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NVMFD5489NLWFT3G

Onsemi

NVMFD5489NLWFT3G by Onsemi

NVMFD5489NLWFT3G by Onsemi is an N-CHANNEL Power FET with 12A max drain current and 23.4W max power dissipation. Utilizes metal-oxide semiconductor technology, operates up to 175 °C, suitable for surface mount applications in various electronic devices.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 2,145 parts In-Stock

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Digiode

USA . 1,828 parts In-Stock

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AZTECH Wire

Italy . 473 parts In-Stock

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Perfect Parts

USA . 17,360 parts In-Stock

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Problanco Electronics

Mexico . 6,238 parts In-Stock

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TANS Electronics

Latvia . 5,253 parts In-Stock

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Kulean Microsystems

USA . 1,219 parts In-Stock

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SupplyDigital Components

Austria . 1,156 parts In-Stock

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Corphita

USA . 517 parts In-Stock

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UHIMA Technologies

Türkiye . 441 parts In-Stock

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Corohmni

South Africa . 439 parts In-Stock

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Overview

Power up your applications with the NVMFD5489NLWFT3G by Onsemi! This N-CHANNEL Power Field Effect Transistor boasts high-quality materials and advanced METAL-OXIDE SEMICONDUCTOR technology, ensuring reliable performance and durability. Ideal for a wide range of power management applications, this FET offers a maximum drain current of 12 A and a maximum power dissipation of 23.4 W, making it a versatile choice for your projects. Trust in Onsemi's expertise and elevate your designs with the NVMFD5489NLWFT3G today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer better efficiency and lower conduction losses compared to P-CHANNEL FETs, making them ideal for various applications.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB design, saving space and enabling high-density applications.

Maximum Drain Current (Abs) (ID): 12 A

With a high maximum drain current, this FET can handle higher power applications without risking damage or overheating.

Maximum Power Dissipation (Abs): 23.4 W

The high maximum power dissipation capability ensures that the FET can efficiently manage heat dissipation, contributing to overall system reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low gate capacitance and high switching speed, making it suitable for high-frequency applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance, ensuring reliability in harsh environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, enhancing the FET's reliability and longevity in various operating conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature prevents thermal damage to the FET during soldering, ensuring proper assembly and functionality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for lead-free soldering processes that comply with environmental regulations, making the FET more environmentally friendly.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5489NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFD5489NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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