environments or under heavy loads.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish provides good solderability and resistance to corrosion, ensuring durable connections.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature reduces thermal stress on the component during soldering, extending its lifespan.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints and prevents solder defects, leading to better performance and longevity.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS4C05NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

116 A

Maximum Drain Current (ID):

116 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS4C05NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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